JPH0227522Y2 - - Google Patents
Info
- Publication number
- JPH0227522Y2 JPH0227522Y2 JP1983008357U JP835783U JPH0227522Y2 JP H0227522 Y2 JPH0227522 Y2 JP H0227522Y2 JP 1983008357 U JP1983008357 U JP 1983008357U JP 835783 U JP835783 U JP 835783U JP H0227522 Y2 JPH0227522 Y2 JP H0227522Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- chip
- parts
- chip component
- clamping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Thermistors And Varistors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP835783U JPS59115604U (ja) | 1983-01-26 | 1983-01-26 | 電子部品のリ−ドフレ−ム |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP835783U JPS59115604U (ja) | 1983-01-26 | 1983-01-26 | 電子部品のリ−ドフレ−ム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59115604U JPS59115604U (ja) | 1984-08-04 |
| JPH0227522Y2 true JPH0227522Y2 (US20020051482A1-20020502-M00057.png) | 1990-07-25 |
Family
ID=30139847
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP835783U Granted JPS59115604U (ja) | 1983-01-26 | 1983-01-26 | 電子部品のリ−ドフレ−ム |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59115604U (US20020051482A1-20020502-M00057.png) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001326113A (ja) * | 2000-05-15 | 2001-11-22 | Oizumi Seisakusho:Kk | 電子部品実装用リードフレームおよび電子部品 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5744531B2 (US20020051482A1-20020502-M00057.png) * | 1978-10-31 | 1982-09-21 | ||
| JPS5948027B2 (ja) * | 1976-11-04 | 1984-11-22 | 日本ゼオン株式会社 | アクリロニトリル系樹脂組成物の製造方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5574028U (US20020051482A1-20020502-M00057.png) * | 1978-11-15 | 1980-05-21 | ||
| JPS5744531U (US20020051482A1-20020502-M00057.png) * | 1980-08-26 | 1982-03-11 | ||
| JPS5948027U (ja) * | 1982-09-21 | 1984-03-30 | 日通工株式会社 | コンデンサのリ−ドフレ−ム |
-
1983
- 1983-01-26 JP JP835783U patent/JPS59115604U/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5948027B2 (ja) * | 1976-11-04 | 1984-11-22 | 日本ゼオン株式会社 | アクリロニトリル系樹脂組成物の製造方法 |
| JPS5744531B2 (US20020051482A1-20020502-M00057.png) * | 1978-10-31 | 1982-09-21 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59115604U (ja) | 1984-08-04 |
