JPH02234478A - Light emitting diode - Google Patents
Light emitting diodeInfo
- Publication number
- JPH02234478A JPH02234478A JP1053888A JP5388889A JPH02234478A JP H02234478 A JPH02234478 A JP H02234478A JP 1053888 A JP1053888 A JP 1053888A JP 5388889 A JP5388889 A JP 5388889A JP H02234478 A JPH02234478 A JP H02234478A
- Authority
- JP
- Japan
- Prior art keywords
- led chip
- lead frame
- reflective
- light emitting
- emitting diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims abstract description 15
- 229920005989 resin Polymers 0.000 claims abstract description 15
- 238000000465 moulding Methods 0.000 claims abstract description 6
- 238000000034 method Methods 0.000 abstract 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Led Device Packages (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、発光ダイオードチップから出射する光を該発
光ダイオードチップの周辺に設けられた凹状の反射面に
より反射させて、発光効率を高めた発光ダイオードに関
するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention improves luminous efficiency by reflecting light emitted from a light emitting diode chip by a concave reflecting surface provided around the light emitting diode chip. It relates to light emitting diodes.
従来、このような発光ダイオード（以下、ＬＥＤという
）は、例えば第２図に示すように構成されている。即ち
、第２図において、ＬＥＤ １は、実質的に上下に平行
に延びる二本のリードフレーム２，３．ｑ，該リードフ
レームのうち一方のリードフレーム２の拡大された上端
面２ａに取り付けられているＬＥＤチップ４と、このＬ
ＥＤチツプ４及びリードフレーム２．３の上端領域を覆
うように透明樹脂モールドにより成形されたレンズ５と
から構成されている。Conventionally, such a light emitting diode (hereinafter referred to as LED) has been configured, for example, as shown in FIG. 2. That is, in FIG. 2, the LED 1 consists of two lead frames 2, 3 . . . which extend substantially vertically in parallel. q, the LED chip 4 attached to the enlarged upper end surface 2a of one of the lead frames 2, and this L
It consists of an ED chip 4 and a lens 5 molded with a transparent resin so as to cover the upper end area of the lead frame 2.3.
この場合、リードフレーム２の上端面２ａは、第２図に
示すように、例えば放物面の如き凹状部分２ｂとして形
成されており、上記ＬＥＤチップ４は、この凹状部分２
ｂの底部に導電性接着剤等により固定され且つ該リード
フレーム２と電気的に接続されていると共に、他方のリ
ードフレーム３の上端に対して金ワイヤ６にてワイヤボ
ンディングされている。In this case, the upper end surface 2a of the lead frame 2 is formed as a concave portion 2b such as a paraboloid, for example, as shown in FIG.
It is fixed to the bottom of the lead frame 2 with a conductive adhesive or the like and is electrically connected to the lead frame 2, and wire-bonded to the upper end of the other lead frame 3 with a gold wire 6.
これにより、二つのリードフレーム２．３の下方のリー
ド部（図示せず）を介して該Ｌ Ｅ Ｄチップ４に給電
が行なわれたとき、このＬＥＤチップ４が発光し、この
ときＬＥＤチップ４から出射した光のうち凹状部分２ｂ
に入射した光が、この凹状部分２ｂにより反射されてほ
ぼ上方へ向かって進行することにより、上記ＬＥＤＩの
発光効率が高められている。As a result, when power is supplied to the LED chip 4 through the lower lead portions (not shown) of the two lead frames 2.3, the LED chip 4 emits light. The concave portion 2b of the light emitted from
The light incident on the concave portion 2b is reflected by the concave portion 2b and travels substantially upward, thereby increasing the light emitting efficiency of the LEDI.
しかしながら、このようなＬＥＤ １においては、リー
ドフレーム３自体が比較的小さいことから、その上端面
は極めて微小であり、この上端面に反射面を構成する凹
状部分２ｂを形成することは、非常に作業が面倒となり
、生産効率が低下すると共に、その精度もあまり高くす
ることは困難であり、製造コストが高くなってしまうと
いう問題があった．
本発明は、以上の点に鑑み、ＬＥＤチップのための反射
面が簡単且つ高精度でしかも低コストで製造され得るよ
うにした、ＬＥＤを提供することを目的としている．
〔問題点を解決するための手段〕
上記目的は、本発明によれば、実質的に上下に平行に延
びる二本のリードフレームと、このリードフレームの一
方の上端面に取り付けられ且つその上面が他方のリード
フレームの上端に対してワイヤボンディングされている
ＬＥＤチップとを含むＬＥＤにおいて、先ず各リードフ
レームの上端領域でＬＥＤチップから出射する光を上方
に向かって反射させるための反射面を有する反射部を樹
脂により一体成形し、続いてこのリードフレームの上端
面にＬＥＤチップを取り付けて該ＬＥＤチップの上面を
他方のリードフレームの上面に対してワイヤボンディン
グした後、ｉＬＥＤチップ及び反射部の上面を覆うよう
に樹脂モールドによりレンズを成形するように構成した
ことによって達成される。However, in such an LED 1, since the lead frame 3 itself is relatively small, its upper end surface is extremely small, and it is extremely difficult to form the concave portion 2b constituting the reflective surface on this upper end surface. There were problems in that the work became troublesome, production efficiency decreased, and it was difficult to increase the accuracy too much, resulting in high manufacturing costs. SUMMARY OF THE INVENTION In view of the above points, an object of the present invention is to provide an LED in which a reflective surface for an LED chip can be easily manufactured with high precision and at low cost. [Means for Solving the Problems] According to the present invention, the above-mentioned object is achieved by providing two lead frames extending substantially vertically and parallel to each other, the lead frame being attached to the upper end surface of one of the lead frames, and the upper surface thereof being attached to the upper end surface of one of the lead frames. In an LED including an LED chip that is wire-bonded to the upper end of the other lead frame, first, a reflective surface is provided at the upper end area of each lead frame to reflect the light emitted from the LED chip upward. Then, an LED chip is attached to the upper end surface of this lead frame, and the upper surface of the LED chip is wire-bonded to the upper surface of the other lead frame, and then the iLED chip and the upper surface of the reflective section are This is achieved by configuring the lens to be molded using a resin mold so as to cover the lens.
この発明によれば、ＬＥＤチップから出射する光を上方
へ導くための反射面が、互いに所定間隔に保持された二
本のリードフレームに対して反゛射部を樹脂により一体
成形することにより、形成されるようにしているので、
該反射面は非常に節単に且つ高精度で形成されることに
なり、従ってＬＥＤ全体が低コストで製造され得る。According to this invention, the reflective surface for guiding the light emitted from the LED chip upward is formed by integrally molding the reflective part with resin to two lead frames held at a predetermined distance from each other. Because it is made to form,
The reflective surface will be formed very simply and with high precision, so the entire LED can be manufactured at low cost.
以下、図面に示した実施例に基づいて本発明をさらに説
明する．
第１図は本発明によるＬＥＤの一実施例を示しており、
ＬＥＤＩＯは、実質的に上下に平行に延びる二本のリー
ドフレーム１１．１２と、これらリードフレームのうち
一方のリードフレーム１１の拡大された上端面１１ａに
取り付けられるＬＥＤチップ１３と、該リードフレーム
１１．１２の上端領域で該リードフレーム１１．１２に
対して樹脂、例えば反射率の高い白色の樹脂により一体
成形され且つ上記一方のリードフレーム１１の上端面１
１ａに取り付けられるＬＥＤチップ１３からの光を反射
させて上方へ導くような、例えば球面状の反射面１４ａ
を有する反射部１４と、前記ＬＥＤチップ１３及びリー
ドフレーム１１．１２の上端領域を覆うように上記反射
部１４の上方に透明樹脂の樹脂モールドにより成形され
たレンズ１５とから構成されている。The present invention will be further explained below based on embodiments shown in the drawings. FIG. 1 shows an embodiment of the LED according to the present invention,
LEDIO includes two lead frames 11 and 12 extending substantially vertically in parallel, an LED chip 13 attached to the enlarged upper end surface 11a of one of the lead frames 11, and the lead frame 11. .12 is integrally molded with the lead frame 11.12 using a resin, for example, a white resin with high reflectance, and the upper end surface 1 of the one lead frame 11.
For example, a spherical reflective surface 14a that reflects the light from the LED chip 13 attached to the LED chip 1a and guides it upward.
and a lens 15 molded with a transparent resin above the reflecting section 14 so as to cover the upper end areas of the LED chip 13 and lead frame 11.12.
この場合、リードフレーム１１の上端面１１ａは、第１
図に示すように、単に平面として形成されており、上記
ＬＥＤチップ１３は、この上端面１１ａ上に導電性接着
剤等により固定され且つ該リードフレーム１１と電気的
に接続されているとともに、他方のリードフレームｌ２
の上端に対して金ワイヤ１６等にてワイヤボンディング
されている．
゜本発明によるＬＥＤは以上のように構成されており、
ＬＥＤＩＯを製造する場合には、先ず二本のリードフレ
ーム１１．１２をほぼ平行に上下方向に延びるように適
宜位置合わせして、該リードフレーム１１．１２の上端
領域に反射部ｌ４を樹脂により一体成形する。続いてリ
ードフレーム１ｌの上端面にＬＥＤチップ１３を載置し
て導電性接着剤等により取付け固定することにより、リ
ードフレームｌ１に電気的に接続すると共に、該ＬＥＤ
チップｌ３の上面を他方のリードフレーム１２の上端に
対して例えば金ワイヤ１６等によりワイヤボンディング
することにより、リードフレーム１２に電気的に接続す
る．その後、ｉｌ Ｌ Ｅ Ｄチップ１３及び反射部１
４の上面を覆うように透明樹脂により樹脂モールドして
レンズ１５を形成し、かくしてＬＥＤＩＯが完成する。In this case, the upper end surface 11a of the lead frame 11
As shown in the figure, the LED chip 13 is simply formed as a flat surface, and the LED chip 13 is fixed on the upper end surface 11a with a conductive adhesive or the like and is electrically connected to the lead frame 11, and the other side. lead frame l2
It is wire-bonded to the upper end of the board using gold wire 16 or the like.゜The LED according to the present invention is configured as described above,
When manufacturing LEDIO, first, the two lead frames 11.12 are appropriately aligned so that they extend in the vertical direction almost parallel to each other, and the reflective part l4 is integrated with resin in the upper end area of the lead frames 11.12. Shape. Next, the LED chip 13 is placed on the upper end surface of the lead frame 1l and fixed with a conductive adhesive or the like to electrically connect to the lead frame 11 and to connect the LED chip 13 to the lead frame 1l.
The upper surface of the chip 13 is electrically connected to the other lead frame 12 by wire bonding to the upper end of the other lead frame 12 using, for example, a gold wire 16. After that, the ill L E D chip 13 and the reflective part 1
A lens 15 is formed by resin molding with a transparent resin so as to cover the upper surface of the LEDIO, thus completing the LEDIO.
このように構成されたＬＥＤＩＯは、二つのリードフレ
ーム１１．１２の下方のリード部（図示せず）を介して
前記ＬＥＤチップ１３に給電が行なわれると、該Ｌ Ｅ
Ｄチップｌ３が発光する．このときＬＥＤチップ１３
から出射した光は、その一部が直接に上方へ出射すると
ともに、他の一部が反射部１４の反射面１４ａに入射し
、該反射面１４ａにより反射されて第１図に矢印で示す
ようにほぼ上方へ向かって進行することから、従来の反
射面を備えたＬＥＤと同様に発光効率が高められている
．
〔発明の効果〕
以上述べたように、本発明によれば、実質的に上下に平
行に延びる二本のリードフレームと、該リードフレーム
の一方の上端面に取り付けられ且つその上面が他方のリ
ードフレームの上端に対してワイヤポンディングされて
いるＬＥＤチップとを有するＬＥＤにおいて、上記各リ
ードフレームの上端領域でＬＥＤチップから出射する光
を上方に向かって反射させるための反射面を有する樹脂
製の反射部を一体成形し、さらに上記一方のリードフレ
ームの上端面にＬＥＤチップを取り付けて該ＬＥＤチッ
プの上面を他方のリードフレームの上面に対してワイヤ
ボンディングすると共に、該ＬＥＤチップ及び反射部の
上面を覆うように樹脂モールドによりレンズを成形する
ことによりＬＥＤを構成したから、ＬＥＤチップから出
射する光を上方へ導くための反射面を、互いに所定間隔
に保持された二本のリードフレームに対して反射部を樹
脂により一体成形することにより形成しているので、こ
の反射面は非常に簡単に且つ高精度で形成されることに
なり、従ってＬＥＤ全体が低コストで製造され得る．
かくして、本発明によれば、ＬＥＤチップから出射され
る光を効率良く取り出すための反射面が非常に簡単にし
かも高精度で形成され得ることにより、低コストで製造
される極めて優れたＬＥＤが提供され得る．In the LEDIO configured in this way, when power is supplied to the LED chip 13 through the lower lead portions (not shown) of the two lead frames 11.12, the LED
D-chip l3 emits light. At this time, the LED chip 13
A part of the light emitted from the is emitted directly upward, and the other part enters the reflective surface 14a of the reflective section 14, and is reflected by the reflective surface 14a, as shown by the arrow in FIG. Because the light travels almost upward, the light emitting efficiency is improved, similar to conventional LEDs with reflective surfaces. [Effects of the Invention] As described above, according to the present invention, there are two lead frames extending substantially vertically in parallel, and the upper end surface of one of the lead frames is attached to the upper end surface of the other lead frame. In an LED having an LED chip that is wire-bonded to the upper end of the frame, a resin-made LED having a reflective surface for upwardly reflecting light emitted from the LED chip at the upper end area of each lead frame. The reflective section is integrally molded, and an LED chip is attached to the upper end surface of one of the lead frames, and the upper surface of the LED chip is wire-bonded to the upper surface of the other lead frame. Since the LED was constructed by molding a lens with a resin mold to cover the Since the reflective portion is formed by integrally molding resin, this reflective surface can be formed very easily and with high precision, and therefore the entire LED can be manufactured at low cost. Thus, according to the present invention, a reflective surface for efficiently extracting light emitted from an LED chip can be formed very easily and with high precision, thereby providing an extremely excellent LED that can be manufactured at low cost. It can be done.
第１図は本発明によるＬＥＤの一実施例の断面図である
。
第２図は従来のＬＥＤの一例を示す断面図である．
１０・・・ＬＥＤ； １１，１２・・・リードフレー
ム；射部； １４ａ・・・反射面； １５・・・レンズ
： ｌ６・・・金ワイヤ．
特許出願人：スタンレー電気株式会社
代 理 人：弁理士 平 山 一 幸
同 ：弁理士 岡崎信太郎FIG. 1 is a cross-sectional view of an embodiment of an LED according to the present invention. Figure 2 is a sectional view showing an example of a conventional LED. 10... LED; 11, 12... Lead frame; radiation part; 14a... Reflective surface; 15... Lens: l6... Gold wire. Patent applicant: Stanley Electric Co., Ltd. Representative: Patent attorney Hajime Hirayama: Patent attorney Shintaro Okazaki
Claims (1)
ムと、該リードフレームの一方の上端面に取り付けられ
且つその上面が他方のリードフレームの上端に対してワ
イヤボンディングされている発光ダイオードチップとを
含む発光ダイオードにおいて、上記各リードフレームの
上端領域で発光ダイオードチップから出射する光を上方
に向かって反射させるための反射面を有する反射部を樹
脂成形により形成すると共に、該リードフレームの上端
面に発光ダイオードチップを取り付けて該発光ダイオー
ドチップの上面を他方のリードフレームの上面に対して
ワイヤボンディングし、該発光ダイオードチップ及び反
射部の上面を覆うように樹脂モールドによりレンズを成
形することにより構成されていることを特徴とする、発
光ダイオード。(1) Two lead frames that extend substantially vertically in parallel, and a light emitting diode chip that is attached to the upper end surface of one of the lead frames and whose upper surface is wire-bonded to the upper end of the other lead frame. A light emitting diode comprising: a reflective portion having a reflective surface for upwardly reflecting light emitted from the light emitting diode chip in the upper end region of each of the lead frames; By attaching a light emitting diode chip to the end face, wire bonding the top surface of the light emitting diode chip to the top surface of the other lead frame, and molding a lens with a resin mold so as to cover the top surface of the light emitting diode chip and the reflective part. A light emitting diode comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1053888A JPH02234478A (en) | 1989-03-08 | 1989-03-08 | Light emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1053888A JPH02234478A (en) | 1989-03-08 | 1989-03-08 | Light emitting diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02234478A true JPH02234478A (en) | 1990-09-17 |
Family
ID=12955270
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1053888A Pending JPH02234478A (en) | 1989-03-08 | 1989-03-08 | Light emitting diode |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02234478A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0621085U (en) * | 1992-02-26 | 1994-03-18 | 品川商工株式会社 | Indicator light cover |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS494572B1 (en) * | 1970-11-16 | 1974-02-01 | ||
| JPS5866372A (en) * | 1981-10-16 | 1983-04-20 | Toshiba Corp | Light emitting diode |
| JPS6234469U (en) * | 1985-08-15 | 1987-02-28 | ||
| JPS62224986A (en) * | 1986-03-27 | 1987-10-02 | Toyoda Gosei Co Ltd | Led lamp and manufacture thereof |
-
1989
- 1989-03-08 JP JP1053888A patent/JPH02234478A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS494572B1 (en) * | 1970-11-16 | 1974-02-01 | ||
| JPS5866372A (en) * | 1981-10-16 | 1983-04-20 | Toshiba Corp | Light emitting diode |
| JPS6234469U (en) * | 1985-08-15 | 1987-02-28 | ||
| JPS62224986A (en) * | 1986-03-27 | 1987-10-02 | Toyoda Gosei Co Ltd | Led lamp and manufacture thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0621085U (en) * | 1992-02-26 | 1994-03-18 | 品川商工株式会社 | Indicator light cover |
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