JPH0531240U - Vacuum pin set tip - Google Patents

Abstract

(57) [Abstract] [Purpose] To provide a tip of a vacuum tweezer which solves the instability of adhesive holding of a semiconductor wafer and the difficulty of handling. [Structure] The total length of the wafer suction part 61 and the neck part 62 is
The length of the semiconductor wafer to be handled is set to be approximately the same as the radius of the semiconductor wafer. It was constructed by refracting.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a vacuum tweezers used for sucking and moving a semiconductor wafer in a clean room, and more particularly to a vacuum tweezer tip forming a tip for directly sucking and holding the semiconductor wafer.

[0002]

[Prior Art]

 In LSI manufacturing / development, etc., work is done in a low dust-generating room (clean room) in order to avoid contamination of various impurities and their effects. Regarding the handling of semiconductor wafers, in order to avoid the generation of dust due to human handling and the accompanying contamination of impurities, batch transfer and movement by machines are often used.

However, depending on the device and the work contents, it may be necessary to manually move the semiconductor wafer. In such a case, the vacuum tweezers whose tip end that directly sucks and holds the wafer is made of quartz with less contamination. Is often used.

In such vacuum tweezers A, as shown in FIG. 5, a metal pipe 2 is attached to a metal vacuum tweezer body 1, and a quartz vacuum tweezer tip portion 3 and the metal pipe 2 are connected to each other. 4 and is coaxially connected through 4 and integrated.

The tip portion 3 of the vacuum tweezers includes a suction portion 31 (approximately 1/6 of the entire length), a neck portion 32 (approximately 1/6 of the same), a body portion 33 (approximately 1/3 of the same), and a taper portion 34. (Almost 1/6). The connection sleeve 4 is made of a fluororesin because it requires a washable and removable material so that the tip 3 of the vacuum tweezers can be washed together when washing the tip 3 of the vacuum tweezers. A tapered hole 41 corresponding to the tapered portion 34 of the tip 3 and an insertion hole 42 for the tip of the metal pipe 2 are formed, and both holes 41, 42 communicate with each other.

Since such vacuum tweezers A are used so as to suck and hold the back surface of the semiconductor wafer B, the surface of the semiconductor wafer is less likely to be scratched, and the problem of defective products is small.

[0007]

[Problems to be solved by the device]

 However, in the conventional vacuum tweezers A, the total length of the wafer suction portion 31 and the neck portion 32 of the vacuum tweezer tip portion 3 is short (approximately 1/3 of the entire length), and therefore the semiconductor wafer B is sucked. When holding, as shown in FIG. 6, the outer peripheral portion 5 has to be sucked and held, but this makes the sucked state unstable, and for example, when an external force is applied to the edge portion of the semiconductor wafer B 1, it is easily sucked. The power was lost, and accidents such as dropping of the semiconductor wafer B were easy to occur.

Further, the vacuum tweezers A have a linear shape, and when the vacuum tweezers A are attracted obliquely from above so that the hand, which is a dust source, is not positioned above the semiconductor wafer B, the wrist is not touched. It was necessary to bend naturally, and it was difficult to handle the semiconductor wafer B.

An object of the present invention is to provide a vacuum tweezers tip portion that solves the above-described instability of holding and holding a semiconductor wafer and the difficulty of handling.

[0010]

[Means for Solving the Problems]

 To this end, the present invention provides a wafer suction part, a body part connected to the vacuum tweezers body, and a vacuum tweezer tip part including the wafer suction part and a neck part connecting the body part. The total length is set to be approximately the same as the radius of the wafer, and the portion of the neck portion away from the body portion by about 1/3 of the total neck length is bent in a direction parallel to the suction surface of the wafer suction portion. It was made up of.

[0011]

According to the present invention, the wafer suction portion can suck the substantially central portion of the semiconductor wafer, thereby strengthening and stabilizing the holding. Further, since the neck portion is bent, the central portion of the semiconductor wafer can be adsorbed from diagonally above without unnaturally bending the wrist, which facilitates handling.

[0012]

【Example】

 Hereinafter, embodiments of the present invention will be described in detail. FIG. 1 is a plan view of a quartz-made vacuum tweezer tip portion 6 for a 6-inch semiconductor wafer according to one embodiment, and FIG. 2 is a side view.

The tip portion 6 of the vacuum tweezers has a suction portion 61 having a length of 25 to 30 mm provided at the tip portion, a neck portion 62 extending from the suction portion 61 and having a length of about 50 mm, and the other end of the neck portion 62. It is composed of a continuous body portion 63 having an outer diameter of 8 mmφ and a tapered surface (not shown).

Here, the total length of the suction portion 61 and the neck portion 62 is 75 to 80 mm, which is almost the same as the radius (75 mm) of the 6-inch semiconductor wafer B. The neck portion 62 has a bent portion 62a formed at a portion separated from the boundary portion with the body portion 63 by about 1/3 (about 15 mm) of the entire length of the neck portion 62. The bending direction of the bent portion 62a is parallel to the suction surface (the surface of the suction port) of the suction portion 61, and the angle is about 15 ° ± 1 to 2 °.

Therefore, when the tip portion 6 of the vacuum tweezers is bonded to the connection sleeve 4 as in the conventional case to hold the semiconductor wafer B by suction, the suction portion 61 may be positioned at the center portion of the semiconductor wafer B. The bent portion 62a of the neck portion 62 is located at the outer peripheral portion of the semiconductor wafer B. That is, since the vacuum tweezers tip portion 6 can suck and hold the central portion of the semiconductor wafer B by the suction portion 61, even if an external force is applied to the periphery of the semiconductor wafer B, the holding state is broken. Instead, a stable holding state can be maintained.

When a plurality of semiconductor wafers B are arranged so that the front surface faces the front side and the back surface faces the front, the suction portion of the vacuum tweezers tip portion 6 is provided between the adjacent semiconductor wafers B with the right hand. 61 can be inserted obliquely from above so that the hand, which is the dust source, is not obliquely upward, but obliquely upward, and can be adsorbed as shown in FIG. Moreover, since the neck portion 62 is bent at the bent portion 62a, it is not necessary to bend the wrist portion holding the vacuum tweezers unnaturally, and the handling thereof becomes easy.

FIG. 4 is an explanatory diagram in which various angles of the bent portion 62 a of the vacuum tweezers tip portion 6 are set and evaluation is performed when a semiconductor wafer is handled. At an angle of 0 degree, when handling a semiconductor wafer, the wrist, which is the source of dust generation, must be bent to prevent it from being positioned above the semiconductor wafer, which is difficult to handle. On the other hand, when the angle is 30 to 45 degrees, it is too curved, and it is difficult to use. Even at an angle of around 20 degrees, it is difficult to use because you need to bend your wrist deeply. After all, an angle of around 15 degrees was the easiest to use.

The tip portion 6 of the vacuum tweezers may be used by inserting it between the wafers B arranged in plural as described above. There is no problem because the wafer suction part 61 is thin and the neck 62 has a small outer diameter. However, since the body 63 is relatively thick, the outer diameter must be smaller than the gap between the semiconductor wafers. Then, as mentioned above, it is set to 8 mmφ.

In the above-mentioned embodiment, the vacuum pinset tip portion 6 for handling the 6-inch semiconductor wafer B is used. However, in order to use it for the 4-inch and 8-inch semiconductor wafers, the radius of each of them should be changed. The length of the neck 62 may be set accordingly. However, the angle of the bent portion 62a needs to be set to the above angle. Further, the wafer suction portion 61 can be a separate one, and in such a case, a commercially available fluororesin wafer suction portion can be used. Further, the vacuum tweezers tip portion 6 described above is for right-handed use, but in order to use it for left-handed use, the suction surface of the wafer suction portion 61 may be oriented in the opposite direction.

[0020]

[Effect of the device]

 As described above, according to the present invention, the total length of the wafer suction portion and the neck portion is set to be the same length as the radius of the semiconductor wafer to be handled, so that the wafer suction portion sucks almost the central portion of the semiconductor wafer. Therefore, even when an external force is applied to the semiconductor wafer, its holding state does not deteriorate.

Further, since the neck portion is bent, the work of inserting the tip portion of the vacuum tweezers from a diagonally upper side of the wafer and adsorbing it can be performed without bending the wrist unnaturally, so that the handling becomes easy.

[Brief description of drawings]

FIG. 1 is a plan view of a tip portion of a vacuum tweezers according to an embodiment of the present invention.

FIG. 2 is a side view of the tip portion of the vacuum tweezers.

FIG. 3 is an explanatory view of holding a semiconductor wafer by suction with the tip portion of the vacuum tweezers.

FIG. 4 is a view for explaining ease of handling due to a difference in bending angle of the neck portion of the vacuum tweezers tip portion.

FIG. 5 is an exploded perspective view of a conventional vacuum tweezers.

FIG. 6 is an explanatory view of holding a semiconductor wafer by suction with a conventional vacuum tweezers tip portion.

[Explanation of symbols]

6: vacuum tweezers tip part, 61: wafer suction part, 6
2: neck part, 62a: bent part, 63: body part.

Front Page Continuation (72) Inventor Hideo Ikutsu 1-6-6, Uchisaiwaicho, Chiyoda-ku, Tokyo Nihon Telegraph and Telephone Corporation

Claims (1)

[Scope of utility model registration request] 1. A total length of the wafer suction portion and the neck portion at a vacuum tweezer tip portion including a wafer suction portion, a body portion connected to the vacuum tweezer body, and a neck portion connecting the wafer suction portion and the body portion. Is set to a length approximately equal to the radius of the wafer, and the portion of the neck portion away from the body portion by about 1/3 of the entire neck length is bent in a direction parallel to the suction surface of the wafer suction portion. Vacuum Hinset tip characterized by being made.