JPH0224568U - - Google Patents

Info

Publication number
JPH0224568U
JPH0224568U JP10276388U JP10276388U JPH0224568U JP H0224568 U JPH0224568 U JP H0224568U JP 10276388 U JP10276388 U JP 10276388U JP 10276388 U JP10276388 U JP 10276388U JP H0224568 U JPH0224568 U JP H0224568U
Authority
JP
Japan
Prior art keywords
holes
inner layer
branch
foot
patterns
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10276388U
Other languages
English (en)
Other versions
JPH0648906Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988102763U priority Critical patent/JPH0648906Y2/ja
Publication of JPH0224568U publication Critical patent/JPH0224568U/ja
Application granted granted Critical
Publication of JPH0648906Y2 publication Critical patent/JPH0648906Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)

Description

【図面の簡単な説明】
第１図は本考案の実施例を示す透視図、第２図
は従来例の透視図、第３図は他の従来例の透視図
である。 ６……ＬＳＩ、７……リード、１０……基板、
１１，１４……フツトパターン、１２，１３，１
５，１６……枝パターン、１８，１９……スルー
ホール、２０……内層パターン、Ｌ１，Ｌ２……
面である。

Claims (1)

    【実用新案登録請求の範囲】
  1. 表面Ｌ２から裏面Ｌ１に貫通する複数のスルー
    ホール１８，１９と、これらスルーホール１８，
    １９同士を内層で接続する内層パターン２０と、
    表面Ｌ２及び裏面Ｌ１に設けられ前記スルーホー
    ル１８，１９と接続されるフツトパターン１１，
    １４とを備えた多層基板１０において、前記フツ
    トパターン１１，１４と前記スルーホール１８，
    １９とを分岐して接続する枝パターン１２，１３
    ，１５，１６を設けたことを特徴とする多層基板
    のパターン構造。
JP1988102763U 1988-08-04 1988-08-04 多層基板のパターン構造 Expired - Lifetime JPH0648906Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988102763U JPH0648906Y2 (ja) 1988-08-04 1988-08-04 多層基板のパターン構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988102763U JPH0648906Y2 (ja) 1988-08-04 1988-08-04 多層基板のパターン構造

Publications (2)

Publication Number Publication Date
JPH0224568U true JPH0224568U (ja) 1990-02-19
JPH0648906Y2 JPH0648906Y2 (ja) 1994-12-12

Family

ID=31332972

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988102763U Expired - Lifetime JPH0648906Y2 (ja) 1988-08-04 1988-08-04 多層基板のパターン構造

Country Status (1)

Country Link
JP (1) JPH0648906Y2 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8222540B2 (en) 2009-05-14 2012-07-17 Fujitsu Limited Printed wiring board and electronic-component package

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61131497A (ja) * 1984-11-29 1986-06-19 富士通株式会社 多層プリント基板
JPS61114880U (ja) * 1984-12-28 1986-07-19

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61131497A (ja) * 1984-11-29 1986-06-19 富士通株式会社 多層プリント基板
JPS61114880U (ja) * 1984-12-28 1986-07-19

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8222540B2 (en) 2009-05-14 2012-07-17 Fujitsu Limited Printed wiring board and electronic-component package

Also Published As

Publication number Publication date
JPH0648906Y2 (ja) 1994-12-12

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