JPH0228035Y2 - - Google Patents

Description

[Detailed Description of the Invention] (a) Industrial Application Field The present invention relates to a mold for molding electronic parts with resin, and particularly to the structure of a mold used for manufacturing hybrid integrated circuits.

Hybrid integrated circuits are widely used because they enable high-density mounting of various electronic devices and miniaturization of devices, but each type is specialized depending on the application, and although there are a large number of models, each A characteristic of this model is that its usage is small.
Furthermore, hybrid integrated circuits generally have electronic components mounted on a ceramic substrate with a conductor pattern formed thereon, and after connecting lead terminals, the outer periphery is covered with resin, but the height and length of the components vary depending on the model. Due to the difference, it is difficult to perform continuous molding using a mold, which results in lower product yields and higher manufacturing costs, and is a factor that impedes automatic mounting of parts.

(b) Prior art Fig. 2 is a perspective view showing a conventional manufacturing method, in which Fig. 2a shows the state before coating with resin, Fig. 2b shows the state immersed in resin, and Fig. 2c shows the state before coating with resin. This shows the state after the resin has been cured.

In FIG. 2a, a lead terminal 2 is bonded to a hybrid integrated circuit body 1 formed by forming a conductor pattern on a ceramic substrate and mounting electronic components, and the other end of the lead terminal 2 has a guide hole 3. They are connected by a metal band 4. Conventionally, in order to cover the outer periphery of the hybrid integrated circuit body 1 with resin, a second
As shown in FIG. b, a liquefied resin 6 such as an epoxy resin is placed in a container 5, and the hybrid integrated circuit body 1 with the metal strip 4 cut to fit the container 5 is immersed in the resin 6. After that, the hybrid integrated circuit body 1
is lifted from the resin 6 and left in a high-temperature oven for 1 to 2 hours to harden the resin.

(c) Problems to be solved by the invention As a condition for coating the outer periphery with resin, the joint part of the lead terminal 2 must be completely covered, but the width formed at the base of the lead terminal 2 must be completely covered. A part of the wide portion 2a must be exposed from the resin. Therefore, in the conventional method, the height of the liquid level of the liquefied resin 6 placed in the container 5 must be constantly monitored. Further, since the metal band portion 4 is cut into pieces, it is difficult to automate the process of coating the outer periphery with resin, as well as automatic mounting on a printed circuit board, which requires human labor.

(d) Means for solving the problem The present invention includes a mold body, a slidable movable side wall member built into the mold body, and a fixed position of the movable side wall member with respect to the mold body. The above-mentioned problem is solved by a molding die characterized by being equipped with a locking mechanism.

(e) Effect By sliding the movable side wall member built into the mold body, it is possible to construct a mold that matches the height and length of the parts, and the outer periphery of the resin It is now possible to replace the conventional dipping method with continuous molding for coating, which stabilizes the product shape and improves yield, eliminates the need to monitor the liquid level of liquefied resin, and coats the outer periphery with resin. It is possible to automate not only the mounting work on printed circuit boards, but also the mounting work on printed circuit boards.

(f) Examples Examples of the present invention will be explained below with reference to the attached drawings.
FIG. 1 is a perspective view showing an embodiment of the present invention, and the same objects as in FIG. 2 are denoted by the same symbols.

In the figure, the mold body is divided into an upper mold 8 and a lower mold 9. The surface of the upper mold 8 in contact with the lower mold 9 is flat and has a plurality of protrusions 10 that fit into the grooves in which the lead terminals 2 of the lower mold 9 are accommodated. It is equipped with Further, the lower mold 9 consists of a lower mold main body 11 and movable side wall members 12a and 12b, and the lower mold main body 11 includes a bottom plate 13 and a movable side wall member 12.
fixed side walls 14a and 14b that guide the terminals a and 12b, and a groove 1 that accommodates the plurality of lead terminals 2.
The front side wall 16 has a diameter of 5.

Furthermore, the movable side wall members 12a and 12b are configured to be able to slide back and forth while being guided by the fixed side walls 14a and 14b.
has a width suitable for molding a two-terminal type component, and the plurality of movable side wall members 12b have a width suitable for molding a two-terminal type component.
It has a width equivalent to one pitch.

Further, a locking mechanism 18 having a screw 17 at a position corresponding to the movable side wall members 12a and 12b is fixed to a portion of the lower mold body 11 that does not contact the upper mold 8.

Therefore, the front side wall 16 and the movable side wall member 12a
The movable side wall member 12a is positioned so that the movable side wall members 12a face each other with an interval corresponding to the height of the part, and then the movable side wall member 12b and the movable side wall member 12a are arranged to form a mold that can accommodate an arbitrary product length. By arranging them on the same line and further arranging the next movable side wall member 12b at a position in contact with the front side wall 16, a mold that can accommodate a hybrid integrated circuit having arbitrary component height and component length can be constructed. Can be done.

Note that the movable side wall member 12 located outside the movable side wall member 12b disposed at a position in contact with the front side wall 16
b and the front side wall 16 are opposed to each other with a gap larger than the gap corresponding to the height of the component to prevent the previously molded resin part from being damaged.

By using such a mold, it is possible to construct a mold that matches the height and length of the part, and the conventional dipping method for covering the outer periphery with resin can be replaced with continuous molding. This makes it possible to stabilize the shape of the product and improve yields. It also eliminates the work of monitoring the liquid level of liquefied resin, and automates not only the work of coating the outer periphery with resin but also the work of mounting it on printed circuit boards. It can be realized.

(g) Effects of the invention As mentioned above, according to the invention, continuous molding using a mold can be easily realized, improving product yield and reducing manufacturing costs, and also making it possible to automatically mount components onto printed circuit boards. become.

[Brief explanation of drawings]

Fig. 1 is a perspective view showing one embodiment of the present invention;
The figure is a perspective view showing a conventional manufacturing method. In the figure, 2 is a lead terminal, 8 is an upper mold, 9 is a lower mold, 10 is a protrusion, 11 is a lower mold main body, 12a, 1
2b is a movable side wall member, 13 is a bottom plate, 14a, 14
b indicates a fixed side wall, 15 a lead terminal groove, 16 a front side wall, 17 a screw, and 18 a lock mechanism, respectively.

Claims (1)

[Scope of utility model registration request] A mold for resin molding of electronic components includes a mold body, a slidable movable side wall member built into the mold body, and a lock mechanism for fixing the position of the movable side wall member with respect to the mold body. A mold that is characterized by: