JPH02222557A - Vacuum pincette - Google Patents

Abstract

PURPOSE:To obtain a pair of vacuum pincette which has the same operability as a conventional one and is able to stably transfer a wafer after it sucks it by a method wherein two or more sucking sections are provided to a handle and a switch. CONSTITUTION:In a pair of vacuum pincette which sucks and detached a semiconductor wafer 7, two or more vacuum sucking sections 3a and 3b are provided to a handle 1 and a switch 2. For instance, an arm connected to the handle 1 is made to branch off into forked arms 5a and 5b from the root of the handle 1, and sucking sections 3a and 3b provided with sucking grooves 4a and 4b respectively are provided to the tips of the arms 5a and 5b respectively. The switch 2 is provided singly, and the sucking sections 3a and 3b are made to suck at the same time by pushing down the switch 2 and a vacuum is turned OFF by stopping pushing down the switch 2. By this setup, a wafer can be sucked only when two or more sucking sections are brought into close contact with the rear of the wafer, and in this case, even if a pair of pincette of this design has a sucking section of the same size as that of a conventional one, it can transfers the wafer more stably.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an improvement in vacuum tweezers for attracting and detaching semiconductor wafers.

[Conventional technology]

The structure of a conventional vacuum tweezers of this type is explained using FIG. 4. In Figure 0, 1 is a handle for gripping the vacuum tweezers, and 2 is a vacuum 0N placed at an appropriate location (easily operated location) on this handle. -OFF switch 3 is a suction part that comes into close contact with the back surface of the wafer, the surface of which is surrounded by suction grooves 4, and this suction part 3 and the handle 1 are connected by an arm 5. Note that the suction section 3 and the arm section 5 are formed thinner than the handle section 1 in order to be inserted into gaps between narrowly spaced wafers arranged in a wafer cassette. 6 is a vacuum tube for evacuating the suction groove.

Next, the wafer suction operation will be explained using FIG.

The switch 2 has a mechanism in which the vacuum is ON when the switch is kept pressed, and when the switch is released, it is turned OFF and the suction is cut off. Therefore, as shown in the figure, the wafer is sucked by bringing the suction unit 3 into close contact with the back surface of the wafer 7 while the switch is pressed, and then the wafer is lifted up.Then, when the wafer is to be removed, the switch is released.

The adsorption of carbon on wafers is related to the size of the adsorption section or the area of the adsorption groove.In order to adsorb a heavy wafer, the adsorption section must be made larger and the degree of vacuum must be increased.0 Normally 6
For a ``φ wafer, if the suction part is 39s x 26m and the degree of vacuum is 10cmHH, the holding force is 250g.In order to correspond to an 8''φ wafer, the suction part is 35m x 26m.
At 32M, the degree of vacuum is also required to be 40cmHg.

[Problem to be solved by the invention]

Conventional vacuum tweezers are configured as described above.
Good if the wafer size is small (up to 5″φ), but
If the wafer has a large diameter (such as 8"φ) and is heavy, the wafer will be very unstable after being picked up because there is only one point on the suction part, and there is a risk that the wafer may fall during suction. Even if an attempt was made to increase the size and adsorbed carbon, there were problems in that the shape would be large and the operability would be poor, and it would be difficult to contact the wafer when adsorbing it.

This invention was made to solve the above-mentioned problems, and the purpose of this invention is to provide vacuum tweezers that have the same operability as conventional wafers during suction, and can move the wafer stably after suction. shall be.

[Means to solve the problem]

The vacuum tweezers according to the present invention include a plurality of suction parts for one handle and switch.

[Effect]

Since the vacuum tweezers of the present invention have a plurality of suction parts, there are a plurality of contact parts, that is, fulcrums, for suctioning a wafer at one time, so even a wafer with a large area and weight can be stably suctioned and moved.

〔Example〕

An embodiment of the present invention will be described below with reference to the drawings.

In Fig. 1, 1.2.6 is the same as that in Fig. 4, but the arm connected to the handle 1 is branched from the root into a plurality of forks 5a and 5b, A suction portion 3a having suction grooves 4a, 4b at each tip thereof.

3b is provided. Further, there is only one switch 2 as in the conventional case, and when the switch is pressed, the above-mentioned suction portion 3a is opened.

When 3b suctions at the same time and the switch is released, the vacuum turns off.
It's supposed to be.

Next, the wafer suction operation will be explained using FIG. 2. The contact operation to the wafer 7, the detachment operation, and how to use the switch are the same as those of conventional vacuum tweezers, but in the case of this embodiment, as shown in the figure, the suction part contacts the wafer at two places, and both The wafer can be sucked only when the suction part is in close contact with the back surface of the wafer, and in that case, even if the suction part is the same size as conventional vacuum tweezers, the wafer can be moved more stably.

In the above embodiment, the case where there are two arm portions and two suction portions is shown, but it is also possible to have more suction portions.

In addition, in the above embodiment, the two arms are made into a forked shape,
Although a suction portion is provided at the tip of each arm, a plurality of suction portions may be provided on one arm, as shown in FIG. 3.

〔Effect of the invention〕

As described above, according to the present invention, a plurality of suction parts are provided for one handle and switch, so even when handling large wafers, there is no need to enlarge the shape of the suction part.
It has good operability and has the effect of allowing the wafer to be moved very stably after being picked up.

[Brief explanation of the drawing]

FIG. 1 shows vacuum tweezers according to an embodiment of the present invention! FIG. 1I and FIG. 2 are explanatory diagrams of its operation, FIG. 3 is an external view showing vacuum tweezers according to another embodiment of the present invention, FIG. 4 is an external view showing conventional vacuum tweezers, and FIG. It is an explanatory diagram of the operation. In the figure, 1 is a handle, 2 is a switch, 3a and 3b are suction parts,
4a and 4b are suction grooves, 5a and 5b are arms, and 6 is a vacuum tube. Note that the same reference numerals in the figures indicate the same or equivalent parts.

Claims (1)

[Claims] Vacuum tweezers for attracting and detaching semiconductor wafers, the vacuum tweezers having a plurality of vacuum suction parts for one handle and switch.