JPH02271697A - Electrostatic and electromagnetic wave shielding material - Google Patents
Electrostatic and electromagnetic wave shielding materialInfo
- Publication number
- JPH02271697A JPH02271697A JP1093391A JP9339189A JPH02271697A JP H02271697 A JPH02271697 A JP H02271697A JP 1093391 A JP1093391 A JP 1093391A JP 9339189 A JP9339189 A JP 9339189A JP H02271697 A JPH02271697 A JP H02271697A
- Authority
- JP
- Japan
- Prior art keywords
- transparent
- conductive layer
- layer
- adhesive layer
- static electricity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 title claims abstract description 47
- 239000010410 layer Substances 0.000 claims abstract description 37
- 239000012790 adhesive layer Substances 0.000 claims abstract description 21
- 230000005611 electricity Effects 0.000 claims abstract description 20
- 230000003068 static effect Effects 0.000 claims abstract description 20
- 239000000758 substrate Substances 0.000 claims abstract description 19
- 239000002390 adhesive tape Substances 0.000 abstract description 2
- 230000005540 biological transmission Effects 0.000 abstract 2
- 239000010408 film Substances 0.000 description 23
- 238000000034 method Methods 0.000 description 8
- 239000010409 thin film Substances 0.000 description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 238000002834 transmittance Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 229920000515 polycarbonate Polymers 0.000 description 3
- 239000004417 polycarbonate Substances 0.000 description 3
- -1 polyethylene terephthalate Polymers 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 229920002799 BoPET Polymers 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 2
- DQEFEBPAPFSJLV-UHFFFAOYSA-N Cellulose propionate Chemical compound CCC(=O)OCC1OC(OC(=O)CC)C(OC(=O)CC)C(OC(=O)CC)C1OC1C(OC(=O)CC)C(OC(=O)CC)C(OC(=O)CC)C(COC(=O)CC)O1 DQEFEBPAPFSJLV-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000004917 carbon fiber Substances 0.000 description 2
- 229920006218 cellulose propionate Polymers 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 206010052128 Glare Diseases 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- CXKCTMHTOKXKQT-UHFFFAOYSA-N cadmium oxide Inorganic materials [Cd]=O CXKCTMHTOKXKQT-UHFFFAOYSA-N 0.000 description 1
- CFEAAQFZALKQPA-UHFFFAOYSA-N cadmium(2+);oxygen(2-) Chemical compound [O-2].[Cd+2] CFEAAQFZALKQPA-UHFFFAOYSA-N 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- GBRBMTNGQBKBQE-UHFFFAOYSA-L copper;diiodide Chemical compound I[Cu]I GBRBMTNGQBKBQE-UHFFFAOYSA-L 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005421 electrostatic potential Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005118 spray pyrolysis Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、各種電子、通信装置、たとえばデイスプレ
ィデバイスなどを備えた装置に取り付けられる静電気、
電磁波シールド材に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] This invention is directed to the prevention of static electricity and
Regarding electromagnetic shielding materials.
［従来の技術］
従来より、デイスプレィデバイスなどを備えた装置にお
ける、たとえば窓材などとして用いられるシールド材と
しては、外部からデイスプレィ内部を目視できるような
高い可視光線透過能、つまりすぐれた透明性（視認性）
を有していることが要求されるとともに、デイスプレィ
デバイスなどから発生する静電気（高電圧）または電磁
波などをシールドしうるすぐれたシールド特性を備えて
いることが望まれる。[Prior Art] Conventionally, shielding materials used, for example, as window materials in devices equipped with display devices, etc., have a high visible light transmittance that allows the inside of the display to be viewed from the outside, that is, excellent transparency. (Visibility)
In addition, it is desired that the display device has excellent shielding characteristics capable of shielding static electricity (high voltage) or electromagnetic waves generated from display devices and the like.
この種のシールド材としては、ガラス基板やポリカーボ
ネート基板などの透明部材上にメツシュタイプのカーボ
ン繊維や金属コーティング繊維を貼り合わせたもの、あ
るいは上記同様の透明部材上に金属酸化物薄膜を形成し
たものなどが汎用されている。This type of shielding material includes mesh-type carbon fibers or metal-coated fibers bonded onto a transparent member such as a glass substrate or polycarbonate substrate, or a metal oxide thin film formed on the same transparent member as above. is widely used.
しかるに、上記従来のシールド材のうち、メツシュタイ
プのカーボン繊維や金属コーティング繊維を貼り合わせ
たものは、基板を透過する像や物体がメツシュ部分で切
断されたり、光の反射による散乱によりゆらぎを生じ、
視認性を悪くさせるといった問題があった。However, among the above-mentioned conventional shielding materials, those in which mesh-type carbon fibers or metal-coated fibers are bonded together may cause images or objects that pass through the substrate to be cut at the mesh portion, or cause fluctuations due to scattering due to light reflection.
There was a problem of poor visibility.
また、金属酸化物薄膜を形成したものは、透明部材上に
上記薄膜を形成するための単一操作を繰り返し行わねば
ならないので、生産性が悪くコスト高となるという問題
があった。また、ガラス基板の場合、基板自体の性状か
ら作業時や使用時に容易に破損したり、曲げ加工ができ
ないといった問題があり、一方プラスチック基板の場合
でも、膜形成作業時に薄膜に傷が付きやすく、擦傷性に
劣る問題があるほか、屋外などの使用環境下では、薄膜
の抵抗変化が大きく、シールド特性が著しく低下すると
いう耐久性の問題があった。Further, in the case of forming a metal oxide thin film, a single operation for forming the thin film on a transparent member must be repeated, resulting in poor productivity and high cost. In addition, in the case of glass substrates, there are problems in that they are easily damaged during work or use due to the nature of the substrate itself, and cannot be bent.On the other hand, even in the case of plastic substrates, the thin film is easily damaged during film formation work. In addition to the problem of poor abrasion resistance, there was also a problem of durability in that the resistance of the thin film changed significantly under conditions of use such as outdoors, resulting in a significant drop in shielding properties.
この発明は、上記従来の問題に鑑み、高い可視光線透過
能を有するとともに、デイスプレィデバイスなどから発
生する静電気や電磁波などを効果的にシールドしうるす
ぐれたシールド能を備え、そのうえ作製時の作業性や耐
擦傷性さらには使用時の耐久性にもすぐれた静電気、電
磁波シールド材を提供することを目的としている。In view of the above-mentioned conventional problems, this invention has high visible light transmittance, excellent shielding ability that can effectively shield static electricity and electromagnetic waves generated from display devices, etc., and also reduces work during manufacturing. The purpose of this invention is to provide a static electricity and electromagnetic shielding material that has excellent hardness, scratch resistance, and durability during use.
この発明者らは、上記の目的を達成するために鋭意検討
した結果、透明なフィルム基材の一方の面に透明な導電
層を設けて透明導電フィルムを構成させるとともに、こ
のフィルムの導電層上にさらに粘着剤層を設け、この粘
着剤層を介して透明基板に貼り合わせることにより、可
視光線透過能、静電気および電磁波に対するシールド能
のいずれの機能をも兼ね備えているうえに、作製時の作
業性、耐擦傷性および使用時の耐久性にもすぐれたシー
ルド材が得られることを知り、この発明を完成するに至
った。As a result of intensive studies to achieve the above object, the inventors constructed a transparent conductive film by providing a transparent conductive layer on one side of a transparent film base material, and also constructed a transparent conductive film on the conductive layer of this film. By further providing an adhesive layer and bonding it to a transparent substrate via this adhesive layer, it has the ability to transmit visible light and shield against static electricity and electromagnetic waves. This invention was completed based on the knowledge that a shielding material with excellent properties such as hardness, scratch resistance, and durability during use can be obtained.
すなわち、この発明は、透明なフィルム基材の一方の面
に透明な導電層とさらにこの導電層上に透明な粘着剤層
を設けるとともに、この粘着剤層を介して他の透明基板
を貼り合わせてなることを特徴とする静電気、電磁波シ
ールド材に係るものである。That is, the present invention provides a transparent conductive layer on one side of a transparent film base material, a transparent adhesive layer on this conductive layer, and attaches another transparent substrate via this adhesive layer. This invention relates to a static electricity and electromagnetic shielding material that is characterized by:
この発明において使用する透明なフィルム基材としては
、透明性を有するフィルムであれば広く適用でき、たと
えばポリエチレンテレフタレート、ポリイミド、ポリエ
ーテルサルフオン、ポリエテルエーテルケトン、ポリカ
ーボネート、ポリプロピレン、ポリアミド、アクリル、
セルロースプロピオネートなどのプラスチックフィルム
が好ましく用いられる。The transparent film substrate used in this invention can be widely applied as long as it has transparency, such as polyethylene terephthalate, polyimide, polyether sulfone, polyether ether ketone, polycarbonate, polypropylene, polyamide, acrylic,
Plastic films such as cellulose propionate are preferably used.
このようなフィルム基材の厚みは、特に限定されないが
、一般には５〜３００μｍ程度であるのがよい。薄くな
りすぎるとフィルムの機械的強度が不足し、また厚くな
りすぎるとフレキシブル性の欠如により、たとえばロー
ル状として連続的にこのフィルム表面に導電層やさらに
粘着剤層を形成することが難しくなるし、また透明基板
を貼り合わせる際に、両者間に浮き現象や気泡が生じや
すくなって密着性を阻害するおそれがあり、好ましくな
い。The thickness of such a film base material is not particularly limited, but is generally preferably about 5 to 300 μm. If it becomes too thin, the film will lack mechanical strength, and if it becomes too thick, it will lack flexibility, making it difficult to continuously form a conductive layer or an adhesive layer on the surface of the film, for example, in roll form. Furthermore, when bonding the transparent substrates together, floating phenomena and bubbles tend to occur between the two, which may impair adhesion, which is not preferable.
この発明において上記のフィルム基材の一方の面に設け
られる透明な導電層としては、酸化第二スズ、酸化イン
ジウム、酸化チタン、酸化カドミウム、金属インジウム
、金属スズ、金、銀、白金、パラジウム、銅、アルミニ
ウム、ニッケル、クロム、チタン、鉄、コバルト、ヨウ
化銅、これらの混合物または合金などが挙げられる。In this invention, the transparent conductive layer provided on one side of the above film base material includes stannic oxide, indium oxide, titanium oxide, cadmium oxide, metallic indium, metallic tin, gold, silver, platinum, palladium, Examples include copper, aluminum, nickel, chromium, titanium, iron, cobalt, copper iodide, and mixtures or alloys thereof.
この導電層の厚みは、目的により適宜変更しうるが、た
とえば酸化物やその混合物を導電層とする場合は通常８
０〜５，０００人、金属または合金を導電層とする場合
は通常５０〜４００人とするのがよい。薄くなりすぎる
と膜構造上の欠陥により静電気や電磁波に対するシール
ド性が低下し、また厚くなりすぎると可視光線透過率が
低下するため、いずれも好ましくない。The thickness of this conductive layer can be changed as appropriate depending on the purpose, but for example, when the conductive layer is made of an oxide or a mixture thereof, it is usually 8.
The number of participants is preferably 0 to 5,000, and when the conductive layer is made of metal or alloy, the number is usually 50 to 400. If it becomes too thin, the shielding property against static electricity and electromagnetic waves will deteriorate due to defects in the film structure, and if it becomes too thick, the visible light transmittance will decrease, which are both undesirable.
この透明な導電層の表面抵抗としては、一般に、静電気
シールド用としては１０９Ω／口以下、電磁波シールド
用としては１０３Ω／口以下であるのが好ましい。Generally, the surface resistance of this transparent conductive layer is preferably 10 9 Ω/or less for electrostatic shielding, and 10 3 Ω/or less for electromagnetic shielding.
このような透明な導電層は、たとえば真空蒸着法、スパ
ッタリング法、イオンブレーティング法、化学蒸着法、
スプレー熱分解法、化学メツキ法、電気メツキ法または
これらの組み合わせ法などの公知の薄膜形成技術により
、容易に形成することができる。Such a transparent conductive layer can be formed by, for example, a vacuum deposition method, a sputtering method, an ion blasting method, a chemical vapor deposition method,
It can be easily formed by a known thin film forming technique such as a spray pyrolysis method, a chemical plating method, an electroplating method, or a combination thereof.
この発明において上記の導電層上に設けられる粘着剤層
としては、透明性を有してかつ導電層を腐食しないもの
であれば広く適用できる。公知の粘着剤の中でもアクリ
ル系粘着剤は特に好ましいものとして用いられる。この
粘着剤層の厚みは２μｍ以上、通常５〜５００μｍとす
るのが適当である。In this invention, the adhesive layer provided on the conductive layer can be widely applied as long as it has transparency and does not corrode the conductive layer. Among known adhesives, acrylic adhesives are particularly preferred. The thickness of this adhesive layer is preferably 2 μm or more, usually 5 to 500 μm.
この発明においては、上記の如く透明な導電層および粘
着剤層を設けたフィルム基材を、上記の粘着剤層を介し
て透明基板に貼り合わせることにより、静電気、電磁波
シールド材を構成させる。In this invention, a film base material provided with a transparent conductive layer and an adhesive layer as described above is laminated to a transparent substrate via the adhesive layer to constitute a static electricity and electromagnetic shielding material.
ここで用いる透明基板には、厚みが通常１〜ｌＯ龍程度
のガラス板や、ポリカーボネート、セルロースプロピオ
ネート、アクリルなどの透明なプラスチック板などがあ
り、その形状は平板状、曲形状などの任意の形状であっ
てよい。The transparent substrate used here includes a glass plate with a thickness of about 1 to 10 mm, a transparent plastic plate made of polycarbonate, cellulose propionate, acrylic, etc., and its shape can be any shape such as a flat plate or a curved shape. It may be in the shape of
なお、ガラス板とプラスチック板とを積層した透明基板
を用いてもよく、この場合には比較的脆く破損されやす
いガラス板の破損時の飛散防止効果が付加されることに
なる。Note that a transparent substrate made by laminating a glass plate and a plastic plate may be used, and in this case, the glass plate, which is relatively brittle and easily broken, has an added effect of preventing scattering when broken.
第１図は、上記この発明の静電気、電磁波シールド材の
構成例を示したもので、図中、２は透明なフィルム基材
１の一方の面に設けられた透明な導電層、３はこの導電
層２上に設けられた透明な粘着剤層、４はこの粘着剤層
３を介してフィルム基材２に貼り合わされた透明基板で
ある。なお、５．６はアース取り出し構造を示し、５は
両面粘着テープ、６は導電性テープである。FIG. 1 shows an example of the structure of the static electricity and electromagnetic wave shielding material of the present invention. A transparent adhesive layer 4 provided on the conductive layer 2 is a transparent substrate bonded to the film base material 2 via the adhesive layer 3. In addition, 5.6 shows a ground extraction structure, 5 is a double-sided adhesive tape, and 6 is a conductive tape.
このように構成されるシールド材において、透明基板４
の表面に防眩処理を施して視認性をさらに向上してもよ
い。また、フィルム基材１の露出表面、つまり導電層お
よび粘着剤層を設けた面とは反対側の面に、耐擦傷性を
向上させるなどの目的でハードコート処理を施してもよ
い。In the shield material configured in this way, the transparent substrate 4
The visibility may be further improved by applying anti-glare treatment to the surface. Further, the exposed surface of the film base material 1, that is, the surface opposite to the surface on which the conductive layer and the adhesive layer are provided, may be subjected to a hard coat treatment for the purpose of improving scratch resistance.
以上のように、この発明の静電気、電磁波シルト材は、
可視光線透過能、静電気および電磁波シールド能のいず
れの機能をも兼ね備えたものであるため、デイスプレィ
デバイスなどを備えた装置の窓材などとして適用されれ
ば、その透明性により装置内部の目視が容易となるうえ
に、装置内部から発生する静電気や電磁波を効果的にシ
ールドしうるという格別の効果が奏し得られる。As described above, the electrostatic and electromagnetic silt material of this invention is
Because it has both the ability to transmit visible light and the ability to shield static electricity and electromagnetic waves, if it is applied as a window material for equipment equipped with display devices, etc., its transparency will allow visual inspection of the inside of the equipment. Not only is this easy, but it also has the special effect of effectively shielding static electricity and electromagnetic waves generated from inside the device.
また、上記シールド材は、透明なフィルム基材を用いて
構成しているため、このフィルム基材をロール状として
連続的にこの基材表面に導電層や粘着剤層を形成できる
し、またこれら層を形成したフィルム基材と透明基板と
を連続して貼り合わせることができる。Furthermore, since the shielding material is constructed using a transparent film base material, it is possible to continuously form a conductive layer and an adhesive layer on the surface of this base material by rolling this film base material, and also to form a conductive layer and an adhesive layer on the surface of the base material. The film base material with the layer formed thereon and the transparent substrate can be successively bonded together.
したがって、作業能率と生産性の飛躍的な向上が期待で
きるし、また作製されたシールド材は上記すぐれた性能
に加えて、導電層の耐擦傷性および耐久性が良好である
ので、従来にない静電気、電磁波シールド材として幅広
い用途に利用することができる。Therefore, a dramatic improvement in work efficiency and productivity can be expected, and in addition to the above-mentioned excellent performance, the fabricated shielding material has good scratch resistance and durability of the conductive layer, which is unprecedented. It can be used in a wide range of applications as a static electricity and electromagnetic shielding material.
以下に、この発明の実施例を記載してより具体的に説明
する。なお、以下の特性試験は、っぎの方法にて行った
ものである。EXAMPLES Below, examples of the present invention will be described in more detail. In addition, the following characteristic tests were conducted using the method of GG.
〈表面抵抗〉
４端子法にて測定した。測定は貼り合わせ前のフィルム
にて行った。<Surface resistance> Measured using the 4-terminal method. Measurements were performed on the film before lamination.
〈可視光ｖＡ透過率〉
分光分析装置ＵＶ−２４０（島津製作所社製）を用いて
、波長５５０ｎｍにおける可視光線透過率を測定した。<Visible light vA transmittance> Visible light transmittance at a wavelength of 550 nm was measured using a spectroscopic analyzer UV-240 (manufactured by Shimadzu Corporation).
〈静電気シールド特性〉
集電式電位測定器ＫＳ−３２５型（春日電気社製）を用
いて、テレビのブラウン管（ＣＲＴ）表面にシールド材
を設置（アース付き）し、シールド材表面の静電気量（
テレビＯＮ時）を測定した。<Static electricity shielding characteristics> Using a current collector type potential measuring device KS-325 model (manufactured by Kasuga Denki Co., Ltd.), a shielding material was installed (grounded) on the surface of a cathode ray tube (CRT) of a television, and the amount of static electricity on the surface of the shielding material (
(when the TV was on) was measured.
なお、シールド材を設置しない場合は、４０〜５０ｋＶ
の静電気電位を持つ。In addition, if no shielding material is installed, the voltage will be 40 to 50 kV.
It has an electrostatic potential of .
〈電磁波シールド特性〉
電磁波シールド効果測定装置ＴＲ−１７３０１（アトパ
ンテスト社製）を用いて、周波数１０’１０’ １０
９Ｈｚの電界シールド効果（ｄＢ）を測定した。<Electromagnetic shielding characteristics> Using an electromagnetic shielding effect measuring device TR-17301 (manufactured by Atopan Test Co., Ltd.), a frequency of 10'10'10 was measured.
The electric field shielding effect (dB) at 9 Hz was measured.
〈耐擦傷性〉
シールド材における透明なフィルム基材の表面をガーゼ
で強くこすり、この操作によって導電層面に傷が著しく
つくものを×、つかないものを○として評価した。<Scratch Resistance> The surface of the transparent film base material in the shielding material was strongly rubbed with gauze, and the conductive layer surface was evaluated as × if the surface was markedly scratched by this operation, and ○ if it was not.
く耐屋外暴露性〉
シールド材を屋外に１力月放置する耐久性試験を行い、
この試験を行う前の初期の抵抗値（Ｒ。Resistance to outdoor exposure〉 A durability test was conducted in which the shielding material was left outdoors for one month.
The initial resistance value (R) before performing this test.
）に対する試験後の抵抗値（Ｒ）の変化（Ｒ／Ｒ０）を
測定した。この変化（Ｒ／Ｒ，）が小さいほど耐久性に
すぐれていることを意味する。なお、実施例のシールド
材では、導電層の１部に非粘着部分を作り、その部分を
用いて抵抗の測定を行った。) The change in resistance value (R) after the test (R/R0) was measured. The smaller this change (R/R,) is, the better the durability is. In addition, in the shield material of the example, a non-adhesive part was made in a part of the conductive layer, and the resistance was measured using that part.
実施例１
透明基材としての厚み７５μｍのポリエチレンテレフタ
レート（以下、ＰＥＴという）フィルムの一面に、スパ
ッタリング法により、透明な導電層として厚み約６００
人のＩＴＯ（Ｉｎ２ ｏｆｆ ：ＳｎＯ□＝１１（重
量比）〕からなる酸化物薄膜層を形成した。ついで、こ
の導電層上に厚み約２０μｍの透明なアクリル系粘着剤
層を介して厚み２鶴の透明なアクリル板を貼り合わせて
、静電気、電磁波シールド材を作製した。Example 1 A transparent conductive layer with a thickness of approximately 600 μm was formed on one side of a 75 μm thick polyethylene terephthalate (hereinafter referred to as PET) film as a transparent base material by sputtering.
A thin oxide film layer made of human ITO (In2off:SnO□=11 (weight ratio)) was formed.Then, a transparent acrylic adhesive layer with a thickness of about 20 μm was interposed on this conductive layer, and then a film with a thickness of 2 mm was formed. A static electricity and electromagnetic shielding material was created by pasting together transparent acrylic plates.
比較例１
ＰＥＴフィルムの一面に導電層を、他面に粘着剤層を設
け、これとアクリル板とを貼り合わせるようにした以外
は、実施例１と同様にして、静電気、電磁波シールド材
を作製した。Comparative Example 1 A static electricity and electromagnetic shielding material was produced in the same manner as in Example 1, except that a conductive layer was provided on one side of the PET film and an adhesive layer was provided on the other side, and this was bonded to an acrylic plate. did.
実施例２
透明な導電層として、真空蒸着法により、厚み約１２０
人の金属Ａｇ薄膜層を形成するようにした以外は、実施
例１と同様にして、静電気、電磁波シールド材を作製し
た。Example 2 A transparent conductive layer was formed with a thickness of about 120 mm by vacuum evaporation method.
A static electricity and electromagnetic shielding material was produced in the same manner as in Example 1, except that a thin metal Ag thin film layer was formed.
比較例２
ＰＥＴフィルムの一面に導電層を、他面に粘着剤層を設
け、これ止アクリル板とを貼り合わせるようにした以外
は、実施例２と同様にして、静電気、電磁波シールド材
を作製した。Comparative Example 2 A static electricity and electromagnetic shielding material was produced in the same manner as in Example 2, except that a conductive layer was provided on one side of the PET film, an adhesive layer was provided on the other side, and the acrylic plate was bonded to prevent this. did.
以上の実施例１，２と比較例１．２に係る各シールド材
の特性を調べた結果は、つぎの第１表に示されるとおり
であった。The results of examining the characteristics of each shielding material according to Examples 1 and 2 and Comparative Examples 1.2 above are as shown in Table 1 below.
第 １
表
を傷つけることはなく、耐久特性が非常に良好であるこ
とが確認された。There was no damage to Table 1, and it was confirmed that the durability characteristics were very good.
図面はこの発明の静電気、電磁波シールド材の一例を示
す断面図である。The drawing is a sectional view showing an example of the electrostatic and electromagnetic shielding material of the present invention.
Claims (1)
とさらにこの導電層上に透明な粘着剤層を設けるととも
に、この粘着剤層を介して他の透明基板を貼り合わせて
なることを特徴とする静電気、電磁波シールド材。(1) A transparent conductive layer is provided on one side of a transparent film base material, and a transparent adhesive layer is further provided on this conductive layer, and another transparent substrate is bonded to the transparent film base via this adhesive layer. Static electricity and electromagnetic shielding material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1093391A JPH02271697A (en) | 1989-04-13 | 1989-04-13 | Electrostatic and electromagnetic wave shielding material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1093391A JPH02271697A (en) | 1989-04-13 | 1989-04-13 | Electrostatic and electromagnetic wave shielding material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02271697A true JPH02271697A (en) | 1990-11-06 |
Family
ID=14081012
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1093391A Pending JPH02271697A (en) | 1989-04-13 | 1989-04-13 | Electrostatic and electromagnetic wave shielding material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02271697A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0553299U (en) * | 1991-12-13 | 1993-07-13 | 住友ベークライト株式会社 | Transparent shield member for liquid crystal display devices with copper electrodes |
| EP0834898A2 (en) * | 1996-10-01 | 1998-04-08 | Nisshinbo Industries, Inc. | Electromagnetic radiation shield panel and method of producing the same |
| EP0883156A2 (en) * | 1997-06-03 | 1998-12-09 | Hitachi Chemical Co., Ltd. | Electromagnetically shielding bonding film |
| EP0886295A2 (en) * | 1997-06-19 | 1998-12-23 | Sumitomo Chemical Company, Limited | Front panel for plasma display |
| EP0908920A2 (en) * | 1997-10-13 | 1999-04-14 | Bridgestone Corporation | Display panel |
| EP0917174A2 (en) * | 1997-11-11 | 1999-05-19 | Hitachi Chemical Co., Ltd. | Electromagetically shielding bonding film, and shielding assembly and display device using such film |
| JP2009151331A (en) * | 1996-09-26 | 2009-07-09 | Asahi Glass Co Ltd | Protective plate for plasma display and method for producing the same |
| JP2011018930A (en) * | 2002-08-17 | 2011-01-27 | Three M Innovative Properties Co | Flexible, formable conductive film |
| WO2021112075A1 (en) * | 2019-12-03 | 2021-06-10 | タツタ電線株式会社 | Electromagnetic wave shielding film |
| WO2021141067A1 (en) * | 2020-01-07 | 2021-07-15 | タツタ電線株式会社 | Electromagnetic wave shielding film |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6034099A (en) * | 1983-08-04 | 1985-02-21 | 三菱レイヨン株式会社 | Electromagnetic shield with excellent transparency |
-
1989
- 1989-04-13 JP JP1093391A patent/JPH02271697A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6034099A (en) * | 1983-08-04 | 1985-02-21 | 三菱レイヨン株式会社 | Electromagnetic shield with excellent transparency |
Cited By (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0553299U (en) * | 1991-12-13 | 1993-07-13 | 住友ベークライト株式会社 | Transparent shield member for liquid crystal display devices with copper electrodes |
| US8048531B2 (en) | 1996-09-26 | 2011-11-01 | Asahi Glass Company Ltd. | Protective plate for a plasma display and a method for producing the same |
| JP4666087B2 (en) * | 1996-09-26 | 2011-04-06 | 旭硝子株式会社 | Protection plate for plasma display |
| JP2009151331A (en) * | 1996-09-26 | 2009-07-09 | Asahi Glass Co Ltd | Protective plate for plasma display and method for producing the same |
| EP0834898A2 (en) * | 1996-10-01 | 1998-04-08 | Nisshinbo Industries, Inc. | Electromagnetic radiation shield panel and method of producing the same |
| EP0834898A3 (en) * | 1996-10-01 | 1998-11-25 | Nisshinbo Industries, Inc. | Electromagnetic radiation shield panel and method of producing the same |
| EP0883156A3 (en) * | 1997-06-03 | 1999-05-26 | Hitachi Chemical Co., Ltd. | Electromagnetically shielding bonding film |
| EP0883156A2 (en) * | 1997-06-03 | 1998-12-09 | Hitachi Chemical Co., Ltd. | Electromagnetically shielding bonding film |
| EP0886295A3 (en) * | 1997-06-19 | 1999-02-10 | Sumitomo Chemical Company, Limited | Front panel for plasma display |
| EP0886295A2 (en) * | 1997-06-19 | 1998-12-23 | Sumitomo Chemical Company, Limited | Front panel for plasma display |
| EP0908920A2 (en) * | 1997-10-13 | 1999-04-14 | Bridgestone Corporation | Display panel |
| EP0908920B1 (en) * | 1997-10-13 | 2006-11-08 | Bridgestone Corporation | Plasma display panel with conductive mesh member bonded to front surface of panel by transparent elastic adhesive |
| EP0917174A2 (en) * | 1997-11-11 | 1999-05-19 | Hitachi Chemical Co., Ltd. | Electromagetically shielding bonding film, and shielding assembly and display device using such film |
| EP0917174A3 (en) * | 1997-11-11 | 1999-05-26 | Hitachi Chemical Co., Ltd. | Electromagetically shielding bonding film, and shielding assembly and display device using such film |
| US6197408B1 (en) | 1997-11-11 | 2001-03-06 | Hitachi Chemical Company, Ltd. | Electromagnetically shielding bonding film, and shielding assembly and display device using such film |
| JP2011018930A (en) * | 2002-08-17 | 2011-01-27 | Three M Innovative Properties Co | Flexible, formable conductive film |
| JP2011018931A (en) * | 2002-08-17 | 2011-01-27 | Three M Innovative Properties Co | Flexible, formable conductive film |
| WO2021112075A1 (en) * | 2019-12-03 | 2021-06-10 | タツタ電線株式会社 | Electromagnetic wave shielding film |
| US11647619B2 (en) | 2019-12-03 | 2023-05-09 | Tatsuta Electric Wire & Cable Co., Ltd. | Electromagnetic wave shielding film |
| TWI815049B (en) * | 2019-12-03 | 2023-09-11 | 日商拓自達電線股份有限公司 | Electromagnetic wave shielding film |
| WO2021141067A1 (en) * | 2020-01-07 | 2021-07-15 | タツタ電線株式会社 | Electromagnetic wave shielding film |
| JP6956926B1 (en) * | 2020-01-07 | 2021-11-02 | タツタ電線株式会社 | Electromagnetic wave shield film |
| TWI807242B (en) * | 2020-01-07 | 2023-07-01 | 日商拓自達電線股份有限公司 | Electromagnetic wave shielding film and shielding printed wiring board |
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