JPH02250392A - 配線基板の製造方法 - Google Patents
配線基板の製造方法Info
- Publication number
- JPH02250392A JPH02250392A JP7042589A JP7042589A JPH02250392A JP H02250392 A JPH02250392 A JP H02250392A JP 7042589 A JP7042589 A JP 7042589A JP 7042589 A JP7042589 A JP 7042589A JP H02250392 A JPH02250392 A JP H02250392A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- thick film
- electrode part
- electrode
- electrode section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 13
- 238000000034 method Methods 0.000 claims abstract description 24
- 238000007650 screen-printing Methods 0.000 claims abstract description 11
- 239000012298 atmosphere Substances 0.000 claims abstract description 10
- 239000004065 semiconductor Substances 0.000 claims description 15
- 238000010304 firing Methods 0.000 claims description 9
- 239000004020 conductor Substances 0.000 abstract description 12
- 230000000694 effects Effects 0.000 abstract description 6
- 238000009792 diffusion process Methods 0.000 abstract description 2
- 239000011261 inert gas Substances 0.000 abstract 2
- 238000007796 conventional method Methods 0.000 abstract 1
- 239000010408 film Substances 0.000 description 26
- 239000000758 substrate Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000007747 plating Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 244000025254 Cannabis sativa Species 0.000 description 1
- 241000287828 Gallus gallus Species 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7042589A JPH02250392A (ja) | 1989-03-24 | 1989-03-24 | 配線基板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7042589A JPH02250392A (ja) | 1989-03-24 | 1989-03-24 | 配線基板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02250392A true JPH02250392A (ja) | 1990-10-08 |
| JPH0558678B2 JPH0558678B2 (US06589383-20030708-C00041.png) | 1993-08-27 |
Family
ID=13431113
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7042589A Granted JPH02250392A (ja) | 1989-03-24 | 1989-03-24 | 配線基板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02250392A (US06589383-20030708-C00041.png) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04316394A (ja) * | 1991-04-15 | 1992-11-06 | Ngk Insulators Ltd | セラミック厚膜配線回路基板の製造方法 |
| US6020048A (en) * | 1996-10-02 | 2000-02-01 | Denso Corporation | Thick film circuit board and method of forming wire bonding electrode thereon |
| US6384344B1 (en) | 1995-06-19 | 2002-05-07 | Ibiden Co., Ltd | Circuit board for mounting electronic parts |
| USRE44251E1 (en) | 1996-09-12 | 2013-06-04 | Ibiden Co., Ltd. | Circuit board for mounting electronic parts |
-
1989
- 1989-03-24 JP JP7042589A patent/JPH02250392A/ja active Granted
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04316394A (ja) * | 1991-04-15 | 1992-11-06 | Ngk Insulators Ltd | セラミック厚膜配線回路基板の製造方法 |
| US6384344B1 (en) | 1995-06-19 | 2002-05-07 | Ibiden Co., Ltd | Circuit board for mounting electronic parts |
| USRE44251E1 (en) | 1996-09-12 | 2013-06-04 | Ibiden Co., Ltd. | Circuit board for mounting electronic parts |
| US6020048A (en) * | 1996-10-02 | 2000-02-01 | Denso Corporation | Thick film circuit board and method of forming wire bonding electrode thereon |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0558678B2 (US06589383-20030708-C00041.png) | 1993-08-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |