JPH05211226A - Air tweezers - Google Patents

Abstract

PURPOSE:To prevent slipping-down when a semiconductor wafer is held by using air tweezers, and to suck the semiconductor wafer smoothly. CONSTITUTION:A retaining member 5 connected to a suck button 3 is mounted in addition to the sucking section 4 of air tweezers 1, and a pawl 5b is set up to the retaining member 5. According to such structure, when a semiconductor wafer 2 is sucked by the sucking section 4 by depressing the suck button 3, the retaining member 5 of the semiconductor wafer 2 holds the semiconductor wafer at the same time. Consequently, the retaining member 5 of the semiconductor wafer 2 is installed in addition to the sucking section 4, thus positively holding the semiconductor wafer, then allowing improvement in operating efficiency.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to air tweezers for holding a semiconductor wafer when the semiconductor wafer is transferred.

[0002]

2. Description of the Related Art FIG. 4 shows a conventionally used air tweezer, 1 is an air tweezer, 2 is a semiconductor wafer, and the air tweezer 1 has a suction button 3 and a suction portion 4.
Is provided.

Next, the operation will be described. Figure 5 (a)
(B) is a detailed view showing the operation, and (a) shows the air tweezers 1 attached to the semiconductor wafer 2 and the suction button 3 still in place.
Indicates that the button is not pressed. As shown in (b), a vacuum is drawn by pressing the suction button 3, the back surface side of the semiconductor wafer 2 is sucked by the suction portion 4, and the semiconductor wafer 2 is transferred. The air tweezers 1 is hollow, and this portion is connected to a vacuuming device or the like, and the semiconductor wafer 2 is sucked through the suction portion 4. At this time, the suction button 3 controls the evacuation of the suction portion 4.
Since the semiconductor device is formed on the front side of the semiconductor wafer 2, the semiconductor wafer 2 is protected so as not to damage this part.
Adsorb the back side of.

[0004]

Since the conventional air tweezers 1 are constructed as described above, the semiconductor wafer 2
When sucking, the suction portion 4 of the air tweezers 1 must be surely placed horizontally on the semiconductor wafer 2 or the suction portion 4 will not be sucked.
When adsorbing the semiconductor wafer 2 having a large diameter, there is a problem that the semiconductor wafer 2 is heavy and slips off.
Further, when the work for completely sucking the semiconductor wafer 2 to the suction portion 4 is repeated many times, the edge of the semiconductor wafer 2 is broken, and this becomes a foreign substance, which causes a decrease in the yield of the semiconductor device thereafter. There is also a problem.

The present invention has been made in order to solve the above-mentioned problems, and an air sucking part can be smoothly and horizontally applied to the back surface of a semiconductor wafer, and the semiconductor wafer can be prevented from slipping. Aim to get tweezers.

[0006]

In addition to the suction portion of the semiconductor wafer, the air tweezers according to the present invention is provided with a retainer member having a pawl that presses against the semiconductor wafer in conjunction with the suction button.

[0007]

In the present invention, the semiconductor wafer is sucked and the semiconductor wafer is held by the holding member.

[0008]

Embodiment 1 An embodiment of the present invention will be described below with reference to FIGS. In FIG. 1, the holding member 5 has an upper end connected to the suction button 3 and is supported by an intermediate fulcrum 5a,
The lower part is provided with a pawl 5b which is pressed against the front side of the semiconductor wafer 2. In addition, the same reference numerals as those in FIG. 4 indicate the same parts.

Next, the operation will be described with reference to FIGS. (A) shows a state in which the air tweezers 1 have not yet sucked the semiconductor wafer 2. When the semiconductor wafer 2 is moved, if the semiconductor wafer 2 is moved only by the suction portion 4, the large-diameter wafer may drop due to its own weight unless the suction portion 4 is applied in the direction toward the center of the semiconductor wafer 2 to suck the semiconductor wafer 2. However, as shown in (b), when the suction button 3 is pressed, the semiconductor wafer 2 is sucked by the suction portion 4, and at the same time, the holding member 5 of the semiconductor wafer 2 is interlocked to hold the semiconductor wafer 2 from the front side with the pawl 5b. By doing so, the semiconductor wafer 2 is firmly held, and the semiconductor wafer 2 does not drop due to a suction error.

Since the semiconductor device is provided on the front side of the semiconductor wafer 2, the holding member 5 is provided with the pawl 5b as much as possible.
The contact portion of is reduced and the semiconductor device is not damaged.

Embodiment 2 In Embodiment 2 of FIG. 3, the pawl 5b is divided into two. With such a structure, the contact area of the surface of the semiconductor wafer 2 can be reduced.

[0012]

As described above, according to the present invention, the member for holding the semiconductor wafer is provided in the air tweezers.
Adsorption mistakes can be reduced, and the operation efficiency can be improved by facilitating the operation.

[Brief description of drawings]

FIG. 1 is a front view of a first embodiment of the present invention, and b
Is a side view.

FIG. 2 is a side view showing the operation of the first embodiment of the present invention, where a is before adsorption and b is during adsorption.

FIG. 3A is a front view and b is a side view of Embodiment 2 of the present invention.

FIG. 4A is a front view of a conventional air tweezers,
b is a side view.

FIG. 5 is a side view showing the operation of the conventional air tweezers,
a is before adsorption and b is after adsorption.

[Explanation of symbols]

 1 Air Tweezers 2 Semiconductor Wafer 3 Suction Button 4 Adsorption Member 5 Holding Part 5b Pawl

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Takashi Yano 4-chome, Mizuhara, Itami-shi Ryoden Semiconductor System Engineering Co., Ltd. (72) Inventor Kazuhiko Yamamoto 4-chome, Mizuhara Itami-shi Ryoden Semiconductor System Engineering Co., Ltd. Within the corporation

Claims (1)

[Claims] 1. A suction member for sucking a semiconductor wafer, a suction button for controlling vacuum suction of the suction unit, and a holding member provided with a pawl interlocking with the suction button for pressing the semiconductor wafer. Air tweezers equipped with.