JPH08264629A - Vacuum tweezers - Google Patents

Abstract

PURPOSE: To provide tweezers in which no dust is generated without damaging a wafer. CONSTITUTION: When the surface 2a of a holder 2 is brought into contact with a wafer and a suction operating unit 4a is operated in the direction of an arrow D, a movable unit 4b is moved in the direction of an arrow B. A wire 4d is moved in the opposite direction of an arrow C by the movement of the unit 4b, a film 1 is pulled and elongated, and as the part surrounded by the wafer, the film 1 and the holder 2 is increased, the wafer is sucked to the surface 2a of the holder 2.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to vacuum tweezers.

[0002]

2. Description of the Related Art Conventionally, as a tweezers for handling a wafer, a tweezers type which directly sandwiches (grasps) the wafer and a type which sucks the wafer by using a pump have been generally used. Further, as the material of the tweezers, a material such as stainless steel or Teflon which is unlikely to become a pollution source is used.

[0003]

However, the former has a problem that the wafer may be scratched when the wafer is sandwiched.

The latter has a problem that dust is generated due to the use of the pump.

An object of the invention of the present application is to provide tweezers which does not scratch the wafer and does not generate dust.

[0006]

SUMMARY OF THE INVENTION The invention relating to the vacuum tweezers of the present application includes a stretchable film portion, an outer peripheral portion having a surface that holds the outer periphery of the film portion and is in contact with a wafer, and the film portion. The above-mentioned object is achieved by providing an operating portion that is pulled on the side opposite to the surface that comes into contact with the wafer.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention relating to the vacuum tweezers of the present application will be specifically described below with reference to the embodiments shown in the drawings.

In FIG. 1, reference numeral 1 denotes a film portion, and in this example, a material such as Teflon having high elasticity and little pollution is used. Reference numeral 2 denotes a holding portion, which has a surface 2a that holds the outer periphery of the film portion 1 and is in contact with a wafer 5 described later. 3 is a support part,
In this example, a hollow rod is used to hold the holding portion 2. Reference numeral 4 denotes an operation portion, which is composed of a suction operation portion 4a provided on the support portion 3 and the like. In this example, the configuration shown in FIG. 2 is adopted.
2 is a sectional view taken along the line AA of FIG. In the figure, 4b is a movable part, and the shaft 4 is moved by operating the suction operation part 4a.
It is configured such that it can move in the direction of arrow B around c. The movable portion 4b is normally held at the position shown in FIG. 2 by receiving a force in the direction of arrow C by a spring or the like (not shown). A wire 4d has one end 4e joined to the end 4f of the movable portion 4b and the other end 4g joined to a part of the film portion 1. In the figure, the same numbers as in FIG. 1 are the same. Further, the suction operation section 4a, the movable section 4b,
The shaft 4c and the wire 4d constitute the operation unit 4.

Next, the operation method will be described with reference to FIGS. 3 and 4 are enlarged views of the film unit 1 and the holding unit 2.

When the surface 2a of the holding portion 2 is brought into contact with the wafer 5 (see FIG. 3) and the suction operation portion 4a is operated in the direction of arrow D (see FIG. 2), the movable portion 4b moves in the direction of arrow B. The movement of the movable portion 4b causes the wire 4d to move in the direction opposite to the arrow C, the film portion 1 is pulled and extended, and the area 6 surrounded by the wafer 5, the film portion 1 and the holding portion 2 increases. Then, the wafer 5 is attracted to the surface 2a of the holding unit 2 (see FIG. 4).

In the example shown above, the operation unit 4 shown in FIG. 2 is used, but the operation unit 4 is not limited to this, and those shown in FIGS. 5 and 6 may be used. . 5 and 6, those having the same numbers as those in FIG. 2 are the same.

Referring to FIG. 5, a movable portion 4i having a surface 4h having a predetermined angle with respect to the lengthwise direction of the support portion 3 is arranged in the support portion 3, and the suction operation portion 4a is engaged with the surface 4h. The mating portion is a surface having an angle corresponding to the surface 4h.

By operating the suction operation portion 4a in the direction of arrow D, the movable portion 4i moves in the direction of arrow E, and along with this movement, the wire 4i moves in the direction of arrow E as in the previous example, and the film portion is moved. 1 works.

In FIG. 6, one end 4m of the wire 4k corresponding to the wire 4d shown in FIG. 2 is connected to the piston 4n provided in the support portion 3. Therefore, the piston 4n moves in the direction of the arrow F by the operation of the suction operation portion 4a, and the pressure in the region 7 surrounded by the piston 4n, the support portion 3, the holding portion 2 and the membrane portion 1 decreases with this movement, and the membrane portion 1 decreases. Is pulled downward in the drawing, and the film part 1 operates in the same manner as the previous example.

As described above, when the wafer is handled, the wafer is not scratched and dust is not generated, so that the wafer can be handled safely.

Depending on the size of the wafer to be handled,
It is desirable to change the size of the film part.

Further, it is desirable that the thickness of the holding portion 2 be such that it can be inserted between the wafers in the wafer carrier.

[0018]

EFFECT OF THE INVENTION The invention relating to the vacuum tweezers of the present application includes a stretchable film portion, a holding portion that holds the outer periphery of the film portion and a surface that contacts the wafer, and a surface that contacts the film portion with the wafer. Since it has an operation part that pulls to the opposite side, it is possible to eliminate the inconvenience of scratching the wafer or generating dust when handling the wafer as in the conventional case, and highly safe wafer operation Can be realized.

[Brief description of drawings]

FIG. 1 is an explanatory view showing an embodiment of the invention relating to the vacuum tweezers of the present application.

FIG. 2 is a sectional view of a main part of FIG.

FIG. 3 is an explanatory view showing an embodiment of the invention relating to the vacuum tweezers of the present application.

FIG. 4 is an explanatory view showing an embodiment of the invention relating to the vacuum tweezers of the present application.

FIG. 5 is a main part explanatory view of another embodiment of the invention relating to the vacuum tweezers of the present application.

FIG. 6 is an explanatory view of a main part of still another embodiment of the invention related to the vacuum tweezers of the present application.

[Explanation of symbols]

 1 membrane part 2 holding part 4 operation part

Claims (1)

[Claims] 1. A stretchable film part, a holding part that holds the outer periphery of the film part and has a surface that contacts the wafer, and an operation part that pulls the film part to the opposite side of the surface that contacts the wafer. Vacuum tweezers characterized by having and.