JPH02271651A - Positioning device of molded ic - Google Patents

Positioning device of molded ic

Info

Publication number
JPH02271651A
JPH02271651A JP9412789A JP9412789A JPH02271651A JP H02271651 A JPH02271651 A JP H02271651A JP 9412789 A JP9412789 A JP 9412789A JP 9412789 A JP9412789 A JP 9412789A JP H02271651 A JPH02271651 A JP H02271651A
Authority
JP
Japan
Prior art keywords
molded
positioning
mold
lead
lead part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9412789A
Other languages
Japanese (ja)
Inventor
Nobuyuki Kurauchi
伸幸 倉内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP9412789A priority Critical patent/JPH02271651A/en
Publication of JPH02271651A publication Critical patent/JPH02271651A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To position a molded IC and prevent a lead from being bent by providing a molded IC substrate guiding the lower part of molded part or the inside of the lead part of a molded IC. CONSTITUTION:The area between a molded part lower side 3 and an inside of lead part 4 is guided by a positioning guide 2 and a taper is attached to the tip of the positioning guide 2 to enable the molded IC1 to be inserted into the positioning guide 2. By reducing difference in dimensions between the dimensions of the molded part lower side 3 of a molded IC1 and those of a molded pad inside 5, a precise positioning can be made. Also, the mold padding inside 5 and the lead part inside 4 come into contact each other. However, since the lead part inside 4 is strong so that nearly no bending in leg occurs. Therefore, it is not necessary to perform mechanical operation for positioning and no bending of leads occurs.

Description

【発明の詳細な説明】 ［産業上の利用分野〕 本発明は、モールドＩＣの位置決め方法及びモールドＩ
Ｃ装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention provides a method for positioning a molded IC and a method for positioning a molded IC.
Regarding the C device.

［従来の技術］ 従来は、第３図に示すように、モールドＩＣＩのモール
ド部上側８をチャック９によりはさみ込み位置決めする
方法がある。[Prior Art] Conventionally, as shown in FIG. 3, there is a method in which the upper side 8 of the mold part of a mold ICI is held and positioned by a chuck 9.

また第４図に示すように、位置決めガイド２によりモー
ルドＩＣＩのリード部外周ｌＯで位置決めする方法があ
った。Furthermore, as shown in FIG. 4, there is a method in which positioning is performed using a positioning guide 2 at the outer periphery lO of the lead portion of the mold ICI.

［発明が解決しようとする課題〕 しかし、従来のモールドＩＣの位置決め方法は第３図に
示す場合、チャック９を左右に開閉動作させる機構が必
要であり、また第４図に示す場合では、位置決めガイド
２にモールドＩＣＩのリード部外周１０が接触し、リー
ドの足曲りが発生するという課題を有していた。[Problems to be Solved by the Invention] However, in the case shown in FIG. 3, the conventional positioning method of a molded IC requires a mechanism for opening and closing the chuck 9 from side to side, and in the case shown in FIG. There was a problem in that the outer periphery 10 of the lead portion of the molded ICI came into contact with the guide 2, causing the legs of the lead to bend.

そこで、本発明は従来のこのような課題を解決するため
、位置決めするための機械的動作が必要なく、またリー
ドに足曲りを発生させないことを目的としている。Therefore, in order to solve these conventional problems, the present invention aims to eliminate the need for mechanical operation for positioning and also to prevent the lead from bending.

［課題を解決するための手段１ 上記課題を解決するため、本発明のモールドＩＣの位置
決め方法は、モールド■Ｃの位置決め方法において、モ
ールドＩＣのモールド部下側又はノード部内側をガイド
するモールドＩＣ基板をもうけ、前記モールドＩＣ基板
により位置決めすることを特徴とする。[Means for Solving the Problems 1] In order to solve the above problems, the molded IC positioning method of the present invention includes a molded IC substrate that guides the molded IC under the mold or inside the node part in the molded IC positioning method. , and the positioning is performed by the molded IC substrate.

〔実　施　例〕〔Example〕

以下に本発明の実施例を図面にもとづいて説明する。第
１図において、位置決めガイド２でモールドエＣ１のモ
ールド部下側３とリード部内側４の間をガイドする１位
置決めガイド２の先端にテーバなつけることにより、モ
ールドＩＣＩが位置決めガイド２により入りやすくなる
。Embodiments of the present invention will be described below based on the drawings. In FIG. 1, the mold ICI can be inserted into the positioning guide 2 more easily by attaching a taper to the tip of the positioning guide 2 that guides the positioning guide 2 between the lower side 3 of the mold and the inner side 4 of the lead part of the mold E C1.

モールドＩＣＩのモールド部下側３の寸法と位置決めガ
イド２のモールド受は内側５の寸法との寸法公差を小さ
くすることにより、精密な位置決めをすることができる
。これは、モールドＩＣＩのリード部内側４の寸法とモ
ールド受は外側６の寸法の寸法公差を小さくしても同じ
である。またモールド受は内側５とリード部内側４は接
触するが、第４図に示す方法と比較すると、リード部内
側４はリード部外周１０より強いため、足曲りはほとん
ど（約Ｏ％）発生しない効果がある。Precise positioning can be achieved by reducing the dimensional tolerance between the dimensions of the lower mold side 3 of the mold ICI and the dimensions of the inner side 5 of the mold receiver of the positioning guide 2. This is the same even if the dimensional tolerance between the inner side 4 of the lead portion of the mold ICI and the outer side 6 of the mold receiver is reduced. In addition, the inner side 5 of the mold receiver and the inner side 4 of the lead part contact, but compared to the method shown in Fig. 4, the inner side 4 of the lead part is stronger than the outer periphery 10 of the lead part, so bending of the legs hardly occurs (about 0%). effective.

第２図は、こう方法を用いてモールドＩＣを搬送したと
きの実施例を示したものである０位置決めガイド２を搬
送板７の上に必要な数だけ設置する。モールドＩＣＩは
、真空吸着により次の位置決めガイド２の上に搬送され
る。こうすることにより、モールドＩＣＩは、位置ズレ
することなく順次搬送することができる。FIG. 2 shows an embodiment in which molded ICs are transported using this method. A necessary number of positioning guides 2 are installed on the transport plate 7. The mold ICI is conveyed onto the next positioning guide 2 by vacuum suction. By doing so, the mold ICIs can be sequentially transported without being misaligned.

［発明の効果］ 本発明のモールドＩＣの位置決め方法は、以上説明した
ように、モールドＩＣのモールド部下側又はリード部内
側をガイドするモールドＩＣ基板をもうけるという簡単
な構造によって、モールドＩＣを位置決めし、リードに
足曲りが発生しない効果がある。[Effects of the Invention] As explained above, the method for positioning a molded IC of the present invention positions a molded IC using a simple structure of providing a molded IC substrate that guides the lower side of the mold or the inside of the lead part of the molded IC. This has the effect of preventing the lead from bending.

また、モールドＩＣを位置決めするための位置決め動作
部は必要ないため、小型化、省スペース化という面でも
効果がある。Further, since a positioning operation unit for positioning the molded IC is not required, it is also effective in terms of miniaturization and space saving.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は１本発明のモールドＩＣの位置決め装置の横断
面図、第２図は、本発明のモールドＩＣの位置決め装置
をモールドＩＣの搬送に用いたときの図、第３図及び第
４図は、従来の位置決め装置の横断面図である。 モールドＩＣ 位置決めガイド モールド部下側 リード部内側 モールド受は内側 モールド受は外側 搬送板 モールド部上側 チャック リード部外周 〒１０ 第　２　図 以上 出願人　セイコーエプソン株式会社 代理人　弁理士　鈴　木　喜三部（他１名）第 図 第４図FIG. 1 is a cross-sectional view of a molded IC positioning device of the present invention, FIG. 2 is a diagram when the molded IC positioning device of the present invention is used for transporting a molded IC, and FIGS. 3 and 4 1 is a cross-sectional view of a conventional positioning device. Mold IC Positioning guide Mold lower lead part Inner mold holder is inner mold holder is outer conveyor plate Mold part Upper chuck lead part Outer circumference 〒10 Figures 2 and above Applicant Seiko Epson Co., Ltd. Agent Patent attorney Kizobe Suzuki (et al.) 1 person) Figure 4

Claims (1)

【特許請求の範囲】[Claims] モールドＩＣの位置決め装置において、前記モールドＩ
Ｃのモールド部下側又はリード部内側をガイドするモー
ルドＩＣ基板をもうけ、前記モールドＩＣ基板により位
置決めすることを特徴とするモールドＩＣの位置決め装
置。In the molded IC positioning device, the mold I
1. A positioning device for a molded IC, comprising a molded IC board that guides the lower side of the mold or the inside of the lead part of the molded IC, and positions the molded IC board using the molded IC board.
JP9412789A 1989-04-13 1989-04-13 Positioning device of molded ic Pending JPH02271651A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9412789A JPH02271651A (en) 1989-04-13 1989-04-13 Positioning device of molded ic

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9412789A JPH02271651A (en) 1989-04-13 1989-04-13 Positioning device of molded ic

Publications (1)

Publication Number Publication Date
JPH02271651A true JPH02271651A (en) 1990-11-06

Family

ID=14101752

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9412789A Pending JPH02271651A (en) 1989-04-13 1989-04-13 Positioning device of molded ic

Country Status (1)

Country Link
JP (1) JPH02271651A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5778517A (en) * 1995-06-09 1998-07-14 Webasto Sunroofs, Inc. Device and method for the assembly of a sliding sunroof frame

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5778517A (en) * 1995-06-09 1998-07-14 Webasto Sunroofs, Inc. Device and method for the assembly of a sliding sunroof frame
US6035510A (en) * 1995-06-09 2000-03-14 Webasto Sunroofs, Inc. Method for assembly of a sliding sunroof assembly

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