JPH0225988B2 - - Google Patents
Info
- Publication number
- JPH0225988B2 JPH0225988B2 JP58111849A JP11184983A JPH0225988B2 JP H0225988 B2 JPH0225988 B2 JP H0225988B2 JP 58111849 A JP58111849 A JP 58111849A JP 11184983 A JP11184983 A JP 11184983A JP H0225988 B2 JPH0225988 B2 JP H0225988B2
- Authority
- JP
- Japan
- Prior art keywords
- target
- electromagnet
- current
- substrate
- discharge impedance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrodes Of Semiconductors (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
- Physical Vapour Deposition (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11184983A JPS605878A (ja) | 1983-06-23 | 1983-06-23 | スパツタリング装置の放電インピ−ダンス制御方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11184983A JPS605878A (ja) | 1983-06-23 | 1983-06-23 | スパツタリング装置の放電インピ−ダンス制御方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS605878A JPS605878A (ja) | 1985-01-12 |
JPH0225988B2 true JPH0225988B2 (enrdf_load_stackoverflow) | 1990-06-06 |
Family
ID=14571701
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11184983A Granted JPS605878A (ja) | 1983-06-23 | 1983-06-23 | スパツタリング装置の放電インピ−ダンス制御方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS605878A (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1088341A (ja) * | 1996-09-11 | 1998-04-07 | Anelva Corp | 低圧力放電スパッタ装置及びスパッタ制御方法 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008156708A (ja) * | 2006-12-25 | 2008-07-10 | Idemitsu Kosan Co Ltd | 透明導電膜の製造方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58110872A (ja) * | 1981-12-23 | 1983-07-01 | Hitachi Ltd | 真空排気装置 |
-
1983
- 1983-06-23 JP JP11184983A patent/JPS605878A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1088341A (ja) * | 1996-09-11 | 1998-04-07 | Anelva Corp | 低圧力放電スパッタ装置及びスパッタ制御方法 |
Also Published As
Publication number | Publication date |
---|---|
JPS605878A (ja) | 1985-01-12 |
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