JPH0227768U - - Google Patents

Info

Publication number
JPH0227768U
JPH0227768U JP10557788U JP10557788U JPH0227768U JP H0227768 U JPH0227768 U JP H0227768U JP 10557788 U JP10557788 U JP 10557788U JP 10557788 U JP10557788 U JP 10557788U JP H0227768 U JPH0227768 U JP H0227768U
Authority
JP
Japan
Prior art keywords
holes
filled
conductive
hole conductors
conductive resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10557788U
Other languages
English (en)
Other versions
JPH0547485Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988105577U priority Critical patent/JPH0547485Y2/ja
Publication of JPH0227768U publication Critical patent/JPH0227768U/ja
Application granted granted Critical
Publication of JPH0547485Y2 publication Critical patent/JPH0547485Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Description

【図面の簡単な説明】
第１図は、本考案の実施例を示す厚膜回路基板
の要部縦断面図、第２図は、厚膜回路基板の従来
例を示す要部縦断面図、第３図は、同回路基板の
いわゆるスルーホールオープンの状態を示す用図
縦断側面図である。 １…絶縁基板、２…スルーホール導体、５…導
電性樹脂、９…スルーホール、１０…導電パター
ン。

Claims (1)

    【実用新案登録請求の範囲】
  1. 絶縁基板１の両主面に導体パターン１０を印刷
    し、同基板１に形成したスルーホール９の周面に
    被着・形成したスルーホール導体２で上記絶縁基
    板１の各々両主面に形成した導体パターン１０を
    接続した厚膜回路基板において、周面に上記スル
    ーホール導体２が形成されたスルーホール９に導
    電性樹脂５を充填し、さらに前記導電性樹脂５が
    充填されたスルーホール９の開口部を絶縁性の保
    護樹脂で被覆してなることを特徴とする厚膜回路
    基板のスルーホール接続部。
JP1988105577U 1988-08-10 1988-08-10 Expired - Lifetime JPH0547485Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988105577U JPH0547485Y2 (ja) 1988-08-10 1988-08-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988105577U JPH0547485Y2 (ja) 1988-08-10 1988-08-10

Publications (2)

Publication Number Publication Date
JPH0227768U true JPH0227768U (ja) 1990-02-22
JPH0547485Y2 JPH0547485Y2 (ja) 1993-12-14

Family

ID=31338318

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988105577U Expired - Lifetime JPH0547485Y2 (ja) 1988-08-10 1988-08-10

Country Status (1)

Country Link
JP (1) JPH0547485Y2 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101055516B1 (ko) * 2003-04-02 2011-08-08 가부시기가이샤 후지고오키 전동 밸브
JP2018170506A (ja) * 2017-03-29 2018-11-01 京セラ株式会社 回路基板およびこれを備える電子装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58219796A (ja) * 1982-06-15 1983-12-21 松下電器産業株式会社 導体層接続装置
JPS60167489A (ja) * 1984-02-10 1985-08-30 富士通株式会社 セラミツク回路基板の製造方法
JPS627194A (ja) * 1985-07-04 1987-01-14 旭化成株式会社 スル−ホ−ル回路
JPS6265496A (ja) * 1985-09-18 1987-03-24 日本シイエムケイ株式会社 プリント配線板の製造法
JPS6411397A (en) * 1987-07-03 1989-01-13 Hokuriku Elect Ind Manufacture of circuit board
JPH0171465U (ja) * 1987-10-30 1989-05-12

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58219796A (ja) * 1982-06-15 1983-12-21 松下電器産業株式会社 導体層接続装置
JPS60167489A (ja) * 1984-02-10 1985-08-30 富士通株式会社 セラミツク回路基板の製造方法
JPS627194A (ja) * 1985-07-04 1987-01-14 旭化成株式会社 スル−ホ−ル回路
JPS6265496A (ja) * 1985-09-18 1987-03-24 日本シイエムケイ株式会社 プリント配線板の製造法
JPS6411397A (en) * 1987-07-03 1989-01-13 Hokuriku Elect Ind Manufacture of circuit board
JPH0171465U (ja) * 1987-10-30 1989-05-12

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101055516B1 (ko) * 2003-04-02 2011-08-08 가부시기가이샤 후지고오키 전동 밸브
JP2018170506A (ja) * 2017-03-29 2018-11-01 京セラ株式会社 回路基板およびこれを備える電子装置

Also Published As

Publication number Publication date
JPH0547485Y2 (ja) 1993-12-14

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