JPH0222542B2 - - Google Patents
Info
- Publication number
- JPH0222542B2 JPH0222542B2 JP25111084A JP25111084A JPH0222542B2 JP H0222542 B2 JPH0222542 B2 JP H0222542B2 JP 25111084 A JP25111084 A JP 25111084A JP 25111084 A JP25111084 A JP 25111084A JP H0222542 B2 JPH0222542 B2 JP H0222542B2
- Authority
- JP
- Japan
- Prior art keywords
- glass tube
- large diameter
- electrode
- electrodes
- glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011521 glass Substances 0.000 claims description 38
- 239000004065 semiconductor Substances 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000007789 sealing Methods 0.000 description 9
- 230000007547 defect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005336 cracking Methods 0.000 description 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25111084A JPS61129850A (ja) | 1984-11-28 | 1984-11-28 | リ−ドレス半導体装置の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25111084A JPS61129850A (ja) | 1984-11-28 | 1984-11-28 | リ−ドレス半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61129850A JPS61129850A (ja) | 1986-06-17 |
JPH0222542B2 true JPH0222542B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1990-05-18 |
Family
ID=17217797
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP25111084A Granted JPS61129850A (ja) | 1984-11-28 | 1984-11-28 | リ−ドレス半導体装置の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61129850A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
-
1984
- 1984-11-28 JP JP25111084A patent/JPS61129850A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS61129850A (ja) | 1986-06-17 |
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