JPH0870030A - Vacuum tweezers - Google Patents

Abstract

PURPOSE: To provide a pair of vacuum tweezers for positively and stably sucking and retaining a flat substrate such as a semiconductor wafer with a large aperture even if a grip is held in shake-hand system. CONSTITUTION: Vacuum tweezers 10 consist of, as in conventional vacuum tweezers, a grip 2, a pipe 3 connected to one edge part of the grip 2, a suction part 4 provided at the other edge of the pipe 3, a hose 5 which is connected to the pipe 3, and a shutter button 6 provided at the grip 2. A bent part 3A is formed at the tip part of the pipe 3. In a second embodiment, a bent part is constituted in bellows structure.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vacuum tweezer suitable for adsorbing a large flat substrate such as a large-diameter semiconductor wafer, blanks and LCD substrate. In the following description, a semiconductor wafer will be described as an example of the flat substrate.

[0002]

2. Description of the Related Art First, a conventional vacuum tweezer is shown in FIG.
Will be explained. FIG. 3 is a side view of a conventional vacuum tweezers. The vacuum tweezers 1 is connected to a grip 2, a linear pipe 3 connected to one end of the grip 2, an adsorption portion 4 provided at the other end of the pipe 3 and the other end of the grip 2, and the pipe 3. Connected hose 5
And a shutter button 6 provided on the grip 2.

In the case of adsorbing a semiconductor wafer (not shown) using the vacuum tweezers 1 having such a structure, first, the other end of the hose 5 is connected to a vacuum pump (not shown), While gripping the grip 2 and pressing the shutter button 6 to suck in the suction air from the suction portion 4, the suction portion 4 is brought close to the surface of the semiconductor wafer and sucked,
Hold.

[0004]

When the semiconductor wafer has a relatively small diameter, the pen holder type is sufficient for gripping the grip 2 of the vacuum tweezers 1. However, when handling a semiconductor wafer having a large diameter and a large weight, if the grip 2 is gripped by a pen holder type, it is difficult to securely hold the semiconductor wafer, and it is better to grip by a shake hand type. However, if the pipe 3 is straight, when the grip 2 is gripped by a shake hand type, the suction portion 4 of the vacuum tweezers 1 is unlikely to come close to the surface of the semiconductor wafer as expected, and the suction operation is difficult.
The vacuum tweezers of the present invention have an object to solve such problems.

[0005]

Accordingly, the vacuum tweezers of the present invention are connected to a grip, a pipe connected to one end of the grip, an adsorption portion provided at the other end of the pipe, and the other end of the grip, and In a vacuum tweezer including a hose connected to the pipe and a shutter button provided on the grip, a bent portion is formed in the pipe to solve the above problem.

[0006]

Therefore, the vacuum tweezers of the present invention can be easily operated even if the grip is gripped by the shake hand type, and the semiconductor wafer can be surely sucked and held.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the vacuum tweezers of the present invention will be described with reference to FIGS. 1 is a side view of a vacuum tweezers which is a first embodiment of the present invention, and FIG. 2 is a side view of a vacuum tweezers which is a second embodiment of the present invention. First, a vacuum tweezers 10 according to a first embodiment of the present invention will be described with reference to FIG. The vacuum tweezers 10 of the present invention are of a size that can be gripped by the palm, and have a grip 2A that has an elliptical cross section to facilitate gripping, a pipe 3 connected to one end of the grip 2A, and a suction provided on the other end of the pipe 3. It comprises a hose 5 connected to the section 4 and the other end of the grip 2A and connected to the pipe 3, and a shutter button 6 provided on the grip 2A. In the vacuum tweezers 10 of the present invention, the bent portion 3A is formed by bending the tip of the pipe 3.

In the vacuum tweezers 20 of the second embodiment shown in FIG. 2, at least a part of the tip of the pipe 3 is made of plastic or the like to form a bellows, and that part is the bent part 3B. When the bent portion 3B has a bellows structure in this manner, the tip end portion of the pipe 3 can be freely expanded and contracted, and the angle of the adsorption portion 4 can be changed to a desired angle, regardless of the size of the semiconductor. It is possible to deal with the stored state of wafers and semiconductor wafers.

[0009]

Therefore, the vacuum tweezers of the present invention are
The shake hand type makes it easy to operate even if a grip is held, and a flat substrate such as a large-diameter semiconductor wafer can be reliably and stably adsorbed and held. Although the vacuum tweezers handling flat substrates such as large-diameter semiconductor wafers have been described in the above embodiments, it goes without saying that the present invention can also be applied to vacuum tweezers handling flat substrates having a relatively small diameter.

[Brief description of drawings]

FIG. 1 is a side view of a vacuum tweezers that is a first embodiment of the present invention.

FIG. 2 is a side view of the vacuum tweezers that is the second embodiment of the present invention.

FIG. 3 is a side view of currently used vacuum tweezers.

[Explanation of symbols]

 10 Vacuum tweezers which is the first embodiment of the present invention 20 Vacuum tweezers which is the second embodiment of the present invention 2A Grip 3 Pipe 3A Bent section 3B Bent section 4 Adsorption section 5 Hose 6 Shutter button

Claims (2)

[Claims] 1. A grip, a pipe connected to one end of the grip, a suction portion provided at the other end of the pipe, a hose connected to the other end of the grip and connected to the pipe, A vacuum tweezer comprising a shutter button provided on a grip, wherein the pipe has a bent portion. 2. The vacuum tweezers according to claim 1, wherein the bent portion is formed of a bellows.