JPH0227818B2 - - Google Patents

Info

Publication number
JPH0227818B2
JPH0227818B2 JP59054912A JP5491284A JPH0227818B2 JP H0227818 B2 JPH0227818 B2 JP H0227818B2 JP 59054912 A JP59054912 A JP 59054912A JP 5491284 A JP5491284 A JP 5491284A JP H0227818 B2 JPH0227818 B2 JP H0227818B2
Authority
JP
Japan
Prior art keywords
layer
substrate
pin
film
titanium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59054912A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60198763A (ja
Inventor
Juzo Shimada
Kazuaki Uchiumi
Hideo Takamizawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP5491284A priority Critical patent/JPS60198763A/ja
Publication of JPS60198763A publication Critical patent/JPS60198763A/ja
Publication of JPH0227818B2 publication Critical patent/JPH0227818B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists

Landscapes

  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP5491284A 1984-03-22 1984-03-22 ピン付基板およびその製造方法 Granted JPS60198763A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5491284A JPS60198763A (ja) 1984-03-22 1984-03-22 ピン付基板およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5491284A JPS60198763A (ja) 1984-03-22 1984-03-22 ピン付基板およびその製造方法

Publications (2)

Publication Number Publication Date
JPS60198763A JPS60198763A (ja) 1985-10-08
JPH0227818B2 true JPH0227818B2 (enrdf_load_stackoverflow) 1990-06-20

Family

ID=12983809

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5491284A Granted JPS60198763A (ja) 1984-03-22 1984-03-22 ピン付基板およびその製造方法

Country Status (1)

Country Link
JP (1) JPS60198763A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0132364Y2 (enrdf_load_stackoverflow) * 1985-03-04 1989-10-03

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4824009A (en) * 1981-12-31 1989-04-25 International Business Machines Corporation Process for braze attachment of electronic package members

Also Published As

Publication number Publication date
JPS60198763A (ja) 1985-10-08

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term