JPH0222145Y2 - - Google Patents

Info

Publication number
JPH0222145Y2
JPH0222145Y2 JP1984165650U JP16565084U JPH0222145Y2 JP H0222145 Y2 JPH0222145 Y2 JP H0222145Y2 JP 1984165650 U JP1984165650 U JP 1984165650U JP 16565084 U JP16565084 U JP 16565084U JP H0222145 Y2 JPH0222145 Y2 JP H0222145Y2
Authority
JP
Japan
Prior art keywords
solder
stocker
bar
printed circuit
bars
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1984165650U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6182766U (enrdf_load_html_response
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984165650U priority Critical patent/JPH0222145Y2/ja
Publication of JPS6182766U publication Critical patent/JPS6182766U/ja
Application granted granted Critical
Publication of JPH0222145Y2 publication Critical patent/JPH0222145Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP1984165650U 1984-11-02 1984-11-02 Expired JPH0222145Y2 (enrdf_load_html_response)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984165650U JPH0222145Y2 (enrdf_load_html_response) 1984-11-02 1984-11-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984165650U JPH0222145Y2 (enrdf_load_html_response) 1984-11-02 1984-11-02

Publications (2)

Publication Number Publication Date
JPS6182766U JPS6182766U (enrdf_load_html_response) 1986-05-31
JPH0222145Y2 true JPH0222145Y2 (enrdf_load_html_response) 1990-06-14

Family

ID=30723490

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984165650U Expired JPH0222145Y2 (enrdf_load_html_response) 1984-11-02 1984-11-02

Country Status (1)

Country Link
JP (1) JPH0222145Y2 (enrdf_load_html_response)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58102260U (ja) * 1981-12-28 1983-07-12 近藤 権士 はんだ補給装置

Also Published As

Publication number Publication date
JPS6182766U (enrdf_load_html_response) 1986-05-31

Similar Documents

Publication Publication Date Title
US6585149B2 (en) Packaging method using lead-free solder
CN109175587B (zh) 一种dc线焊接机
DE4328603A1 (de) Vorrichtung zum Entfernen elektronischer Bauelemente von gedruckten Leiterplatten
EP0480754A2 (en) Mounting device for mounting an electronic device on a substrate by the surface mounting technology
US6475023B2 (en) Surface mount holding feature
KR0145211B1 (ko) 전자부품실장장치 및 전자부품실장방법
JPH0222145Y2 (enrdf_load_html_response)
JP3793969B2 (ja) カラム整列装置
US7048173B2 (en) Wave soldering method using lead-free solder, apparatus therefor, and wave-soldered assembly
JP3214316B2 (ja) 導電性ボールの搭載装置および搭載方法およびバンプの形成方法
JPH0648699B2 (ja) 高密度集積回路支持体と、この支持体の導体の選択的錫メッキ装置
US3041991A (en) Soldering device
CN101600303A (zh) 焊锡设备及其焊锡方法
JPH0386372A (ja) 半田付装置
JP3907180B2 (ja) はんだカラム搭載装置
DE19910173C2 (de) Verfahren zum Entfernen von Lotresten auf einer Leiterplatte
JPH0256989B2 (enrdf_load_html_response)
JPH0690077A (ja) 印刷配線板
KR100661982B1 (ko) 바타입 솔더공급장치
JPS634020Y2 (enrdf_load_html_response)
JPS60223200A (ja) 電子部品插入方法
JPS6297763A (ja) はんだ付け方法および装置
JPH0523872B2 (enrdf_load_html_response)
JP2000190074A (ja) 高温半田ディップ処理装置
JPH04257293A (ja) ディップ半田付工法及び装置