JPH02264496A - Mounting structure of chip component - Google Patents
Mounting structure of chip componentInfo
- Publication number
- JPH02264496A JPH02264496A JP8645389A JP8645389A JPH02264496A JP H02264496 A JPH02264496 A JP H02264496A JP 8645389 A JP8645389 A JP 8645389A JP 8645389 A JP8645389 A JP 8645389A JP H02264496 A JPH02264496 A JP H02264496A
- Authority
- JP
- Japan
- Prior art keywords
- pad
- mounting
- chip component
- printed board
- positioning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims abstract description 41
- 230000008018 melting Effects 0.000 claims abstract description 18
- 238000002844 melting Methods 0.000 claims abstract description 18
- 239000000155 melt Substances 0.000 claims description 13
- 238000000034 method Methods 0.000 abstract description 7
- 230000000630 rising effect Effects 0.000 abstract description 5
- 238000010438 heat treatment Methods 0.000 abstract description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000005496 eutectics Effects 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【発明の詳細な説明】
〔概 要〕
本体部の両側部分に対となる形で端子部を有してなるチ
ップ部品をプリント板に実装する際に適用されるチップ
部品の実装構造に関し、実装時におけるチップ部品の立
ち上がり現象や位置ズレ現象の防止を目的とし、
チップ部品のプリント板実装面の中央部分に、当該チッ
プ部品の実装に用いる半田よりも低温度で溶融する低融
点半田層を有してなる位置決めパッドを前記各端子部と
接触しない形で設けるとともに、前記プリント板のパッ
ド形成面には、該位置決めパッド対応に位置決めパター
ンを設けた構造。[Detailed Description of the Invention] [Summary] Regarding the mounting structure of a chip component that is applied when mounting a chip component having terminal portions in pairs on both sides of a main body portion on a printed board, In order to prevent chip components from rising or misaligning when the chip components are mounted, a low melting point solder layer that melts at a lower temperature than the solder used for mounting the chip components is provided in the center of the printed board mounting surface of the chip components. A positioning pad is provided in a form that does not contact each of the terminal portions, and a positioning pattern corresponding to the positioning pad is provided on the pad forming surface of the printed board.
本発明はチップコンデンサ或いはチップ抵抗等のチップ
部品をプリント板に半田付は実装する際に適用されるチ
ップ部品の実装構造（以下・実装構造と呼ぶ）に関する
。The present invention relates to a mounting structure (hereinafter referred to as a mounting structure) for chip components that is applied when mounting chip components such as a chip capacitor or a chip resistor on a printed board by soldering.
第２図（ａ）と伽）および（Ｃ）は従来のチップ部品の
実袋構造を示す図であって、（ａ）はチップ部品の構成
を示す斜視図、山）はプリント板の構成を示す要部側断
面図、（Ｃ）は実装後の状態を示す要部側断面図である
。Figures 2(a), 2), and 2(C) are diagrams showing the structure of a conventional chip component bag, where (a) is a perspective view showing the structure of the chip component, and crest) shows the structure of the printed board. (C) is a side sectional view of the main part showing the state after mounting.
第２図（ａ）に示すように、従来のチップ部品５０は、
本体部１と、本体部」の両側部分に対となる形で設けら
れた端子部３とによって構成されている。As shown in FIG. 2(a), the conventional chip component 50 is
It is composed of a main body part 1 and terminal parts 3 provided in pairs on both sides of the main body part.
また、このチップ部品５０が実装されるプリント板３０
は、第２図（ｂ）に示すように、前記チップ部品５０の
前記端子部３対応に設けられ、かつその面上に例えば錫
／鉛の共晶半田（溶融点は約１８３’Ｃ）で構成された
実装用半田１３が配置されてなるパッド１１を装備して
いる。前記チップ部品５０は、これをプリント板３０の
パッド１１上に第２図（Ｃ）に示すように位置決めした
後、これらをベーパ層（図示せず）内に収容して加熱す
る。この加熱によってパッド１１上に配置されている実
装用半田１３が溶け、チップ部品５０側の端子部３とプ
リント板３０側のパッド１１とが互いに前記実装用半田
１３によって半田付けされる。といったプロセスで実装
されることは周知である。Also, a printed board 30 on which this chip component 50 is mounted
As shown in FIG. 2(b), is provided corresponding to the terminal portion 3 of the chip component 50, and is coated with, for example, tin/lead eutectic solder (melting point is approximately 183'C) on its surface. It is equipped with a pad 11 on which a structured mounting solder 13 is placed. After the chip components 50 are positioned on the pads 11 of the printed board 30 as shown in FIG. 2(C), they are housed in a vapor layer (not shown) and heated. This heating melts the mounting solder 13 placed on the pad 11, and the terminal portion 3 on the chip component 50 side and the pad 11 on the printed board 30 side are soldered to each other by the mounting solder 13. It is well known that this process is implemented as follows.
チップ部品５０をプリント板３０のパッド１１上に位置
決めした状態でこれをペーパー槽内で加熱してチップ部
品５０をプリント板３０に実装するというこの方法は、
実装工程の進行中にチップ部品５０の位置や姿勢を制御
することができないため、当該チップ部品５０が第２図
（ｂ）に示すように矢印省力向に立ち上がったり（チッ
プの立ち上がり現象）、矢印伽方向、或いは矢印→方向
に移動したり（チップの位置ズレ現象）といった現象が
生じてもこれに対処できないという難点がある。この問
題に対処するため、接着剤を用いてチップ部品５０を予
めプリント板３０に接着する。或いはチップ部品５０の
上に錘を置いてチップ部品５０の位置移動を防止する。This method involves positioning the chip component 50 on the pad 11 of the printed board 30 and heating it in a paper bath to mount the chip component 50 on the printed board 30.
Since the position and orientation of the chip component 50 cannot be controlled during the mounting process, the chip component 50 may stand up in the labor-saving direction indicated by the arrow in FIG. 2(b) (chip rising phenomenon). There is a problem in that even if a phenomenon such as movement in the direction of the arrow or in the direction of the arrow → (chip misalignment phenomenon) occurs, it cannot be dealt with. To deal with this problem, the chip component 50 is bonded to the printed board 30 in advance using an adhesive. Alternatively, a weight is placed on the chip component 50 to prevent the chip component 50 from moving.
といった方法も実施されているが、接着による方法は接
着材の管理が難しいことから、管理工数が増大するとい
う問題点があり、また錘による方法は特殊な治具を必要
とするといった問題点があった。However, methods using adhesives have the problem of increasing management man-hours because it is difficult to manage the adhesive, and methods using weights require special jigs. there were.
本発明はこれらの問題点を解決するためになされたもの
である。The present invention has been made to solve these problems.
本発明によるチップ部品の実装構造は、第１図に示すよ
うに、チップ部品５のプリント板実装面６の中央部分に
、前記チップ部品５の実装に用いる半田１３よりも低温
度で溶融する低融点半田層８を有してなる位置決めパッ
ド７を前記各端子部３と接触しない形で設けるとともに
、前記プリント板１０のバンド形成面１４には、該位置
決めパッド７に対応するよう形成されてなる位置決めパ
ターン１５を設けた構成になっている。As shown in FIG. 1, the chip component mounting structure according to the present invention has a solder solder melted at a lower temperature than the solder 13 used for mounting the chip component 5 at the center of the printed board mounting surface 6 of the chip component 5. A positioning pad 7 having a melting point solder layer 8 is provided in such a manner that it does not come into contact with each of the terminal parts 3, and is formed on the band forming surface 14 of the printed board 10 so as to correspond to the positioning pad 7. It has a configuration in which a positioning pattern 15 is provided.
本発明による実装構造は、部品実装用の半田１３よりも
低温度で溶融する低融点半田層８が形成されてなる位置
決めパッド７をチップ部品５（１０）に設けると共に、
プリント板１０側のパッド形成面１４には前記位置決め
パッド７対応に位置決めパターン１５を設けた構成にな
っていることから、これを加熱した時は先ず低融点半田
層８が溶けてチップ部品５をその凝集力（表面張力）に
よってプリント板１０側のパッド１１上に正しく位置決
めする。従ってその後溶融する実装用半田１３によって
プリント板１０に実装されるチップ部品５は、先に溶融
した当該低融点半田層８の半田に引っ張られる形となっ
て前記パッド１１上に位置決めされるので、当該チップ
部品５の立ち上がり現象、或いは滑り現象の発生が抑止
される。In the mounting structure according to the present invention, the chip component 5 (10) is provided with a positioning pad 7 formed with a low melting point solder layer 8 that melts at a lower temperature than the solder 13 for component mounting.
Since the pad forming surface 14 on the printed board 10 side is configured to have a positioning pattern 15 corresponding to the positioning pad 7, when this is heated, the low melting point solder layer 8 first melts and the chip component 5 is heated. The cohesive force (surface tension) allows it to be correctly positioned on the pad 11 on the printed board 10 side. Therefore, the chip component 5 mounted on the printed circuit board 10 by the mounting solder 13 that melts thereafter is pulled by the solder of the low melting point solder layer 8 that melts first, and is positioned on the pad 11. The occurrence of a rising phenomenon or a slipping phenomenon of the chip component 5 is suppressed.
以下実施例図に基づいて本発明の詳細な説明する。 EMBODIMENT OF THE INVENTION The present invention will be described in detail below based on embodiment figures.
第１図（ａｌと（′ｂ）と（Ｃ）は本発明の一実施例を
示す図であって、（ａ）はチップ部品の構成を示す斜視
図、（１）ｌはプリント板の構成を示す要部側断面図、
（Ｃ）は実装後の状態を示す要部側断面図であるが、前
記第２図と同一部分には同一符号を付している。Figures 1 (al, 'b) and (C) are views showing one embodiment of the present invention, in which (a) is a perspective view showing the structure of a chip component, and (1)l is a perspective view showing the structure of a printed board. A side sectional view of the main part showing the
(C) is a side cross-sectional view of main parts showing the state after mounting, and the same parts as in FIG. 2 are given the same reference numerals.
本発明による実装構造は、第１図（ａ）と（ｂ）に示す
ように、チップ部品５のプリント板実装面６の中央部分
に、これをプリント板１０に実装する際に作動する実装
用半田１３よりも低温度で溶融する低融点半田層８を備
えた位置決めパッド７を各端子部３と接触しない形で設
けると共に、プリント板１０側のパッド形成面１４には
、該位置決めパッド７対応に位置決めパターン１５を設
けた構成になっている。なお、前記この決めパッド７は
、プリント板１０側のバッド１１或いは位置決めパター
ン１５等と同様にして形成される。また前記位置決めパ
ッド７上に配置される低融点半田層８は、約１８３°Ｃ
で溶融する実装用半田１３（錫／鉛の共晶半田）よりも
さらに低温度（約１１８’Ｃ）で溶融するインジウム／
錫の共晶半田で構成されている。As shown in FIGS. 1(a) and 1(b), the mounting structure according to the present invention is provided with a mounting device that operates when mounting the chip component 5 on the printed board 10 at the center of the printed board mounting surface 6 of the chip component 5. A positioning pad 7 having a low melting point solder layer 8 that melts at a lower temperature than the solder 13 is provided in a form that does not contact each terminal portion 3, and a pad forming surface 14 on the printed board 10 side is provided with a positioning pad 7 corresponding to the positioning pad 7. It has a configuration in which a positioning pattern 15 is provided on. The above-mentioned positioning pad 7 is formed in the same manner as the pad 11 or the positioning pattern 15 on the printed board 10 side. Furthermore, the low melting point solder layer 8 disposed on the positioning pad 7 has a temperature of about 183°C.
Indium/lead melts at a lower temperature (approximately 118'C) than mounting solder 13 (tin/lead eutectic solder) which melts at
It is composed of tin eutectic solder.
前記位置決めパフドアと位置決めパターン１５は、チッ
プ部品５の端子部３をプリント板１０のパッド１１上に
正しく位置決めする必要上、その形状寸法は互いに等し
くなるように形成される。The positioning puff door and the positioning pattern 15 are formed so that their shapes and dimensions are equal to each other in order to correctly position the terminal portion 3 of the chip component 5 on the pad 11 of the printed board 10.
以下この実装構造を適用してチップ部品をプリント仮に
実装する際の手順を述べる。The following describes the procedure for temporarily mounting chip components by applying this mounting structure.
■６位置決め、パッド７を下方に向けた形でチップ部品
５をプリント板１０のパッドｌｌ上に位置決めする゛。(6) Positioning: Position the chip component 5 on the pad 11 of the printed board 10 with the pad 7 facing downward.
■、各チップ部品５の位置決めが終了すると、今度はこ
れらを図示しないペーパー槽内に収容して加熱する。(2) Once the positioning of each chip component 5 is completed, they are placed in a paper tank (not shown) and heated.
■、この加熱によって先ず溶融温度の低い低融点半田層
８の半田が溶け、チップ部品５側の位置決めパッド７と
プリント板１０側の位置決めパターン１５は溶融状態と
なった低融点半田を介して機械的に結合される。(2) This heating first melts the solder in the low melting point solder layer 8, which has a low melting temperature, and the positioning pad 7 on the chip component 5 side and the positioning pattern 15 on the printed board 10 side are transferred to the machine via the molten low melting point solder. are combined.
■、ペーパー槽内の温度がさらに上昇すると、今度はプ
リント板１０側のパッド１１上に配置された実装用半田
１３が溶融する。この時、既に溶融している前記低融点
半田層８の低融点半田は、その凝集力によって、チップ
部品５側の位置決めパッド７をプリント板１０側の位置
決めパターン１５側へ矢印６方向に引っ張り込むように
誘導する。(2) When the temperature inside the paper tank further increases, the mounting solder 13 placed on the pad 11 on the printed board 10 side melts. At this time, the already melted low melting point solder of the low melting point solder layer 8 uses its cohesive force to pull the positioning pad 7 on the chip component 5 side toward the positioning pattern 15 side on the printed board 10 side in the direction of arrow 6. to guide you in this way.
■０位置決めパッド７が位置決めパターン１５上へ誘導
されたことによってチップ部品５側の端子部３はプリン
ト板１０例のパッド１１上に正確に、かつプリント板実
装面６とパッド形成面１４間の間隔が最小となる形で位
置決めされるので、チップ部品５の立ち上がり現象、或
いは位置ズレ現象（チップ部品５が矢印―方向酸いは矢
印→方向に移動する現象）が生じない。■0 Since the positioning pad 7 is guided onto the positioning pattern 15, the terminal portion 3 on the chip component 5 side is placed exactly on the pad 11 of the printed board 10, and between the printed board mounting surface 6 and the pad forming surface 14. Since the chip components 5 are positioned in such a manner that the interval is minimized, the rising phenomenon of the chip components 5 or the phenomenon of positional shift (the phenomenon in which the chip components 5 move in the direction of the arrow or in the direction of the arrow) does not occur.
本発明による実装構造はチップ部品５の位置決めパフド
ア上に配置された低融点半田層８の半田が先ず溶融して
チップ部品５を引っ張り込むようにしてプリント板１０
側のパッドｌｌ上に位置決めする構成になっている点に
その特徴がある。The mounting structure according to the present invention is such that the solder of the low melting point solder layer 8 disposed on the puff door for positioning the chip component 5 first melts and pulls the chip component 5 onto the printed board 10.
Its feature is that it is configured to be positioned on the side pad ll.
以上の説明から明らかなように、本発明による実装構造
は、チップ部品（１０）に低融点半田層を備えた位置決
めパッドを設け、プリント板（１０）に該位置決めパッ
ド対応に形成された位置決めパターンを設けるという簡
単な手段を講じることによってチップ部品を正確にプリ
ント板のパッド上に位置決めし得る構成になっているこ
とから、チップ部品実装時におけるチップ部品の立ち上
がり現象や位置ズレ現象を的確に防止することができる
。As is clear from the above description, in the mounting structure according to the present invention, a positioning pad provided with a low melting point solder layer is provided on the chip component (10), and a positioning pattern is formed on the printed board (10) corresponding to the positioning pad. The structure allows the chip components to be accurately positioned on the pads of the printed circuit board by taking the simple step of providing a pad, which accurately prevents the rise and misalignment of the chip components during chip component mounting. can do.
第１図（ａ）と山）と（Ｃ）は本発明の一実施例を示す
斜視図と要部側断面図、
第２図（ａ）と（ｂ）と（Ｃ）は従来の実装構造を示す
斜視図と要部側断面図である。
図において、１は本体部、
３は端子部、
５と５０はチップ部品、
６はプリント板実装面、
７は位置決めパッド、
８は低融点半田層、
１０と３０はプリント板、
１１はパッド、
１３は実装用半田、
１４はパッド形成面、
１５は位置決めパターン、
をそれぞれ示す。
（ｂ）
第１
図Figures 1 (a), crests) and (C) are a perspective view and a side sectional view of the main parts showing an embodiment of the present invention, and Figures 2 (a), (b) and (C) are conventional mounting structures. FIG. 2 is a perspective view and a side sectional view of main parts. In the figure, 1 is a main body part, 3 is a terminal part, 5 and 50 are chip components, 6 is a printed board mounting surface, 7 is a positioning pad, 8 is a low melting point solder layer, 10 and 30 are a printed board, 11 is a pad, 13 is solder for mounting, 14 is a pad forming surface, and 15 is a positioning pattern. (b) Figure 1
Claims (1)
有してなるチップ部品（５）をプリント板（１０）に実
装する際に適用される構造であって、 前記チップ部品（５）のプリント板実装面（６）の中央
部分に、当該チップ部品（５）の実装に用いる半田（１
３）よりも低温度で溶融する低融点半田層（８）を有し
てなる位置決めパッド（７）を前記各端子部（３）と接
触しない形で設けるとともに、前記プリント板（１０）
のパッド形成面（１４）には、該位置決めパッド（７）
対応に位置決めパターン（１５）を設けてなることを特
徴とするチップ部品の実装構造。[Claims] A structure applied when mounting a chip component (5) having terminal portions (3) in pairs on both sides of a main body portion (1) on a printed board (10). Solder (1) used for mounting the chip component (5) is placed in the center of the printed board mounting surface (6) of the chip component (5).
A positioning pad (7) having a low melting point solder layer (8) that melts at a lower temperature than that of the printed board (10) is provided in such a manner that it does not come into contact with each of the terminal parts (3).
The pad forming surface (14) is provided with the positioning pad (7).
A mounting structure for chip components, characterized in that a corresponding positioning pattern (15) is provided.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8645389A JPH02264496A (en) | 1989-04-04 | 1989-04-04 | Mounting structure of chip component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8645389A JPH02264496A (en) | 1989-04-04 | 1989-04-04 | Mounting structure of chip component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02264496A true JPH02264496A (en) | 1990-10-29 |
Family
ID=13887355
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8645389A Pending JPH02264496A (en) | 1989-04-04 | 1989-04-04 | Mounting structure of chip component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02264496A (en) |
-
1989
- 1989-04-04 JP JP8645389A patent/JPH02264496A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR910007103B1 (en) | Cast solder leads for leadless semiconductor circuits | |
| JPH02264496A (en) | Mounting structure of chip component | |
| JP2555720B2 (en) | Solder bump component mounting method | |
| JPS5935439A (en) | Mounting method on substrate of leadless chip carrier with bump | |
| JP3138779B2 (en) | How to mount chip components | |
| JP2648385B2 (en) | Method for manufacturing semiconductor device | |
| JP3681879B2 (en) | Electronic component soldering apparatus and method | |
| JPS63284890A (en) | Mounting method of electronic part | |
| JPH03196650A (en) | Flip chip bonding | |
| JPH05259631A (en) | Surface mounting of printed wiring board | |
| JPH02192792A (en) | Method of soldering electronic component with low thermal resistance | |
| JPH03289192A (en) | Soldering method for component on printed wiring board | |
| JP2546706B2 (en) | Jig for solder bump molding | |
| JP2002374060A (en) | Electronic circuit board | |
| JP3392562B2 (en) | Mounting method of semiconductor device | |
| JPH0391990A (en) | Bonding device for semiconductor device | |
| JPH04146688A (en) | Method of bonding electronic component | |
| JPS6367137A (en) | Superposition structure of board | |
| JPS63311732A (en) | Method of packaging semiconductor element | |
| JPH05235108A (en) | Manufacture of film carrier tape | |
| JPH06283568A (en) | Tool heating soldering method | |
| JPH03204950A (en) | Bonding of tape carrier | |
| JPH04184951A (en) | Semiconductor element mounting method | |
| JPH02121342A (en) | Film carrier | |
| JPH0429340A (en) | Method of mounting semiconductor device |