JPH0226273U - - Google Patents
Info
- Publication number
- JPH0226273U JPH0226273U JP10467088U JP10467088U JPH0226273U JP H0226273 U JPH0226273 U JP H0226273U JP 10467088 U JP10467088 U JP 10467088U JP 10467088 U JP10467088 U JP 10467088U JP H0226273 U JPH0226273 U JP H0226273U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- flat package
- package element
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011810 insulating material Substances 0.000 claims description 2
- 239000011247 coating layer Substances 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案に係る実装型電子部品の要部構
成例を示す斜視図、第２図は従来の実装型電子部
品の構成例を示す斜視図である。 １…プリント配線基板、２…フラツトパツケー
ジ型素子、２ａ…端子リード、３…耐熱性絶縁材
被覆層。
成例を示す斜視図、第２図は従来の実装型電子部
品の構成例を示す斜視図である。 １…プリント配線基板、２…フラツトパツケー
ジ型素子、２ａ…端子リード、３…耐熱性絶縁材
被覆層。
Claims (1)
- プリント配線基板と、このプリント配線基板の
表面所定位置に搭載実装されたフラツトパツケー
ジ素子とを具備し、前記フラツトパツケージ型素
子から延出している各端子リードを耐熱性絶縁材
で被覆して成ることを特徴とする実装型電子部品
。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10467088U JPH0226273U (ja) | 1988-08-08 | 1988-08-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10467088U JPH0226273U (ja) | 1988-08-08 | 1988-08-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0226273U true JPH0226273U (ja) | 1990-02-21 |
Family
ID=31336596
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10467088U Pending JPH0226273U (ja) | 1988-08-08 | 1988-08-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0226273U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014086496A (ja) * | 2012-10-22 | 2014-05-12 | Sansha Electric Mfg Co Ltd | 発熱部品実装回路基板 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6288398A (ja) * | 1985-10-15 | 1987-04-22 | 富士通株式会社 | フラツトパツケ−ジ形部品の半田付け方法 |
| JPS62118555A (ja) * | 1985-11-19 | 1987-05-29 | Oki Electric Ind Co Ltd | 集積回路パツケ−ジ |
-
1988
- 1988-08-08 JP JP10467088U patent/JPH0226273U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6288398A (ja) * | 1985-10-15 | 1987-04-22 | 富士通株式会社 | フラツトパツケ−ジ形部品の半田付け方法 |
| JPS62118555A (ja) * | 1985-11-19 | 1987-05-29 | Oki Electric Ind Co Ltd | 集積回路パツケ−ジ |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014086496A (ja) * | 2012-10-22 | 2014-05-12 | Sansha Electric Mfg Co Ltd | 発熱部品実装回路基板 |