JPH0227496Y2 - - Google Patents
Info
- Publication number
- JPH0227496Y2 JPH0227496Y2 JP1982117786U JP11778682U JPH0227496Y2 JP H0227496 Y2 JPH0227496 Y2 JP H0227496Y2 JP 1982117786 U JP1982117786 U JP 1982117786U JP 11778682 U JP11778682 U JP 11778682U JP H0227496 Y2 JPH0227496 Y2 JP H0227496Y2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- disk
- ion implantation
- holder
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11778682U JPS5923732U (ja) | 1982-08-04 | 1982-08-04 | 回転式イオン注入装置に於けるウエハ取付装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11778682U JPS5923732U (ja) | 1982-08-04 | 1982-08-04 | 回転式イオン注入装置に於けるウエハ取付装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5923732U JPS5923732U (ja) | 1984-02-14 |
JPH0227496Y2 true JPH0227496Y2 (enrdf_load_html_response) | 1990-07-25 |
Family
ID=30271003
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11778682U Granted JPS5923732U (ja) | 1982-08-04 | 1982-08-04 | 回転式イオン注入装置に於けるウエハ取付装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5923732U (enrdf_load_html_response) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6174513U (enrdf_load_html_response) * | 1984-10-18 | 1986-05-20 | ||
JPH0748510Y2 (ja) * | 1993-04-21 | 1995-11-08 | 日本紙業株式会社 | 瓶類の搬送用紙器 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5582771A (en) * | 1978-12-20 | 1980-06-21 | Toshiba Corp | Ion implanting device |
US4282924A (en) * | 1979-03-16 | 1981-08-11 | Varian Associates, Inc. | Apparatus for mechanically clamping semiconductor wafer against pliable thermally conductive surface |
-
1982
- 1982-08-04 JP JP11778682U patent/JPS5923732U/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5923732U (ja) | 1984-02-14 |
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