JPH02216843A - Temperature control method - Google Patents
Temperature control methodInfo
- Publication number
- JPH02216843A JPH02216843A JP1037719A JP3771989A JPH02216843A JP H02216843 A JPH02216843 A JP H02216843A JP 1037719 A JP1037719 A JP 1037719A JP 3771989 A JP3771989 A JP 3771989A JP H02216843 A JPH02216843 A JP H02216843A
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- temperature control
- fluid
- liquid
- mounting table
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 13
- 239000012530 fluid Substances 0.000 claims abstract description 45
- 230000001105 regulatory effect Effects 0.000 claims description 35
- 230000007246 mechanism Effects 0.000 claims description 9
- 230000001276 controlling effect Effects 0.000 claims description 5
- 239000007788 liquid Substances 0.000 abstract description 28
- 238000001816 cooling Methods 0.000 abstract description 16
- 239000002826 coolant Substances 0.000 abstract description 13
- 238000007689 inspection Methods 0.000 abstract description 12
- 239000004065 semiconductor Substances 0.000 abstract description 10
- 230000009172 bursting Effects 0.000 abstract description 3
- 229940125368 controlled substance Drugs 0.000 abstract 3
- 239000000599 controlled substance Substances 0.000 abstract 3
- 238000003825 pressing Methods 0.000 abstract 1
- 239000000110 cooling liquid Substances 0.000 description 29
- 235000012431 wafers Nutrition 0.000 description 26
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 6
- 239000000523 sample Substances 0.000 description 6
- 238000012360 testing method Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 230000002528 anti-freeze Effects 0.000 description 2
- 238000004380 ashing Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000012809 cooling fluid Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
Abstract
Description
【発明の詳細な説明】 〔発明の目的〕 （産業上の利用分野） 本発明は、温調方法に関する。[Detailed description of the invention] [Purpose of the invention] (Industrial application field) The present invention relates to a temperature control method.
（従来の技術）
半導体集積回路の製造は、半導体ウェハに複数の処理を
施すことにより、上記ウェハ表面に微細パターンが形成
される。この微細パターンが形成されたウェハは検査工
程で検査され、不良品を半導体チップ単位で廃除してい
る。このような検査工程では、上記ウェハを低温に設定
して検査することがある。これは、コンピュータの計算
速度を速めるために低温下で半導体素子が使用される場
合があるため、この使用条件に適応させる如くウェハを
冷却して検査する。このようにウェハを冷却した状態で
電気特性の検査を行なう技術は、例えば特公昭６２−３
６３７８号公報等に開示されている。(Prior Art) In the manufacture of semiconductor integrated circuits, a fine pattern is formed on the surface of a semiconductor wafer by performing a plurality of processes on the semiconductor wafer. The wafers on which these fine patterns are formed are inspected in an inspection process, and defective products are discarded on a semiconductor chip basis. In such an inspection process, the wafer may be inspected at a low temperature. This is because semiconductor devices are sometimes used at low temperatures in order to speed up computer calculations, so the wafer is cooled and inspected to suit the conditions of use. The technique of testing the electrical characteristics of a wafer in a cooled state was developed, for example, by the Japanese Patent Publication No. 62-3.
This method is disclosed in Japanese Patent No. 6378 and the like.
このようにウェハを冷却させるためには、一般に、ウェ
ハを載置する載置台に温調流体例えば温調液を供給する
ことにより行なわれている。これは、熱交換が行なわれ
るタンク内に上記温調液例えば冷却液を循環させて冷却
し、この冷却された冷却液は、上記載置台へ供給駆動す
る手段例えばポンプにより流導管を介してウェハの載置
台に供給され、この載置台を冷却した後、再び上記タン
ク内に液送される。このように冷却液をタンクと載置台
の間でポンプにより循環させることにより、上記載置台
の冷却が行なわれている。この載置台を十分に且つ精度
良く冷却するためには、大量の冷却液を載置台に供給さ
せる必要がある。しかし、上記冷却液を液送する流導管
の長さ及び径による流体抵抗や、この流導管の途中に設
けられている継手による流体抵抗の制約のために、上記
ポンプの圧力を上昇させて冷却液の液送量を増すのが一
般的となっていた。In order to cool the wafer in this manner, it is generally done by supplying a temperature regulating fluid, such as a temperature regulating liquid, to a mounting table on which the wafer is mounted. This is done by circulating the above-mentioned temperature control liquid, for example, a cooling liquid, in the tank where heat exchange is performed, and this cooled liquid is supplied to the above-mentioned mounting table through a flow conduit by means of driving means, such as a pump, to the wafer. After cooling the mounting table, the liquid is fed into the tank again. By circulating the cooling liquid between the tank and the mounting table using a pump in this manner, the mounting table is cooled. In order to cool the mounting table sufficiently and accurately, it is necessary to supply a large amount of cooling liquid to the mounting table. However, due to the fluid resistance due to the length and diameter of the flow conduit that transports the cooling liquid, and the fluid resistance due to the joints installed in the middle of this flow conduit, the pressure of the pump is increased to cool it. It has become common practice to increase the amount of liquid delivered.
（発明が解決しようとする課題）
しかしながら上記従来の技術では、載置台へ大量の冷却
液を供給するために、ポンプの圧力を上昇させている。(Problems to be Solved by the Invention) However, in the above conventional technology, the pressure of the pump is increased in order to supply a large amount of cooling liquid to the mounting table.
この圧力を上昇させると流導管内の冷却液圧力が大気圧
に対して上昇し、これにより上記流導管等の配管の破裂
や継手等からの液もれを生ずる恐れがあり、ポンプの圧
力を上昇させることも制約があった。このため、上記載
置台に大量の冷却液を供給することができず、十分且つ
精度良く冷却することが困難となる場合があった。If this pressure is increased, the pressure of the coolant in the flow conduit increases relative to atmospheric pressure, which may cause pipes such as the flow conduit to burst or leak from joints, etc., and the pressure of the pump may increase. There were also restrictions on raising the price. For this reason, a large amount of cooling liquid cannot be supplied to the mounting table, and it may be difficult to cool the device sufficiently and accurately.
本発明は上記点に対処してなされたもので、配管の破裂
や流体のもれがなく、且つ被温調体に大量の温調流体を
供給することによる高精度な温調制御を可能とする温調
方法を提供しようとするものである。The present invention has been made to address the above-mentioned problems, and enables highly accurate temperature control without pipe rupture or fluid leakage, and by supplying a large amount of temperature control fluid to the object to be temperature controlled. The purpose of this paper is to provide a method for controlling temperature.
（ＩＩＭを解決するための手段）
本発明は、温調機構及び被温調体間で温調流体を循環さ
せて被温調体を温調するに際し、上記被温調体へ温調流
体を供給駆動する手段と、被温調体から温調流体を吸引
駆動する手段により、上記温調流体を循環させて被温調
体の温調を行なうことを特徴とする温調方法を得るもの
である。(Means for Solving IIM) The present invention provides for supplying the temperature regulating fluid to the temperature regulated body when circulating the temperature regulating fluid between the temperature regulating mechanism and the temperature regulated body to regulate the temperature of the temperature regulated body. The present invention provides a temperature control method characterized in that the temperature control fluid is circulated and the temperature of the temperature control object is controlled by a means for supplying and driving the temperature control fluid and a means for sucking and driving the temperature control fluid from the temperature control object. be.
（作用効果）
即ち、本発明は、温調機構及び被温調体間で温調流体を
循環させて被温調体を温調するに際し、上記被温調体へ
温調流体を供給駆動する手段と、被温調体から温調流体
を吸引駆動する手段により、上記温調流体を循環させて
被温調体の温調を行なうことにより、上記被温調体内及
びこの被温調体に温調流体を循環させる配管内に大量の
温調流体を流しても、上記温調流体の圧力が大気圧に対
して上昇することはなく、上記配管の破裂や継手等から
の流体のもれを防止することができる。この温調流体の
圧力上昇をなくしたために、大量の温ｌ！ｌｌ流体を被
温調体に供給することができ、十分な熱交換を実行する
ことが可能となる。そのため。(Operation and Effect) That is, the present invention drives the supply of the temperature regulating fluid to the temperature regulated body when circulating the temperature regulating fluid between the temperature regulating mechanism and the temperature regulated body to regulate the temperature of the temperature regulated body. and a means for suctioning and driving the temperature regulating fluid from the temperature regulated body, by circulating the temperature regulating fluid and controlling the temperature of the temperature regulated body. Even if a large amount of temperature-regulating fluid is passed through the piping that circulates the temperature-regulating fluid, the pressure of the temperature-regulating fluid will not rise above atmospheric pressure, and the piping may burst or the fluid may leak from joints, etc. can be prevented. By eliminating the pressure rise of this temperature control fluid, a large amount of temperature l! 11 fluid can be supplied to the temperature controlled body, and it becomes possible to perform sufficient heat exchange. Therefore.
被ｍｉ１体を高精度で温調制御することができる。The temperature of the target mi1 body can be controlled with high precision.
（実施例）
以下、本発明方法を半導体ウェハを検査する検査装置に
適用した一実施例につき、図面を参照して説明する。(Example) Hereinafter, an example in which the method of the present invention is applied to an inspection apparatus for inspecting semiconductor wafers will be described with reference to the drawings.
まず、検査装置の構成を説明する。First, the configuration of the inspection device will be explained.
被検査体例えば半導体ウェハωをチップ単位で電気的な
特性を検査する検査袋！■が構成されている。この検査
装置■には、Ｘ−Ｙ−Ｚ・θに移動及び回転可能な被温
調体である載置台■が設けられている。この載置台■の
上面に上記ウェハ■を載置し保持することにより、一体
内にウェハ■をＸ−Ｙ−Ｚ・θ移動及び回転が可能とさ
れている。また、この載置台■の上方には、上記ウェハ
■の電極（図示せず）に接触して電気的な特性を検査す
るための探針に）を備えたプローブカード■が設けられ
ており、このプローブカード■の探針に）に、載置台■
の上昇によりウェハ■を接触させることで、検査を可能
としている。このようにウェハα）を検査するに際して
は、上記ウェハ■を温調した状態で検査されることがあ
る０例えば完成品ＩＣの使用条件に適応させる如く上記
ウェハωを冷却して、同条件で検査を行なう。このウェ
ハωを冷却する手段としては、冷却液循環路に設けられ
た載置台■に、上記温調流体例えば冷却液循環路を介し
て冷却液例えば不凍液を液送することにより載置台■を
冷却し１間接的にウェハ■の冷却を行なう構造となって
いる。この時、不凍液は、エチレングリコール水溶液を
用いる場合が多い。An inspection bag for inspecting the electrical characteristics of an object to be inspected, such as a semiconductor wafer, on a chip-by-chip basis! ■ is configured. This inspection device (2) is provided with a mounting table (2) which is a temperature controlled object that can be moved and rotated in X-Y-Z and θ. By placing and holding the wafer (2) on the upper surface of this mounting table (1), it is possible to move and rotate the wafer (2) in X-Y-Z and .theta. within one body. Further, above the mounting table ■, there is provided a probe card ■ equipped with a probe for testing the electrical characteristics by contacting the electrodes (not shown) of the wafer ■. On the probe of this probe card ■), place the mounting stand ■
Inspection is possible by bringing the wafer (■) into contact with the wafer (2) due to the rise in the temperature. When inspecting the wafer α) in this way, the wafer ω may be inspected while the temperature is controlled. Conduct an inspection. The means for cooling the wafer ω is to cool the wafer ω by feeding a cooling liquid, such as antifreeze, to the wafer ω, which is provided in the cooling liquid circulation path, through the temperature control fluid, such as the cooling liquid circulation path. The structure is such that the wafer (1) is indirectly cooled. At this time, an aqueous ethylene glycol solution is often used as the antifreeze.
この冷却手段を具体的に説明すると、上記＃！置台■内
に流路０が貫設され、この流路■の入力側には流導管（
７ａ）、出力側には流導管（７ｂ）が接続している。こ
れら流導管（７ａ） （７ｂ）は、上記載置台■がＸ−
Ｙ−Ｚ・θ方向等に移動するため、フレキシブルな蛇腹
状に形成されている。このため、後述する温調機構と接
続するため継手（８ａ） （ｇｂ）が設けられている。To specifically explain this cooling means, #! above! A flow path 0 is installed through the placing stand ■, and a flow conduit (
7a), a flow conduit (7b) is connected to the output side. These flow conduits (7a) (7b) are
It is formed into a flexible bellows shape in order to move in the Y-Z and θ directions. For this reason, joints (8a) (gb) are provided for connection to a temperature control mechanism to be described later.
このような継手（８ａ） （８ｂ）に接続され。Connected to such joints (8a) and (8b).
上記載置台■を冷却する冷却液の熱交換即ち冷却を行な
う温調機構例えば冷却機構■が設けられている。この冷
却機構■は、冷却液を溜めるタンク（１１）と、このタ
ンク（１１）内の冷却液（１０）を所定温度に熱交換即
ち冷却する、上記冷却液（１０）内に浸漬された冷却コ
イル（エバポレータ） （１２）と、この冷却コイル（
１２）に連設し冷却コイル（１２）の冷却を行なう冷凍
機（１３）とから構成されている。また、上記タンク（
１１）内の底部付近まで一端が延び、他端が上記継手（
８ａ）に接続した液送管（１４ａ）が設けられ、更に、
上記タンク（１１）向上部に一端が配置され、他端が上
記継手（８ｂ）に接続した液送管（１４ｂ）が設けられ
ている。 これら、液送管（１４ａ） 、流導管（７ａ
）、載置台■、流導管（７ｂ） ｌ液送管（１４ｂ）に
より、上記タンク（１１）からの冷却液循環路が構成さ
れている。この冷却液循環路に、介在した、上記載置台
■へ冷却液（１０）を供給駆動する手段例えば第１のポ
ンプ（１５）が設けられている。更に、上記冷却液循環
路に介在した。上記載置台■から冷却液（１０）を吸引
駆動する手段例えば第２のポンプ（１６）が設けられて
いる。この第１及び第２のポンプ（１５） （１６）に
より、上記冷却液循環路内で冷却液（１０）を循環駆動
する構造となっている。このようにして冷却機構０を備
えた検査袋！■が構成されている。A temperature control mechanism, such as a cooling mechanism (2), is provided for heat exchange, that is, cooling, of the cooling fluid that cools the mounting table (2). This cooling mechanism (2) consists of a tank (11) that stores a cooling liquid, and a cooling device immersed in the cooling liquid (10) that exchanges heat, that is, cools the cooling liquid (10) in the tank (11) to a predetermined temperature. Coil (evaporator) (12) and this cooling coil (
12) and a refrigerator (13) that is connected to the cooling coil (12) and cools the cooling coil (12). In addition, the above tank (
11) One end extends to near the bottom of the inside, and the other end connects to the above joint (
A liquid feed pipe (14a) connected to 8a) is provided, and further,
A liquid feed pipe (14b) is provided, one end of which is disposed above the tank (11) and the other end connected to the joint (8b). These are the liquid feed pipe (14a) and the flow pipe (7a).
), the mounting table (1), the flow pipe (7b), and the liquid pipe (14b) constitute a cooling liquid circulation path from the tank (11). This coolant circulation path is provided with a means for supplying and driving the coolant (10) to the intervening mounting table (1), such as a first pump (15). Furthermore, it was interposed in the cooling liquid circulation path. For example, a second pump (16) is provided for sucking and driving the cooling liquid (10) from the mounting table (1). The first and second pumps (15) and (16) are configured to circulate and drive the coolant (10) within the coolant circulation path. In this way, an inspection bag with zero cooling mechanism! ■ is configured.
次に、上述した検査袋Ｗ１■の動作作用及び被温調体で
ある載置台■の温調方法例えば冷却方法を説明する。Next, the operation of the above-mentioned test bag W1 (2) and the temperature control method, for example, the cooling method, of the mounting table (2), which is the object to be temperature controlled, will be explained.
まず、図示しないハンドリングアーム等の搬送機構によ
り被検査体である半導体ウェハ■を、ＸＹステージ機能
を有する載置台（３）上に搬送し、載置する。そして、
位置合わせ等の処理を終えた後。First, a semiconductor wafer (2), which is an object to be inspected, is transported and placed on a mounting table (3) having an XY stage function by a transport mechanism such as a handling arm (not shown). and,
After completing processing such as alignment.
上記載置台■を上昇させて、ウェハ０表面に形成されて
いる所望する半導体チップの電極に、プローブカード■
の探針（イ）を接触させて電気的な特性を検査する。こ
の検査に際しては、完成品ＩＣの使用条件に適応させる
如く、低温下で実行する。Raise the mounting table ■ above and place the probe card ■ on the electrode of the desired semiconductor chip formed on the surface of wafer 0.
Test the electrical characteristics by touching the probe (a). This test is carried out at a low temperature to suit the usage conditions of the finished IC.
即ち、上記ウェハ■を低温状態に設定した載置台■によ
り間接的に冷却して検査が行なわれる。That is, the above-mentioned wafer (2) is indirectly cooled by the mounting table (4) set at a low temperature and then inspected.
この被温調体である載置台■の冷却方法は、タンク（１
１）内に貯留されて冷却された冷却液（］０）を載置台
（３）に液送し循環させることにより冷却される。即ち
、上記タンク（１１）内で、冷凍機（１３）に連設した
冷却コイル（１２）・により、冷却液（１０）を低温例
えば−１５〜−２５℃に冷却し、この冷却された冷却液
（１０）をポンプ（１５） （１６）の駆動により液送
管（１４ａ）及び流導管（７ａ）を介して上記載置台■
に供給する。そして、この載置台■内の流路（０を流通
し、この流通により熱交換されて載置台■の温度を−１
０−０℃程度に設定する。この時、より効率良く熱交換
させるために、上記載置台■内の流路（０を蛇行させて
長くすることが好ましい、そして、熱交換された冷却液
（１０）は、流導管（７ｂ）及び液送管（１４ｂ）を介
して上記タンク（１１）内に戻される。The cooling method for the mounting table ■, which is the object to be temperature controlled, is as follows:
1) The cooling liquid (]0) stored in the cooling liquid is sent to the mounting table (3) and circulated to be cooled. That is, in the tank (11), the cooling liquid (10) is cooled to a low temperature, for example, -15 to -25°C, by a cooling coil (12) connected to the refrigerator (13), and the cooled liquid is The liquid (10) is pumped by the pumps (15) and (16) through the liquid feed pipe (14a) and flow pipe (7a) to the above-mentioned mounting table.
supply to. Then, it flows through the flow path (0) in this mounting table ■, and through this circulation, heat is exchanged to lower the temperature of the mounting table ■ by -1.
Set to about 0-0℃. At this time, in order to exchange heat more efficiently, it is preferable to make the flow channel (0) in the above-mentioned mounting table meandering and to make it long, and the heat-exchanged cooling liquid (10) is passed through the flow conduit (7b). and is returned into the tank (11) via the liquid feed pipe (14b).
このように冷却液を循環させるが、この循環はポンプ（
１５）（１６）により行なわれる。即ち、上記ポンプ（
１５）により冷却液（１０）がタンク（１１）から載置
台■へ液送供給され、ポンプ（１６）により冷却液（ｉ
ｏ）が載置台■からタンク（１１）に吸引される。ここ
で。The coolant is circulated in this way, and this circulation is done by a pump (
15) (16). That is, the above pump (
15) supplies the cooling liquid (10) from the tank (11) to the mounting table ■, and the pump (16) supplies the cooling liquid (i
o) is sucked into the tank (11) from the mounting table (2). here.
上記冷却液（１０）を循環させる手段として上記液送供
給させるポンプ（１５）のみでも、上記冷却液（１０）
の循環は可能であるが、外気に対して冷却液循環路内の
液圧が上昇してしまう。この液圧が上昇すると、配管の
破裂や継手（８ａ） （８ｂ）からの液もれ等が発生す
る恐れがある。そのために、上記液圧を上昇させずに液
量を増やすことが必要となる。そこで、上記冷却液（１
０）を吸引駆動するポンプ（１６）を設けている。この
ため、上記ポンプ（１５）で圧力を加えて冷却液（１０
）を載置台■に供給しても、この載置台■に供給された
冷却液（１０）は、上記ポンプ（ｌｂ）により吸引され
、液圧が低下する。このポンプ（１５）及びポンプ（１
６）を同一のものを使用することで、上記載置台■及び
各配管内において液圧が大気圧に対して上昇することは
なく、上記配管の破裂や継手（８ａ）（８ｂ）等からの
液もれを防止することができる。そのため、冷却液循環
路により多くの冷却液（１０）を流すことが可能となり
、上記載置台■を精度良く安定した冷却が可能となる。Even if only the pump (15) for feeding and supplying the liquid is used as a means for circulating the cooling liquid (10), the cooling liquid (10)
Although it is possible to circulate the coolant, the liquid pressure in the coolant circulation path increases relative to the outside air. If this liquid pressure increases, there is a risk that pipes may burst or liquid may leak from the joints (8a) (8b). Therefore, it is necessary to increase the liquid amount without increasing the liquid pressure. Therefore, the above cooling liquid (1
0) is provided. For this reason, the pump (15) applies pressure to coolant (10
) is supplied to the mounting table (2), the cooling liquid (10) supplied to the mounting table (2) is sucked by the pump (lb), and the liquid pressure decreases. This pump (15) and pump (1
By using the same 6), the liquid pressure will not rise above the atmospheric pressure in the mounting stand ① and each pipe, and there will be no possibility of the pipe bursting or leaking from the joints (8a), (8b), etc. Liquid leakage can be prevented. Therefore, it becomes possible to flow a large amount of the cooling liquid (10) through the cooling liquid circulation path, and the above-mentioned mounting table (2) can be cooled accurately and stably.
このように、より多くの冷却液（１０）を、液送管（１
４ａ）及び流導管（７ａ）を介して載置台■に供給し、
そして、流導管（７ｂ）及び液送管（１４ｂ）を介して
りンク（１１）に循環させて冷却を行ない、載置台■に
載置されたウェハ■が低温下で検査される。In this way, more cooling liquid (10) can be supplied to the liquid feed pipe (1
4a) and the flow conduit (7a) to the mounting table ■;
Then, the liquid is circulated to the link (11) via the flow pipe (7b) and the liquid feed pipe (14b) for cooling, and the wafer (2) placed on the mounting table (2) is inspected at a low temperature.
上記実施例では、被温調体として検査装置の載置台を例
に上げて説明したが、温調を必要するものであれば何れ
でもよく１例えばエツチング装置。In the above embodiments, a mounting table for an inspection device was used as an example of the temperature-controlled object, but any object that requires temperature control may be used, such as an etching device.
アッシング装置、レジスト塗布・現像装置、成膜装置等
でも同様な効果が得られる。A similar effect can be obtained with an ashing device, a resist coating/developing device, a film forming device, etc.
また、上記実施例では、被温調体を冷却する例を説明し
たが、加熱や常温温調でも同様な効果が得られる。更に
、温調流体としてエチレングリコール水溶液である冷却
液を例に挙げて説明したが、これに限定するものではな
く１例えばヘリウムやエアー等の気体でも同様な効果が
得られる。Further, in the above embodiment, an example was explained in which the object to be temperature-regulated is cooled, but the same effect can be obtained by heating or controlling the temperature at room temperature. Furthermore, although the description has been given using a cooling liquid that is an aqueous ethylene glycol solution as the temperature regulating fluid, the present invention is not limited to this, and the same effect can be obtained by using a gas such as helium or air.
以上述べたようにこの実施例によれば、温調機構及び被
温調体間で温調流体を循環させて被温調体を温調するに
際し、上記被温調体へ温調流体を供給駆動する手段と、
被温調体から温調流体を吸引駆動する手段により、上記
温調流体を循環させて被温調体の温調を行なうことによ
り、上記被温調体内及びこの被温調体に温調流体を循環
させる配管内に大量の温調流体を流しても、温調流体を
供給駆動する手段及び吸引駆動する手段により上記温調
流体の圧力が大気圧に対して上昇することはなく、上記
配管の破裂や継手等からの流体のもれを防止することが
できる。この温調流体の圧力上昇をなくしたために、大
量の温調流体を被温調体に供給することができ、十分な
熱交換を実行することが可能となる。そのため、被温調
体を高精度で温調制御することができる。As described above, according to this embodiment, when the temperature regulating fluid is circulated between the temperature regulating mechanism and the temperature regulating body to regulate the temperature of the temperature regulating body, the temperature regulating fluid is supplied to the temperature regulating body. means for driving;
By circulating the temperature regulating fluid and controlling the temperature of the temperature controlled body by means of sucking and driving the temperature controlled fluid from the temperature controlled body, the temperature controlled fluid is supplied into the temperature controlled body and into the temperature controlled body. Even if a large amount of temperature regulating fluid flows through the piping that circulates the temperature regulating fluid, the pressure of the temperature regulating fluid will not rise relative to atmospheric pressure due to the means for supplying and driving the temperature regulating fluid and the means for suctioning and driving the temperature regulating fluid. rupture and leakage of fluid from joints, etc. can be prevented. Since this pressure increase in the temperature control fluid is eliminated, a large amount of temperature control fluid can be supplied to the temperature controlled object, and sufficient heat exchange can be performed. Therefore, the temperature of the object to be temperature regulated can be controlled with high precision.
第１図は本発明方法の一実施例を説明するための温調手
段を備えた検査装置の構成図である。FIG. 1 is a block diagram of an inspection apparatus equipped with temperature control means for explaining one embodiment of the method of the present invention.
Claims (1)
体を温調するに際し、上記被温調体へ温調流体を供給駆
動する手段と、被温調体から温調流体を吸引駆動する手
段により、上記温調流体を循環させて被温調体の温調を
行なうことを特徴とする温調方法。When controlling the temperature of the temperature-controlled body by circulating the temperature-controlled fluid between the temperature control mechanism and the temperature-controlled body, a means for supplying and driving the temperature-controlled fluid to the temperature-regulated body, and a means for supplying and driving the temperature-controlled fluid from the temperature-regulated body to the temperature-controlled body are provided. A temperature control method characterized in that the temperature of a body to be temperature controlled is controlled by circulating the temperature control fluid using means for sucking and driving the fluid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1037719A JP2649836B2 (en) | 1989-02-17 | 1989-02-17 | Temperature control method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1037719A JP2649836B2 (en) | 1989-02-17 | 1989-02-17 | Temperature control method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02216843A true JPH02216843A (en) | 1990-08-29 |
| JP2649836B2 JP2649836B2 (en) | 1997-09-03 |
Family
ID=12505318
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1037719A Expired - Lifetime JP2649836B2 (en) | 1989-02-17 | 1989-02-17 | Temperature control method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2649836B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003534559A (en) * | 2000-05-19 | 2003-11-18 | ユニシス コーポレイシヨン | System for regulating the temperature of an IC chip with a fluid whose temperature is rapidly controlled by a slow response cooler and a fast response heater |
| WO2013051099A1 (en) * | 2011-10-04 | 2013-04-11 | 富士通株式会社 | Testing jig and semiconductor device test method |
| CN111788666A (en) * | 2018-03-05 | 2020-10-16 | 东京毅力科创株式会社 | Inspection apparatus |
-
1989
- 1989-02-17 JP JP1037719A patent/JP2649836B2/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003534559A (en) * | 2000-05-19 | 2003-11-18 | ユニシス コーポレイシヨン | System for regulating the temperature of an IC chip with a fluid whose temperature is rapidly controlled by a slow response cooler and a fast response heater |
| WO2013051099A1 (en) * | 2011-10-04 | 2013-04-11 | 富士通株式会社 | Testing jig and semiconductor device test method |
| CN111788666A (en) * | 2018-03-05 | 2020-10-16 | 东京毅力科创株式会社 | Inspection apparatus |
| CN111788666B (en) * | 2018-03-05 | 2024-03-15 | 东京毅力科创株式会社 | Inspection apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2649836B2 (en) | 1997-09-03 |
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