JPH0222542B2 - - Google Patents

Info

Publication number
JPH0222542B2
JPH0222542B2 JP25111084A JP25111084A JPH0222542B2 JP H0222542 B2 JPH0222542 B2 JP H0222542B2 JP 25111084 A JP25111084 A JP 25111084A JP 25111084 A JP25111084 A JP 25111084A JP H0222542 B2 JPH0222542 B2 JP H0222542B2
Authority
JP
Japan
Prior art keywords
glass tube
large diameter
electrode
electrodes
glass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP25111084A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61129850A (ja
Inventor
Kaoru Nakagawa
Yoshio Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP25111084A priority Critical patent/JPS61129850A/ja
Publication of JPS61129850A publication Critical patent/JPS61129850A/ja
Publication of JPH0222542B2 publication Critical patent/JPH0222542B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP25111084A 1984-11-28 1984-11-28 リ−ドレス半導体装置の製造方法 Granted JPS61129850A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP25111084A JPS61129850A (ja) 1984-11-28 1984-11-28 リ−ドレス半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25111084A JPS61129850A (ja) 1984-11-28 1984-11-28 リ−ドレス半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS61129850A JPS61129850A (ja) 1986-06-17
JPH0222542B2 true JPH0222542B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1990-05-18

Family

ID=17217797

Family Applications (1)

Application Number Title Priority Date Filing Date
JP25111084A Granted JPS61129850A (ja) 1984-11-28 1984-11-28 リ−ドレス半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS61129850A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Also Published As

Publication number Publication date
JPS61129850A (ja) 1986-06-17

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