JPH022318B2 - - Google Patents
Info
- Publication number
- JPH022318B2 JPH022318B2 JP59170893A JP17089384A JPH022318B2 JP H022318 B2 JPH022318 B2 JP H022318B2 JP 59170893 A JP59170893 A JP 59170893A JP 17089384 A JP17089384 A JP 17089384A JP H022318 B2 JPH022318 B2 JP H022318B2
- Authority
- JP
- Japan
- Prior art keywords
- ceramic
- laminated
- ceramic capacitor
- multilayer
- green sheets
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000919 ceramic Substances 0.000 claims description 21
- 239000003985 ceramic capacitor Substances 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 9
- 239000010410 layer Substances 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 238000005245 sintering Methods 0.000 claims description 4
- 238000010304 firing Methods 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 3
- 239000011229 interlayer Substances 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims description 2
- 239000003990 capacitor Substances 0.000 description 9
- 239000000758 substrate Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59170893A JPS6148996A (ja) | 1984-08-16 | 1984-08-16 | セラミツク多層配線基板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59170893A JPS6148996A (ja) | 1984-08-16 | 1984-08-16 | セラミツク多層配線基板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6148996A JPS6148996A (ja) | 1986-03-10 |
| JPH022318B2 true JPH022318B2 (US06346242-20020212-C00066.png) | 1990-01-17 |
Family
ID=15913267
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59170893A Granted JPS6148996A (ja) | 1984-08-16 | 1984-08-16 | セラミツク多層配線基板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6148996A (US06346242-20020212-C00066.png) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2555639B2 (ja) * | 1987-10-07 | 1996-11-20 | 株式会社村田製作所 | 多層セラミック基板の製造方法 |
| JP2555638B2 (ja) * | 1987-10-07 | 1996-11-20 | 株式会社村田製作所 | 多層セラミック基板の製造方法 |
| JPH0632384B2 (ja) * | 1987-12-22 | 1994-04-27 | 株式会社住友金属セラミックス | 積層セラミック基板の製造方法 |
-
1984
- 1984-08-16 JP JP59170893A patent/JPS6148996A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6148996A (ja) | 1986-03-10 |
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