JPS6411397A - Manufacture of circuit board - Google Patents

Manufacture of circuit board

Info

Publication number
JPS6411397A
JPS6411397A JP16748887A JP16748887A JPS6411397A JP S6411397 A JPS6411397 A JP S6411397A JP 16748887 A JP16748887 A JP 16748887A JP 16748887 A JP16748887 A JP 16748887A JP S6411397 A JPS6411397 A JP S6411397A
Authority
JP
Japan
Prior art keywords
paint
hole
pin
holes
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16748887A
Other languages
Japanese (ja)
Other versions
JPH06101621B2 (en
Inventor
Kiyoshi Ida
Shizuo Sakurai
Sakae Shinkawa
Yozo Obara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HOKURIKU DENKI KOGYO KK
Hokuriku Electric Industry Co Ltd
Original Assignee
HOKURIKU DENKI KOGYO KK
Hokuriku Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HOKURIKU DENKI KOGYO KK, Hokuriku Electric Industry Co Ltd filed Critical HOKURIKU DENKI KOGYO KK
Priority to JP62167488A priority Critical patent/JPH06101621B2/en
Publication of JPS6411397A publication Critical patent/JPS6411397A/en
Publication of JPH06101621B2 publication Critical patent/JPH06101621B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

PURPOSE:To form uniform through holes of products with less manufacturing steps and cost by dipping the ends of pins in conductive resin paint, inserting them into the through holes of a circuit board, reciprocating them plural times, removing the pins, and then curing the paint in the holes. CONSTITUTION:When a pin 1 formed with a spiral groove 1a is dipped in conductive resin paint 2 mixed with silver particles and pulled up, the paint 2 is adhered to the end. However, since excessive paint 2 is adhered, the pin 1 is inserted into the hole 3a of a dummy board 3 formed of the same array as that of the through holes of the board so as to provide necessary sufficient amount of the paint. When the pin 1 is then pulled up, the excessive paint is removed. The pin 1 is inserted to the hole 4a of the board 4, reciprocated several times in the hole 4a to drape the paint 2 with the inner wall of the hole 4 so as to uniformly adhere the paint to the whole periphery. When the pin 1 is pulled up, a snow hole 7 for conducting conductor patterns 5, 6 on the front and rear face of the substrate 4 is formed with the paint 2 in the hole 4a.
JP62167488A 1987-07-03 1987-07-03 Method and apparatus for manufacturing through-hole connection portion of circuit board Expired - Lifetime JPH06101621B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62167488A JPH06101621B2 (en) 1987-07-03 1987-07-03 Method and apparatus for manufacturing through-hole connection portion of circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62167488A JPH06101621B2 (en) 1987-07-03 1987-07-03 Method and apparatus for manufacturing through-hole connection portion of circuit board

Publications (2)

Publication Number Publication Date
JPS6411397A true JPS6411397A (en) 1989-01-13
JPH06101621B2 JPH06101621B2 (en) 1994-12-12

Family

ID=15850611

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62167488A Expired - Lifetime JPH06101621B2 (en) 1987-07-03 1987-07-03 Method and apparatus for manufacturing through-hole connection portion of circuit board

Country Status (1)

Country Link
JP (1) JPH06101621B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0227768U (en) * 1988-08-10 1990-02-22

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57112097A (en) * 1980-12-29 1982-07-12 Matsushita Electric Ind Co Ltd Device for connecting through hole shortcircuit of circuit board
JPS5839097A (en) * 1981-08-31 1983-03-07 シャープ株式会社 Method of connecting printing wire on flexible board

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57112097A (en) * 1980-12-29 1982-07-12 Matsushita Electric Ind Co Ltd Device for connecting through hole shortcircuit of circuit board
JPS5839097A (en) * 1981-08-31 1983-03-07 シャープ株式会社 Method of connecting printing wire on flexible board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0227768U (en) * 1988-08-10 1990-02-22

Also Published As

Publication number Publication date
JPH06101621B2 (en) 1994-12-12

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