JPH05154786A - Semiconductor wafer sucking device - Google Patents

Abstract

PURPOSE:To eliminate the limitation of the conveyance range of a semiconductor wafer and freely move it by providing a cylinder arranged and connected to a wafer sucking section and a piston decompressing the cylinder. CONSTITUTION:When a suction lever 4 is grasped, a piston 3 exhausts and decompresses the air in a cylinder 2. Vacuum suction force is applied from the cylinder 2 to a sucking section 1 connected by a pipe. A wafer can be sucked when it is positioned by a wafer positioner into contact with the sucking section 1. The wafer is released when the suction lever 4 is released and the piston 3 is returned to the original position by the force of a spring 5. The semiconductor wafer can be freely moved to any position.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor wafer suction device used in a semiconductor device manufacturing process.

[0002]

2. Description of the Related Art Conventionally, a semiconductor wafer suction device for suction-holding and transferring a semiconductor wafer often functions by vacuum suction from the outside. For example, as shown in the configuration diagram of FIG. 6, a vacuum suction pipe 8 from a vacuum pump provided outside is connected to the wafer suction unit 1.

[0003]

In the structure of the conventional semiconductor wafer suction apparatus described above, the vacuum suction tube 8 from the outside is used.
Is connected, the range of use of the semiconductor wafer suction device is determined by the length of the vacuum suction tube 8. Therefore, in order to remove the limitation of the range of use, it is necessary to have a structure that does not use a vacuum suction tube, and for that purpose, it is necessary to provide the semiconductor wafer suction device itself with a vacuum suction mechanism.

[0004]

The semiconductor wafer suction apparatus according to the present invention eliminates the vacuum suction tube connected to the outside so that the wafer can be freely moved while holding it.

The semiconductor wafer suction device of the present invention has a structure in which the piston is moved by gripping the suction lever of the device and the wafer is sucked by depressurizing the inside of the cylinder.

[0006]

The present invention will be described below with reference to the drawings. Figure 1
2 is a side view of Embodiment 1 of the present invention, and FIG. 2 is a bottom view thereof. 3 is an enlarged view of the suction unit 1 of FIG. 1, and FIG. 4 is a cross-sectional view of the cylinder 2 of FIG.

In the semiconductor wafer suction apparatus of this embodiment, the piston 3 is moved to the cylinder 2 by gripping the suction lever 4.
The air inside is exhausted to the outside to reduce the pressure. As a result, a vacuum suction force acts from the inside of the cylinder 2 to the suction portion 1 connected by a pipe. Therefore, the wafer can be sucked by positioning the wafer with the wafer alignment 6 and applying it to the suction portion 1. For release, release the suction lever 4 and spring 5.
This is done by returning the piston to the base with the force of.

FIG. 5 is a side sectional view of the second embodiment of the present invention. In the semiconductor wafer suction device of this embodiment, the piston 3 is moved by gripping the suction lever 4 as in the first embodiment.
By moving a, the inside of the cylinder 2a is depressurized and a vacuum suction force is generated. The structure of this embodiment is the suction lever 4
Is not directly connected to the piston 3a, but is connected to the rack via a pinion gear mechanism 9. Further, the cylinder 2a is laterally incorporated in the apparatus. The advantages over the first embodiment are that there is no concern about leakage from around the piston rod of the cylinder, and that the device can be made smaller.

[0009]

As described above, according to the present invention, the apparatus is provided with the piston and the cylinder, and the vacuum suction force is generated by depressurizing the cylinder. Therefore, it can be used by moving to any place in the clean room.

[Brief description of drawings]

FIG. 1 is a side view of a first embodiment of the present invention.

FIG. 2 is a bottom view of FIG.

FIG. 3 is an enlarged view of a suction unit shown in FIG.

FIG. 4 is an enlarged cross-sectional view of the cylinder shown in FIG.

FIG. 5 is a side sectional view of a second embodiment of the present invention.

FIG. 6 is a configuration diagram of a conventional adsorption device.

[Explanation of symbols]

 1 Adsorption Part 2, 2a Cylinder 3, 3a Piston 4 Suction Lever 5 Spring 6 Wafer Alignment 8 Vacuum Suction Pipe 9 Gear Mechanism

Claims (1)

[Claims] 1. A semiconductor wafer suction device for sucking a semiconductor wafer by vacuum, a cylinder connected to a wafer suction portion by a pipe, a piston for depressurizing the inside of the cylinder, and a suction lever having a gripping structure for driving the piston. A semiconductor wafer suction device having a spring for returning the suction lever.