JPH0222258U - - Google Patents
Info
- Publication number
- JPH0222258U JPH0222258U JP9922188U JP9922188U JPH0222258U JP H0222258 U JPH0222258 U JP H0222258U JP 9922188 U JP9922188 U JP 9922188U JP 9922188 U JP9922188 U JP 9922188U JP H0222258 U JPH0222258 U JP H0222258U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- opening part
- opening
- mask plate
- resistant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 238000005476 soldering Methods 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の耐半田マスクプレートの斜視
図である。第２図は第１図のＸ―Ｘ断面図である
。図中の参照番号はそれぞれ次のものを表わす。
１…耐半田マスクプレート、２…額縁状支持体
、３…耐半田プレート薄体、４…開口部、５…非
開口部、６…放熱層。
FIG. 1 is a perspective view of a solder-resistant mask plate of the present invention. FIG. 2 is a sectional view taken along line XX in FIG. Reference numbers in the figures represent the following, respectively. DESCRIPTION OF SYMBOLS 1... Solder resistant mask plate, 2... Frame-shaped support, 3... Solder resistant plate thin body, 4... Opening, 5... Non-opening, 6... Heat dissipation layer.
Claims (1)
体からなり、その非開口部の電子部品と接する側
の面に放熱板が設けられていることを特徴とする
、配線基板に重ねて溶融した半田に浸漬し半田付
けするための耐半田マスクプレート。 A thin body made of a solder-resistant material having an opening and a non-opening part, and a heat sink is provided on the side of the non-opening part that contacts electronic components, and is stacked on a wiring board. Solder resistant mask plate for soldering by immersing it in molten solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9922188U JPH0222258U (en) | 1988-07-27 | 1988-07-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9922188U JPH0222258U (en) | 1988-07-27 | 1988-07-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0222258U true JPH0222258U (en) | 1990-02-14 |
Family
ID=31326178
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9922188U Pending JPH0222258U (en) | 1988-07-27 | 1988-07-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0222258U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5475072A (en) * | 1977-11-29 | 1979-06-15 | Fujitsu Ltd | Method of soldering circuit substrate |
-
1988
- 1988-07-27 JP JP9922188U patent/JPH0222258U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5475072A (en) * | 1977-11-29 | 1979-06-15 | Fujitsu Ltd | Method of soldering circuit substrate |