JPH0225987B2 - - Google Patents
Info
- Publication number
- JPH0225987B2 JPH0225987B2 JP19010286A JP19010286A JPH0225987B2 JP H0225987 B2 JPH0225987 B2 JP H0225987B2 JP 19010286 A JP19010286 A JP 19010286A JP 19010286 A JP19010286 A JP 19010286A JP H0225987 B2 JPH0225987 B2 JP H0225987B2
- Authority
- JP
- Japan
- Prior art keywords
- target
- backing plate
- reaction
- sputtering device
- sputtering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19010286A JPS6345368A (ja) | 1986-08-13 | 1986-08-13 | スパツタ装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19010286A JPS6345368A (ja) | 1986-08-13 | 1986-08-13 | スパツタ装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6345368A JPS6345368A (ja) | 1988-02-26 |
JPH0225987B2 true JPH0225987B2 (enrdf_load_stackoverflow) | 1990-06-06 |
Family
ID=16252409
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19010286A Granted JPS6345368A (ja) | 1986-08-13 | 1986-08-13 | スパツタ装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6345368A (enrdf_load_stackoverflow) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2756158B2 (ja) * | 1989-10-20 | 1998-05-25 | 東京エレクトロン株式会社 | スパッタ装置 |
JPH0774436B2 (ja) * | 1990-09-20 | 1995-08-09 | 富士通株式会社 | 薄膜形成方法 |
US5286361A (en) * | 1992-10-19 | 1994-02-15 | Regents Of The University Of California | Magnetically attached sputter targets |
KR101040076B1 (ko) * | 2006-06-29 | 2011-06-09 | Jx닛코 닛세끼 킨조쿠 가부시키가이샤 | 스퍼터링 타겟트/배킹 플레이트 접합체 |
KR102720427B1 (ko) * | 2018-12-07 | 2024-10-23 | 에스케이하이닉스 주식회사 | 스퍼터링 타겟 및 그 제조 방법 |
-
1986
- 1986-08-13 JP JP19010286A patent/JPS6345368A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6345368A (ja) | 1988-02-26 |
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