JPH0222974B2 - - Google Patents
Info
- Publication number
- JPH0222974B2 JPH0222974B2 JP56190538A JP19053881A JPH0222974B2 JP H0222974 B2 JPH0222974 B2 JP H0222974B2 JP 56190538 A JP56190538 A JP 56190538A JP 19053881 A JP19053881 A JP 19053881A JP H0222974 B2 JPH0222974 B2 JP H0222974B2
- Authority
- JP
- Japan
- Prior art keywords
- shadow mask
- predetermined
- resist film
- nickel plating
- blackening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 28
- 238000000034 method Methods 0.000 claims description 27
- 239000000463 material Substances 0.000 claims description 16
- 238000004519 manufacturing process Methods 0.000 claims description 14
- 229910052759 nickel Inorganic materials 0.000 claims description 14
- 238000007747 plating Methods 0.000 claims description 14
- 238000005406 washing Methods 0.000 claims description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 13
- 238000000137 annealing Methods 0.000 claims description 8
- 238000010894 electron beam technology Methods 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 8
- 238000005553 drilling Methods 0.000 claims 1
- 238000005530 etching Methods 0.000 description 6
- 238000000465 moulding Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 238000010306 acid treatment Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/02—Manufacture of electrodes or electrode systems
- H01J9/14—Manufacture of electrodes or electrode systems of non-emitting electrodes
- H01J9/142—Manufacture of electrodes or electrode systems of non-emitting electrodes of shadow-masks for colour television tubes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2209/00—Apparatus and processes for manufacture of discharge tubes
- H01J2209/01—Generalised techniques
- H01J2209/012—Coating
- H01J2209/015—Machines therefor
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
Description
【発明の詳細な説明】
発明の技術分野
本発明のカラー受像管に装着されるシヤドウマ
スクの製造方法に係り、特に高品質であり、より
安価なシヤドウマスクを得ることが可能なシヤド
ウマスクの製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION Technical Field of the Invention The present invention relates to a method of manufacturing a shadow mask attached to a color picture tube, and particularly relates to a method of manufacturing a shadow mask that is of high quality and can be obtained at a lower cost. It is.
発明の技術的背景
カラー受像管に装着されるシヤドウマスクの製
造方法は通常次のようにして製造されている。TECHNICAL BACKGROUND OF THE INVENTION A method for manufacturing a shadow mask attached to a color picture tube is generally as follows.
即ち、軟鉄からなる長尺のシヤドウマスク素材
の両面にレジスト膜を被着形成する。次にこのレ
ジスト膜の被着形成されたシヤドウマスク素材の
両面に所定のパターンのネガ原板を密着、露光
し、ネガ原板の透光部に対応するレジスト膜を光
硬化する。次にレジスト膜の未硬化部を現像除去
後光硬化部の耐エツチング処理を行なつた後、両
面よりスプレイ法などによりエツチング液をかけ
レジスト膜の除去された部分をエツチング除去
し、矩形状のドツト状の電子ビーム通過孔部を穿
設する。次に光硬化部のレジスト膜を除去し、水
洗乾燥工程を経てシヤドウマスク素材にフラツト
マスク及びピツクオフ線を設ける。次にこのピツ
クオフ線によりシヤドウマスク素材からフラツト
マスクをピツクオフする。次にフラツトマスクを
所定球面にプレス成形、黒化、スタビ炉通しなど
の諸工程を経てシヤドウマスクを完成する。 That is, a resist film is formed on both sides of a long shadow mask material made of soft iron. Next, a negative original plate having a predetermined pattern is brought into close contact with both sides of the shadow mask material on which the resist film has been deposited and exposed to light, and the resist film corresponding to the light-transmitting portions of the negative original plate is photocured. Next, after developing and removing the uncured portions of the resist film, the photo-cured portions are subjected to anti-etching treatment, and then an etching solution is applied from both sides using a spray method to remove the removed portions of the resist film, forming a rectangular shape. A dot-shaped electron beam passage hole is bored. Next, the resist film in the photocured area is removed, and a flat mask and pick-off lines are provided on the shadow mask material through a washing and drying process. Next, the flat mask is picked off from the shadow mask material using this pickoff line. Next, the flat mask is press-molded into a predetermined spherical surface, blackened, passed through a stabilizer oven, and other processes to complete the shadow mask.
この様なシヤドウマスクの製造方法により形成
されたシヤドウマスクは前述したように黒化、ス
タビ炉通しなどをプレス成形後行なうため設備や
工程が煩雑になるし、黒化膜は絶縁物であるた
め、マスクフレームなどに溶接することがなかな
かむずかしく、かつこの溶接時にスプラツシユが
発生するなどの問題点がある。 As mentioned above, the shadow mask formed by this method of manufacturing a shadow mask requires complicated equipment and processes because blackening, passing through a stabilizer oven, etc. are performed after press molding, and the blackening film is an insulator, so the mask It is difficult to weld to frames, etc., and there are problems such as splashes occurring during welding.
この改良として発明者らはシヤドウマスクとマ
スクフレームとからなるフレームマスク系に予め
ニツケルめつきを0.5〜3.0μ施し、次いで黒化処
理を行ない所定の形状に組立てる方法や製造コス
トの低減化のためにプレス成形後に行なう黒化処
理をプレス成形前の焼鈍時に同時に行なう方法を
先に出願した。 As an improvement to this, the inventors developed a method in which a frame mask system consisting of a shadow mask and a mask frame is coated with nickel plating of 0.5 to 3.0 μm in advance, and then blackened to assemble it into a predetermined shape and pressed to reduce manufacturing costs. An application was previously filed for a method in which the blackening treatment performed after molding is performed at the same time as annealing before press molding.
背景技術の問題点
しかしながらシヤドウマスクに限定すればニツ
ケルめつきの前処理のうちの弱酸洗浄により電子
ビーム通過孔部が大きくなるため、この広がり分
を差し引いた電子ビーム通過孔部を形成し、ニツ
ケルめつき処理を行なう必要がある。その結果電
子ビーム通過孔部寸法のばらつきがやや大きくな
るという問題点がある。また黒化と焼鈍との同時
処理はそれなりに省エネルギー効果を有するもの
の熱処理のためのフラツトマスクの積重ね作業や
入炉や出炉作業などのわずらわしい工程がある
し、また積重ねのために黒化膜厚のばらつきが大
きく、一部は再黒化しなければならない問題点が
ある。Problems with the Background Art However, when limited to shadow masks, the electron beam passage hole becomes larger due to weak acid cleaning as part of the pretreatment for nickel plating. It is necessary to perform processing. As a result, there is a problem that variations in the dimensions of the electron beam passage hole become somewhat large. Furthermore, although the simultaneous treatment of blackening and annealing has a certain energy-saving effect, it involves cumbersome processes such as stacking flat masks for heat treatment, entering and exiting the furnace, and the thickness of the blackening film varies due to stacking. There is a problem that some parts have to be re-blackened.
発明の目的
本発明は前述し諸問題点に鑑みなされたもので
あり、れら諸問題点を解消すると共に、より高品
質なシヤドウマスクを低コストで提供することが
可能なシヤドウマスクの製造方法を提供すること
を目的としている。Purpose of the Invention The present invention has been made in view of the problems mentioned above, and provides a method for manufacturing a shadow mask that can solve these problems and provide a higher quality shadow mask at a lower cost. It is intended to.
発明の概要
即ち、本発明は露光工程、現像工程を経て、両
主面の所定位置にレジスト膜が被着された長尺の
シヤドウマスク素材をエツチング、水洗する工程
と、レジスト膜を除去水洗する工程と、所定厚の
ニツケルめつきを施すニツケルめつき工程及び水
洗工程と、水蒸気またはCO2ガスを含む雰囲気中
で焼鈍と黒化処理を同時に行なう熱処理工程とを
所定の移動速度で通過させるようにしたことを特
徴としている。Summary of the Invention That is, the present invention involves the steps of etching and washing a long shadow mask material with a resist film adhered to predetermined positions on both principal surfaces through an exposure process and a development process, and a process of removing the resist film and washing it with water. , a nickel plating process and water washing process in which nickel plating is applied to a predetermined thickness, and a heat treatment process in which annealing and blackening treatment are performed simultaneously in an atmosphere containing water vapor or CO 2 gas at a predetermined moving speed. It is characterized by what it did.
本発明の実施例
次に本発明のシヤドウマスクの製造方法の一実
施例を図により説明する。EMBODIMENT OF THE INVENTION Next, an embodiment of the method for manufacturing a shadow mask according to the present invention will be described with reference to the drawings.
即ち、両主面にレジスト膜を被着形成し、露光
工程、現像工程を経て両主面の所定位置にレジス
ト膜が被着された長尺のシヤドウマスク素材１を
リール２よりそれぞれ１対のローラ３1，３2，３
３，３4，３5で所定の移動速度により移動させる
が、この場合ローラ３1，３2間にはエツチング装
置４と第１の水洗装置５が設けられシヤドウマス
ク素材１に長方形状または円形状の電子ビーム通
過孔部を穿設するようになつている。またローラ
３2，３3間にはレジスト膜を除去するレジスト膜
除去装置６と第２の水洗装置７が設けられ、レジ
スト膜を除去するようになつている。またローラ
３3，３4間には複数個の案内用ローラ８によりニ
ツケルめつき液９中に導びかれた電子ビーム通過
孔部の穿設されたシヤドウマスク素材１の両主面
に対設するように陽極板１０が設けられ、シヤド
ウマスク素材１の両主面に所定厚さ、例えば0.5
〜3.0μのニツケルめつきを施すニツケルめつき装
置１１と第３の水洗装置１２が設けられている、
攻にローラ３4，３5には矢印１３方法からCO2ガ
スまたは水蒸気を導入し、ニツケルめつきされた
シヤドウマスク素材を焼鈍と黒化処理を行なう黒
化熱処理装置１４が設けられている。これらを通
過したフラツトマスクの形成されたシヤドウマス
ク素材１はピツクオフ工程を経て、フラツトマス
クが抜き取られこのフラツトマスクはプレス成形
されシヤドウマスクが完成する。 That is, a long shadow mask material 1 with resist films deposited on both main surfaces, exposed and developed, and resist films deposited on predetermined positions on both main surfaces is transferred from a reel 2 to a pair of rollers. 3 1 , 3 2 , 3
3 , 3 4 , and 3 5 at a predetermined moving speed. In this case, an etching device 4 and a first washing device 5 are provided between the rollers 3 1 and 3 2 to form a rectangular or circular shape on the shadow mask material 1. An electron beam passage hole is formed in the hole. Further, a resist film removing device 6 and a second water washing device 7 are provided between the rollers 3 2 and 3 3 to remove the resist film. Further, between the rollers 3 3 and 3 4 , a plurality of guide rollers 8 are arranged opposite to each other on both main surfaces of the shadow mask material 1, in which holes are formed for passing the electron beam guided into the nickel plating solution 9. An anode plate 10 is provided on both main surfaces of the shadow mask material 1 to a predetermined thickness, for example 0.5.
A nickel plating device 11 for applying nickel plating of ~3.0μ and a third water washing device 12 are provided.
Further, the rollers 3 4 and 3 5 are provided with a blackening heat treatment device 14 for annealing and blackening the nickel-plated shadow mask material by introducing CO 2 gas or water vapor in the direction of arrow 13. The shadow mask material 1 on which the flat mask has been passed through these passes through a pick-off process, where the flat mask is extracted and the flat mask is press-molded to complete the shadow mask.
このようにシヤドウマスク素材のエツチング工
程、レジスト膜除去工程に続いてニツケルめつき
工程、熱処理工程を一貫して行なうことにより従
来のシヤドウマスク素材のニツケルめつき工程で
必要であつたローデイング、アンローデイング、
電解脱脂、水洗、弱酸処理、水洗、乾燥、などの
諸工程が全く不要となるばかりでなく、電子ビー
ム通過孔部の寸法の変化がなくなるため、最終的
にシヤドウマスクの品質向上、歩留向上をもたら
した。また従来の黒化兼用焼鈍で必要であつたフ
ラツトマスクのローデイング、アンローデイン
グ、積重ねなどの作業が不要となり、更に炉に入
れるフラツトマスクも積重ねてないため黒化膜厚
の不均一が非常に小さくなつた。 In this way, by performing the etching process of the shadow mask material, the resist film removal process, the nickel plating process, and the heat treatment process in an integrated manner, it is possible to perform the loading and unloading process that was necessary in the conventional nickel plating process of the shadow mask material.
Not only does it eliminate the need for various processes such as electrolytic degreasing, water washing, weak acid treatment, water washing, and drying, but it also eliminates changes in the dimensions of the electron beam passage hole, ultimately improving the quality and yield of shadow masks. Brought. In addition, the loading, unloading, and stacking of flat masks, which were required in conventional blackening and annealing, are no longer necessary, and since the flat masks that are placed in the furnace are not stacked, the nonuniformity of the blackening film thickness is greatly reduced. .
この熱処理炉内の雰囲気ガスの組成はシヤドウ
マスク素材の焼鈍特性に合わせて選定した温度域
により適当に選べばよいし、また予めニツケルめ
つきを施してあるため、黒化膜厚が薄くてもカラ
ー受像管の製造工程中の加熱工程においても錆の
発生がないため追加の黒化処理を必要とせず、完
全な黒化兼焼鈍が可能となつた。 The composition of the atmospheric gas in this heat treatment furnace can be selected appropriately depending on the temperature range selected according to the annealing characteristics of the shadow mask material, and since nickel plating has been applied in advance, even if the thickness of the blackened film is thin, the color is still visible. Since no rust occurs during the heating process during the picture tube manufacturing process, there is no need for additional blackening treatment, making complete blackening and annealing possible.
発明の効果
上述のように本発明のシヤドウマスクの製造方
法によればカラー受像管に装着されるシヤドウマ
スクの製造コストを低減化させるだけでなく、電
子ビーム通過孔部の寸法精度の向上、黒化膜厚の
均一化が得られるのでシヤドウマスクのみなら
ず、カラー受像管の画面の品位を向上させること
が可能となつた。Effects of the Invention As described above, the method of manufacturing a shadow mask of the present invention not only reduces the manufacturing cost of a shadow mask attached to a color picture tube, but also improves the dimensional accuracy of the electron beam passage hole and improves the blackening film. Since the thickness can be made uniform, it has become possible to improve not only the quality of the shadow mask but also the screen quality of the color picture tube.
図は本発明のシヤドウマスクの製造方法の一実
施例に用いられる一連の処理装置を示す説明用簡
略断面図である。
１……シヤドウマスク素材、４……エツチング
装置、５，７，１２……水洗装置、６……レジス
ト膜除去装置、１１……ニツケルめつき装置、１
４……黒化、熱処理装置。
The figure is a simplified sectional view showing a series of processing equipment used in an embodiment of the method for manufacturing a shadow mask of the present invention. 1... Shadow mask material, 4... Etching device, 5, 7, 12... Water washing device, 6... Resist film removal device, 11... Nickel plating device, 1
4...Blackening and heat treatment equipment.
Claims (1)
程、現像工程を経て前記両主面の所定位置にレジ
スト膜が形成された長尺のシヤドウマスク素材を
エツチング装置及び第１の水洗装置により所定の
電子ビーム通過孔部を穿設する工程と、レジスト
除去装置及び第２の水洗装置により残存するレジ
スト膜を除去する工程と、ニツケルめつき装置及
び第３の水洗装置により前記両主面に所定厚のニ
ツケルめつき層を形成する工程と、所定雰囲気を
有する黒化、熱処理装置により焼鈍、黒化する工
程とを順次所定の速度で通過させることを特徴と
するシヤドウマスクの製造方法。 ２ 所定厚のニツケルめつき層が0.5〜3.0μであ
ることを特徴とする特許請求の範囲第１項記載の
シヤドウマスクの製造方法。 ３ 所定雰囲気が水蒸気またはCO2ガスを含む雰
囲気であることを特徴とする特許請求の範囲第１
項または第２項記載のシヤドウマスクの製造方
法。[Scope of Claims] 1. A long shadow mask material in which a resist film is deposited on both main surfaces, and a resist film is formed at a predetermined position on both main surfaces through an exposure process and a development process. A step of drilling a predetermined electron beam passage hole using a first water washing device, a step of removing the remaining resist film using a resist removal device and a second water washing device, and a step using a nickel plating device and a third water washing device. A shadow mask characterized in that the step of forming a nickel plating layer of a predetermined thickness on both main surfaces and the step of annealing and blackening in a blackening and heat treatment device having a predetermined atmosphere are passed sequentially at a predetermined speed. Production method. 2. The method for manufacturing a shadow mask according to claim 1, wherein the nickel plating layer has a predetermined thickness of 0.5 to 3.0 μm. 3 Claim 1, wherein the predetermined atmosphere is an atmosphere containing water vapor or CO 2 gas
The method for manufacturing a shadow mask according to item 1 or 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56190538A JPS5893145A (en) | 1981-11-30 | 1981-11-30 | Manufacture of shadow mask |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56190538A JPS5893145A (en) | 1981-11-30 | 1981-11-30 | Manufacture of shadow mask |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5893145A JPS5893145A (en) | 1983-06-02 |
| JPH0222974B2 true JPH0222974B2 (en) | 1990-05-22 |
Family
ID=16259745
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56190538A Granted JPS5893145A (en) | 1981-11-30 | 1981-11-30 | Manufacture of shadow mask |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5893145A (en) |
-
1981
- 1981-11-30 JP JP56190538A patent/JPS5893145A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5893145A (en) | 1983-06-02 |
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