JPH0227746U - - Google Patents
Info
- Publication number
- JPH0227746U JPH0227746U JP10618488U JP10618488U JPH0227746U JP H0227746 U JPH0227746 U JP H0227746U JP 10618488 U JP10618488 U JP 10618488U JP 10618488 U JP10618488 U JP 10618488U JP H0227746 U JPH0227746 U JP H0227746U
- Authority
- JP
- Japan
- Prior art keywords
- tape carrier
- metal substrate
- semiconductor chip
- lead
- polyimide film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- 229920001721 polyimide Polymers 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
Landscapes
- Wire Bonding (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10618488U JPH0749804Y2 (ja) | 1988-08-11 | 1988-08-11 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10618488U JPH0749804Y2 (ja) | 1988-08-11 | 1988-08-11 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0227746U true JPH0227746U (US06650917-20031118-M00005.png) | 1990-02-22 |
| JPH0749804Y2 JPH0749804Y2 (ja) | 1995-11-13 |
Family
ID=31339468
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10618488U Expired - Lifetime JPH0749804Y2 (ja) | 1988-08-11 | 1988-08-11 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0749804Y2 (US06650917-20031118-M00005.png) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08228071A (ja) * | 1994-11-10 | 1996-09-03 | Vlt Corp | 電気部品パッケージ |
| JP2008171894A (ja) * | 2007-01-09 | 2008-07-24 | Matsushita Electric Ind Co Ltd | パワーデバイス装置 |
| WO2014065288A1 (ja) * | 2012-10-22 | 2014-05-01 | 株式会社ユーシン | ドアロックアクチュエータ、部品実装構造、及び部品実装方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63131561A (ja) * | 1986-11-18 | 1988-06-03 | インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン | 電子パツケージ |
-
1988
- 1988-08-11 JP JP10618488U patent/JPH0749804Y2/ja not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63131561A (ja) * | 1986-11-18 | 1988-06-03 | インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン | 電子パツケージ |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08228071A (ja) * | 1994-11-10 | 1996-09-03 | Vlt Corp | 電気部品パッケージ |
| JP2008171894A (ja) * | 2007-01-09 | 2008-07-24 | Matsushita Electric Ind Co Ltd | パワーデバイス装置 |
| WO2014065288A1 (ja) * | 2012-10-22 | 2014-05-01 | 株式会社ユーシン | ドアロックアクチュエータ、部品実装構造、及び部品実装方法 |
| JPWO2014065288A1 (ja) * | 2012-10-22 | 2016-09-08 | 株式会社ユーシン | ドアロックアクチュエータ及び部品実装構造 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0749804Y2 (ja) | 1995-11-13 |
