JPH04162783A - Light emitting element - Google Patents
Light emitting elementInfo
- Publication number
- JPH04162783A JPH04162783A JP2289398A JP28939890A JPH04162783A JP H04162783 A JPH04162783 A JP H04162783A JP 2289398 A JP2289398 A JP 2289398A JP 28939890 A JP28939890 A JP 28939890A JP H04162783 A JPH04162783 A JP H04162783A
- Authority
- JP
- Japan
- Prior art keywords
- recess
- light emitting
- light
- emitting element
- led chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims abstract description 15
- 229920005989 resin Polymers 0.000 claims abstract description 15
- 230000032258 transport Effects 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 230000005855 radiation Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は発光ダイオード（ＬＥＤ）のような発光素子に
関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to light emitting devices such as light emitting diodes (LEDs).
ＬＥＤチップの発光を効果的に外部に放射するための技
術として、例えば特開昭６２−１２８５７６号公報のも
のが知られている。ここでは、ベースの上面にすりばち
状の凹部が形成され、ここにＬＥＤチップがマウントさ
れる。すると、ＬＥＤチップから側方に放射された光は
、凹部の側壁で反射されて前方（上方）に放射される。As a technique for effectively emitting light emitted from an LED chip to the outside, a technique disclosed in, for example, Japanese Patent Application Laid-Open No. 128576/1983 is known. Here, a dovetail-shaped recess is formed on the upper surface of the base, and the LED chip is mounted here. Then, the light emitted laterally from the LED chip is reflected by the side wall of the recess and emitted forward (upward).
しかし、この型の素子では、側方放射光は、四部のサイ
ズが大きくなる程、多くなってしまうので、発光素子を
用いる測光装置の作動上の障害となる。However, in this type of element, the side emitted light increases as the size of the four parts increases, and this becomes an obstacle to the operation of a photometric device using the light emitting element.
上記従来技術においては、側方への放射光を減少させる
ために、凹部のサイズをＬＥＤチ・ツブのサイズを限度
として小さくすることも考えられる。In the above-mentioned conventional technology, in order to reduce the sideward radiation, it is conceivable to reduce the size of the recess to the size of the LED chip.
しかし、このようにすると、ＬＥＤチップのマウントが
難しくなる。また、ＬＥＤチップのサイズを変更すると
、それに合せて凹部のサイズを変更することが必要にな
り、多品種少量生産の要請に合致しない。However, this makes it difficult to mount the LED chip. Furthermore, if the size of the LED chip is changed, it becomes necessary to change the size of the concave portion accordingly, which does not meet the requirements for high-mix, low-volume production.
本発明は、かかる従来技術の欠点を解決することを課題
としている。The present invention aims to solve the drawbacks of such prior art.
本発明に係る発光素子は、上面に凹部が設けられたベー
スと、凹部の略中央に配設された発光素子チップと、こ
の発光素子チップの周囲の凹部内に配設された遮光部材
とを備える。A light emitting element according to the present invention includes a base having a recess on its upper surface, a light emitting element chip disposed approximately in the center of the recess, and a light shielding member disposed within the recess around the light emitting element chip. Be prepared.
本発明の構成によれば、発光素子チップ周囲の凹部内に
遮光部材が配設されるので、凹部および発光素子チップ
のサイズにかかわりなく、発光素子チップの側面からの
光放射を阻止できる。また、凹部の深さを発光素子チッ
プの厚さ以下とし、更に凹溝を設けることで、樹脂を流
し込むことか容易になり、かつ発光素子チップの上面に
遮光部材が及ぶのを阻止できる。According to the configuration of the present invention, since the light shielding member is disposed in the recess around the light emitting element chip, light emission from the side surface of the light emitting element chip can be blocked regardless of the size of the recess and the light emitting element chip. Further, by making the depth of the recess less than the thickness of the light emitting element chip and further providing a groove, resin can be poured easily and the light shielding member can be prevented from reaching the upper surface of the light emitting element chip.
以下、添付図面を参照して本発明の詳細な説明する。 Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.
第１図は実施例に係る発光素子を示し、同図（ａ）は一
部を断面で示した側面図、同図（ｂ）は遮光部材を形成
する以前の発光素子の上面斜視図である。図示の通り、
底面に２本のリード端子１が設けられたベース２の上面
には、すりばち状の四部３とこれに連結する長方形状の
凹溝４が形成され、凹部３の中央にはＬＥＤチップ５が
固設されている。そして、凹部３および凹溝４には、遮
光性樹脂を流し込んで硬化させた遮光部材６が設けられ
ている。このため、ＬＥＤチップ５はその上面のみが露
出し、発光部のサイズは実質的に小さくなっている。な
お、ボンディングワイヤなどの図示は省略しである。FIG. 1 shows a light emitting device according to an example, and FIG. 1(a) is a side view showing a part in cross section, and FIG. 1(b) is a top perspective view of the light emitting device before forming a light shielding member. . As shown,
On the top surface of the base 2, which has two lead terminals 1 on the bottom surface, there are formed four corner-shaped parts 3 and a rectangular groove 4 connected thereto. It is set up. The recess 3 and the groove 4 are provided with a light shielding member 6 in which a light shielding resin is poured and hardened. Therefore, only the upper surface of the LED chip 5 is exposed, and the size of the light emitting part is substantially reduced. Note that illustration of bonding wires and the like is omitted.
本実施例の発光素子によれば、ＬＥＤチップ５の側面か
らの放射光は全て遮光部材６て阻止されるので、光は上
方にのみ放射される。また、実施例ではＬＥＤチップ５
の厚さが四部３の深さ以上になっているので、遮光部材
６がＬＥＤチップ５の上面にまで及ぶことはなくなる。According to the light emitting device of this embodiment, all the light emitted from the side surface of the LED chip 5 is blocked by the light shielding member 6, so that the light is emitted only upward. In addition, in the embodiment, the LED chip 5
Since the thickness of the light shielding member 6 is equal to or greater than the depth of the four parts 3, the light shielding member 6 does not extend to the upper surface of the LED chip 5.
また、凹部３に連結して凹溝４が設けられているので、
ＬＥＤチップ５をマウントした後に凹溝４に流動性の高
い樹脂を流し込めば、ＬＥＤチップ５の周囲の凹部３の
内部は樹脂で満たされる。従って、これを硬化すること
で、第１図（ａ）の構造を実現できる。In addition, since the groove 4 is provided in connection with the groove 3,
If a highly fluid resin is poured into the groove 4 after mounting the LED chip 5, the inside of the recess 3 around the LED chip 5 is filled with the resin. Therefore, by curing this, the structure shown in FIG. 1(a) can be realized.
第２図は上記実施例を変形した発光素子の要部を、断面
図にて示している。FIG. 2 shows a main part of a light emitting device modified from the above embodiment in a sectional view.
同図（ａ）は、ＬＥＤチップ５の周囲の凹部３内に充填
する樹脂の量を条目にし、遮光部材６を盛り上った形状
とした発光素子を示している。このようにすれば、側方
への放射光を更に効率よく阻止できる。同図（ｂ）は、
充填する樹脂を透光性にすると共に、凹部３の側壁およ
び透光性硬化樹脂６１の上面に反射膜６２を形成したも
のである。このようにすれば、ＬＥＤチップ５の側面か
らの放射光は、反射膜６２で反射されてＬＥＤチップ５
に戻り、結局は上方に放射される。従って、放射効率の
向上が可能になる。FIG. 5A shows a light emitting element in which the amount of resin filled in the recess 3 around the LED chip 5 is arranged in stripes, and the light shielding member 6 is formed in a raised shape. In this way, it is possible to more efficiently prevent light from being emitted to the sides. The figure (b) is
The filling resin is made translucent, and a reflective film 62 is formed on the side wall of the recess 3 and the upper surface of the translucent cured resin 61. In this way, the emitted light from the side surface of the LED chip 5 is reflected by the reflective film 62 and the light emitted from the side surface of the LED chip 5 is reflected by the reflective film 62.
and eventually radiates upward. Therefore, it becomes possible to improve radiation efficiency.
以上、詳細に説明した通り本発明によれば、発光素子チ
ップ周囲の凹部内に遮光部材が配設されるので、凹部お
よび発光素子チップのサイズにかかわりなく、発光素子
チップの側面からの光放射を阻止できる。また、凹部の
深さを発光素子チップの厚さ以下とすることで、発光素
子チップの上面に遮光部材が及ぶのを阻止できる。この
ため、発光素子チップの発光出力を、効率よく外部に取
り出すことができるので、発光部を実質的に小さくする
ことが可能になる。また、樹脂を硬化させて遮光部材を
形成することにより、製造ラインの自動化が実現でき、
低価格化を歩留向上が実現できる。As described above in detail, according to the present invention, the light shielding member is disposed in the recess around the light emitting element chip, so light radiation from the side surface of the light emitting element chip can be prevented regardless of the size of the recess and the light emitting element chip. can be prevented. Further, by making the depth of the recess less than or equal to the thickness of the light emitting element chip, it is possible to prevent the light shielding member from reaching the upper surface of the light emitting element chip. Therefore, the light emitting output of the light emitting element chip can be efficiently extracted to the outside, so that the light emitting section can be made substantially smaller. In addition, by curing the resin and forming a light shielding member, automation of the manufacturing line can be realized.
Lower prices and improved yields can be achieved.
第１図は本発明の実施例に係る発光素子の構造を示す図
、第２図は変形例に係る発光素子の要部断面図である。
１・・・リード端子、２・・・ベース、３・・・凹部、
４・・・凹溝、５・・・ＬＥＤチップ、６・・・遮光部
材、６１・・・透光性硬化樹脂、６２・・・反射膜。
代理人弁理士 長谷用 芳 樹実施例の構造
第１図FIG. 1 is a diagram showing the structure of a light emitting device according to an embodiment of the present invention, and FIG. 2 is a sectional view of a main part of a light emitting device according to a modification. 1... Lead terminal, 2... Base, 3... Recessed part,
4... Concave groove, 5... LED chip, 6... Light blocking member, 61... Transparent cured resin, 62... Reflective film. Representative Patent Attorney Yoshiki Hase’s Example Structure Diagram 1
Claims (1)
央に配設された発光素子チップと、この発光素子チップ
の周囲の前記凹部内に配設された遮光部材とを備える発
光素子。 ２、前記遮光部材は、遮光性樹脂を硬化させて形成され
ている請求項１記載の発光素子。３、前記遮光部材は、
硬化された樹脂とその表面に形成された反射膜により構
成されている請求項１記載の発光素子。 ４、前記凹部の深さが前記発光素子チップの厚さ以下で
あり、前記ベースの上面には前記凹部に連続する凹溝が
設けられ、かつ前記遮光部材は樹脂を前記凹溝から前記
凹部へ流し込んで硬化させることで形成されている請求
項１記載の発光素子。[Scope of Claims] 1. A base having a recess on its upper surface, a light emitting element chip disposed approximately in the center of the recess, and a light shielding member disposed within the recess around the light emitting element chip. A light emitting element comprising: 2. The light emitting device according to claim 1, wherein the light shielding member is formed by curing a light shielding resin. 3. The light shielding member is
2. The light emitting device according to claim 1, comprising a hardened resin and a reflective film formed on the surface of the hardened resin. 4. The depth of the recess is less than or equal to the thickness of the light emitting element chip, the upper surface of the base is provided with a groove continuous to the recess, and the light shielding member transports resin from the groove to the recess. The light emitting device according to claim 1, which is formed by pouring and curing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2289398A JPH0693525B2 (en) | 1990-10-26 | 1990-10-26 | Light emitting element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2289398A JPH0693525B2 (en) | 1990-10-26 | 1990-10-26 | Light emitting element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04162783A true JPH04162783A (en) | 1992-06-08 |
| JPH0693525B2 JPH0693525B2 (en) | 1994-11-16 |
Family
ID=17742714
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2289398A Expired - Fee Related JPH0693525B2 (en) | 1990-10-26 | 1990-10-26 | Light emitting element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0693525B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0672262U (en) * | 1993-03-19 | 1994-10-07 | オータックス株式会社 | Light emitting device |
| US6242760B1 (en) | 1998-07-13 | 2001-06-05 | Matsushita Electronics Corporation | Optical semiconductor device with enhanced light reception |
| JP2002270901A (en) * | 2001-03-12 | 2002-09-20 | Citizen Electronics Co Ltd | Light emitting diode and its manufacturing method |
| US6459711B1 (en) | 1999-01-13 | 2002-10-01 | Matsushita Electronics Corporation | Optical semiconductor device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5025194A (en) * | 1973-01-22 | 1975-03-17 | ||
| JPS6253437U (en) * | 1985-09-20 | 1987-04-02 |
-
1990
- 1990-10-26 JP JP2289398A patent/JPH0693525B2/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5025194A (en) * | 1973-01-22 | 1975-03-17 | ||
| JPS6253437U (en) * | 1985-09-20 | 1987-04-02 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0672262U (en) * | 1993-03-19 | 1994-10-07 | オータックス株式会社 | Light emitting device |
| US6242760B1 (en) | 1998-07-13 | 2001-06-05 | Matsushita Electronics Corporation | Optical semiconductor device with enhanced light reception |
| US6459711B1 (en) | 1999-01-13 | 2002-10-01 | Matsushita Electronics Corporation | Optical semiconductor device |
| JP2002270901A (en) * | 2001-03-12 | 2002-09-20 | Citizen Electronics Co Ltd | Light emitting diode and its manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0693525B2 (en) | 1994-11-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |