CN217620645U - Mechanical arm and constant temperature control device - Google Patents
Mechanical arm and constant temperature control device Download PDFInfo
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- CN217620645U CN217620645U CN202220914776.4U CN202220914776U CN217620645U CN 217620645 U CN217620645 U CN 217620645U CN 202220914776 U CN202220914776 U CN 202220914776U CN 217620645 U CN217620645 U CN 217620645U
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Abstract
The utility model provides a robotic arm and thermostatic control device, include: the mechanical arm transversely extends to form at least two groups of mechanical fingers which are arranged in parallel; the mechanical arm and the mechanical finger are internally provided with an adsorption component and a temperature control component; the adsorption component comprises: the first vacuum air channel is internally arranged on the mechanical arm and used for air circulation, the first vacuum hole and the first vacuum hole are respectively communicated with two ends of the first vacuum air channel, the second vacuum air channel is internally arranged on the mechanical finger and is communicated with the first vacuum air channel, and a second vacuum hole is formed at one end of the second vacuum air channel, which is far away from the first vacuum air channel, so that the wafer is adsorbed through the first vacuum hole and the second vacuum hole; the temperature control assembly includes: the thermostatic pipeline is arranged in the mechanical arm and the mechanical finger and surrounds the outer sides of the first vacuum air passage and the second vacuum air passage. The uniformity of the temperature of the wafer during photoresist coating and developing is improved through application, and the yield of the wafer during photoresist coating and developing operation is improved.
Description
Technical Field
The utility model relates to a IC and LED technical field especially relate to a robotic arm and thermostatic control device.
Background
In the IC (integrated circuit) and LED (light-emitting diode) industry, wafers need to enter a hot plate for high-temperature baking during photoresist coating and developing processes, and the heat accumulation of the robot arm can be caused during the process of transporting the baked wafers. In the prior art, when a mechanical finger carries an unoperated wafer, the temperature is transferred to the unoperated wafer, so that the overall temperature uniformity of the wafer before photoresist coating and developing is influenced, the temperature uniformity before wafer operation directly influences the coating and developing effects of the photoresist, and the yield of the wafer in the photoresist coating and developing operation is reduced.
Accordingly, there is a need for an improved wafer handling robot in the prior art to solve the above-mentioned problems.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to disclose a robotic arm and thermostatic control device for a great deal of defect that robotic arm existed is used in the wafer transport among the solution prior art, especially in order to realize the temperature of accurate control robotic arm, reduce the heat-conduction influence of robotic arm to the wafer of not operation, thereby improved the homogeneity of wafer its self temperature when photoresist coating and development, improved the yields of wafer in carrying out photoresist coating and development operation.
To achieve the above object, in a first aspect, the present invention provides a robot arm, including: the mechanical arm extends transversely to form at least two groups of mechanical fingers which are arranged in parallel;
an adsorption component and a temperature control component are arranged in the mechanical arm and the mechanical finger;
the adsorption assembly includes: the first vacuum air channel is internally arranged in the mechanical arm and used for air circulation, the first vacuum air channel and the first vacuum hole are respectively communicated with two ends of the first vacuum air channel, the second vacuum air channel is internally arranged in the mechanical finger and is communicated with the first vacuum air channel, and a second vacuum hole is formed at one end of the second vacuum air channel, which is far away from the first vacuum air channel, so that the wafer is adsorbed through the first vacuum hole and the second vacuum hole;
the temperature control assembly includes: the constant temperature pipeline is internally arranged on the mechanical arm and the mechanical finger and surrounds the outer sides of the first vacuum air passage and the second vacuum air passage.
As a further improvement of the utility model, the constant temperature pipeline both ends are constructed respectively and are supplied constant temperature liquid to pour into and exhaust water inlet and delivery port, the end of mechanical finger is seted up in the vacuum hole of second.
In a second aspect, the present invention provides a thermostatic control device, including:
the mechanical base, the mechanical base is constructed out the water filling port of intercommunication water inlet, in order to pass through the water filling port to pour into thermostatic liquid into in the constant temperature pipeline, the intercommunication the second negative pressure hole in first negative pressure hole, the intercommunication the outlet of delivery port is in order to pass through the outlet discharge warp the thermostatic liquid that the delivery port flows to and
the mechanical arm is arranged on the top of the mechanical base and is used for connecting the mechanical base and the mechanical arm.
As a further improvement of the utility model, the mechanical base sets up the intercommunication the water injection pipe of water filling port, in order to pass through the water injection pipe is to water filling port transport constant temperature liquid, intercommunication the drain pipe of outlet, in order to pass through the constant temperature liquid of drain pipe discharge through the outlet outflow, intercommunication the third negative pressure hole in second negative pressure hole.
As a further improvement of the present invention, the present invention further comprises: the constant temperature component is provided with a liquid outlet pipe used for injecting constant temperature liquid into the water injection pipe, and a linking pipe used for flowing the constant temperature liquid is formed between the liquid outlet pipe and the water injection pipe.
As a further improvement, the drain pipe connection supplies the constant temperature liquid exhaust fluid-discharge tube, the thermostat configuration intercommunication the feed liquor pipe of fluid-discharge tube, the feed liquor pipe is used for receiving the fluid-discharge tube exhaust constant temperature liquid.
Compared with the prior art, the beneficial effects of the utility model are that:
the first negative pressure hole is used for extracting air in the first vacuum air passage and the second vacuum air passage, so that negative pressure is formed in the first vacuum air passage and the second vacuum air passage, and the first negative pressure hole and the second vacuum hole are used for adsorbing the wafer by virtue of the negative pressure when the wafer is contacted with the wafer through the first vacuum hole and the second vacuum hole, so that the wafer can be conveniently conveyed by the mechanical arm; meanwhile, the temperature of the mechanical arm is controlled by constant-temperature liquid flowing in the constant-temperature pipeline in a heat exchange mode, and the temperature of the constant-temperature liquid can be adjusted according to actual requirements, so that the aim of accurately controlling the temperature of the mechanical arm is fulfilled, the heat conduction influence of the mechanical arm on wafers which are not operated is reduced, the uniformity of the temperature of the wafers during photoresist coating and developing is improved, and the yield of the wafers during photoresist coating and developing operation is improved.
Drawings
Fig. 1 is a perspective view of the thermostatic control device including a robot arm according to the present invention;
fig. 2 is a cross-sectional view of the robot arm.
Detailed Description
The present invention will be described in detail with reference to the embodiments shown in the drawings, but it should be understood that these embodiments are not intended to limit the present invention, and that the functional equivalents, methods, or structural equivalents thereof, or substitutions thereof by those skilled in the art are all within the scope of the present invention.
It should be understood that in the present application, the terms "center", "longitudinal", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be considered as limiting the present disclosure.
It should be especially noted that, in the following embodiments, the term "lateral" refers to a direction parallel to the horizontal line or the horizontal plane.
Compared with the prior art, the robot arm 110 of the present embodiment (hereinafter, simply referred to as "robot arm 110") performs the wafer transferring operation, and the robot arm 110 can reduce the influence of the heat conduction of the robot arm 110 on the unprocessed wafer during the wafer transferring process, thereby improving the uniformity of the temperature of the wafer during the photoresist coating and developing process, and improving the yield of the wafer during the photoresist coating and developing process. The specific implementation of the thermostatic method performed by the robot and the thermostatic control device disclosed in the present application is described in detail below.
It should be noted that the objects processed by the transporting operation performed by the robot 110 disclosed in the present embodiment include, but are not limited to, silicon-based wafers, LED chips, liquid crystal display substrates, silicon nitride wafers, and other semiconductor devices, and in the present embodiment, a silicon-based wafer (i.e., a wafer) is taken as an example for illustration, and those skilled in the art can reasonably select specific parameters such as the temperature of the constant-temperature liquid, the type of the constant-temperature liquid, and the flow rate of the constant-temperature liquid according to the different objects processed by the robot 110.
Please refer to fig. 1 to 2, which illustrate an embodiment of a robot arm.
Referring to fig. 1 and 2, in the present embodiment, the robot arm 110 includes: the mechanical arm 111, the mechanical arm 111 extends transversely to form at least two groups of mechanical fingers 112 arranged in parallel; an adsorption component and a temperature control component are arranged in the mechanical arm 111 and the mechanical finger 112; the adsorption component comprises: a first vacuum air channel 113 internally arranged on the robot 111 and used for air circulation, a first negative pressure hole 114 and a first vacuum hole 115 respectively communicated with two ends of the first vacuum air channel 113, a second vacuum air channel 116 internally arranged on the robot finger 112 and communicated with the first vacuum air channel 113, a second vacuum hole 1122 formed at one end of the second vacuum air channel 116 far away from the first vacuum air channel 113, and a wafer is adsorbed by the robot 110 through the first vacuum hole 115 and the second vacuum hole 1122; the temperature control assembly includes: a thermostatic conduit 118 disposed inside the robot arm 111 and the robot finger 112, the thermostatic conduit 118 surrounding the first vacuum conduit 113 and the second vacuum conduit 116. It should be noted that at least two or more sets of the fingers 112 are disposed on the arm 111, and the two or more sets of the fingers 112 are disposed in parallel, so long as the wafer can be stably lifted. During the process of transporting the wafer by the robot 110, the first negative pressure hole 114 is used for extracting air from the first vacuum air channel 113, so that the first vacuum hole 115 communicating with the first vacuum air channel 113 can absorb the wafer, thereby realizing three-point absorption. Meanwhile, the second vacuum air channel 116 communicated with the first vacuum air channel 113 is also pumped by the first negative pressure hole 114, so that the second vacuum hole 1122 formed at one end of the second vacuum air channel 116 can adsorb the wafer, and the first vacuum hole 115 and the second vacuum hole 1122 can simultaneously adsorb the wafer by means of negative pressure when contacting the wafer, so that the wafer can be grabbed, and the wafer can be conveniently carried to a hot plate (not shown) by the mechanical arm 110 to be baked at high temperature.
Meanwhile, in the process of carrying the wafer baked at a high temperature by the robot 110, the wafer transfers its own high-temperature heat to the robot 110 by a heat conduction manner to increase the temperature of the robot 110, and the constant-temperature liquid circulating continuously inside the constant-temperature pipeline 118 can absorb the heat of the robot 110 by a heat exchange manner to keep the robot 110 at a constant temperature (the constant temperature can adjust the temperature of the constant-temperature liquid according to the actual use requirement), so as to achieve the purpose of accurately controlling the temperature of the robot 110, and to keep the robot 110 at a constant temperature state, so that the heat transferred to the wafer by the robot 110 can be cooled and maintained at a constant temperature by the constant-temperature liquid circulating continuously inside the constant-temperature pipeline 118 in a heat exchange manner, and further, the temperature of the robot 110 can be adjusted by the constant-temperature liquid circulating continuously, so that the wafer position on the robot 110 can also be in a constant temperature state, thereby maintaining the uniformity of the overall temperature of the wafer, and enabling the temperature of the wafer to meet the process requirements of subsequent photoresist coating and developing operations, and further improving the yield of the photoresist coating and developing operations of the wafer.
As shown in fig. 2, the thermostatic pipe 118 has a water inlet 119 and a water outlet 117 at two ends thereof for injecting and discharging the thermostatic liquid, and a second vacuum hole 1122 is formed at a distal end 1121 of the mechanical finger 112. The water inlet 119 allows a constant temperature liquid to be injected into the constant temperature pipeline 118, so that the constant temperature liquid will flow through the constant temperature pipeline 118 along the arrow c direction in fig. 2, so that the constant temperature liquid absorbs heat of the robot arm 110 by a heat exchange method when flowing through the constant temperature pipeline 118, and finally the constant temperature liquid after absorbing heat flows through the water outlet 117 and is discharged, so that the constant temperature liquid circulates in the constant temperature pipeline 118, and the robot arm 110 can be kept in a constant temperature state.
Based on the technical solution of the robot arm disclosed in the foregoing embodiment, the present embodiment further discloses a thermostatic control device.
Referring to fig. 1 and 2, in the present embodiment, the thermostat control device includes: a thermostat 200, wherein the thermostat 200 is provided with a liquid outlet pipe 201 for injecting a constant temperature liquid into the water injection pipe 101, and a connection pipe 203 for flowing the constant temperature liquid is formed between the liquid outlet pipe 201 and the water injection pipe 101. The constant temperature liquid in the thermostat 200 is injected into the connecting pipe 203 through the liquid outlet pipe 201, so that the constant temperature liquid flows into the water injection pipe 101 in the direction of the arrow a in fig. 2, and the constant temperature liquid that is not circulated in the thermostat 200 flows into the mechanical base 100.
The drain pipe 102 is connected to a drain pipe 204 for discharging a constant temperature liquid, and the thermostat 200 is provided with a liquid inlet pipe 202 connected to the drain pipe 204, the liquid inlet pipe 202 receiving the constant temperature liquid discharged from the drain pipe 204. The drain pipe 102 is used for discharging the circulated constant temperature liquid into the drain pipe 204, the constant temperature liquid entering the drain pipe 204 flows into the liquid inlet pipe 202 along the arrow b direction in fig. 2, so that the constant temperature liquid flows through the liquid inlet pipe 202 to enter the thermostat 200, the thermostat 200 cools the constant temperature liquid flowing into the robot 110 after heat exchange, the temperature of the constant temperature liquid flowing into the thermostat 200 is consistent with that of the constant temperature liquid in the thermostat 200, and the thermostat 200 can be conveniently recycled, so that the thermostat 200 can continuously provide the constant temperature liquid for the robot 110 through the liquid outlet pipe 201, and the robot 110 can be kept in a constant temperature state.
As shown in fig. 1 and 2, the robot base 100 includes a water inlet 104 connected to a water inlet 119, for injecting a constant temperature liquid into a constant temperature pipeline 118 through the water inlet 104, a second negative pressure hole 106 connected to a first negative pressure hole 114, a water outlet 105 connected to a water outlet 117, for discharging the constant temperature liquid flowing out through the water outlet 117 through the water outlet 105, and a sealing ring (not shown) disposed on a top of the robot base 100 and connected between the first negative pressure hole 114 and the second negative pressure hole 106, as in the robot arm 110 according to the above-described embodiments. The sealing ring prevents a gap from being formed between the first negative pressure hole 114 and the second negative pressure hole 106, and air leakage is prevented from affecting vacuum environments in the first vacuum air duct 113 and the second vacuum air duct 116. The second negative pressure hole 106 is communicated with the first negative pressure hole 114, so that the second negative pressure hole 106 can extract air in the first vacuum air channel 113 through the first negative pressure hole 114 communicated with the second negative pressure hole 106, and the first vacuum hole 115 communicated with the first vacuum air channel 113 can adsorb the wafer; meanwhile, constant temperature liquid is injected into the water inlet 119 of the robot arm 110 through the water inlet 104, so that the constant temperature liquid enters the constant temperature pipeline 118 through the water inlet 119 and flows through the constant temperature pipeline 118 along the arrow c direction in fig. 2, when the constant temperature liquid flows through the constant temperature pipeline 118, the heat of the robot arm 110 is absorbed through a heat exchange manner, and finally the constant temperature liquid absorbing the heat flows into the water outlet 105 through the water outlet 117 and is discharged.
The machine base 100 is provided with a water filling pipe 101 communicating with a water filling port 104 to supply a constant temperature liquid to the water filling port 104 through the water filling pipe 101, a water discharge pipe 102 communicating with a water discharge port 105 to discharge the constant temperature liquid flowing out through the water discharge port 105 through the water discharge pipe 102, and a third negative pressure hole 103 communicating with a second negative pressure hole 106. The constant-temperature liquid discharged through the connection pipe 203 is injected into the water injection port 104 through the water injection pipe 101, so that the water injection port 104 can inject the constant-temperature liquid into the water inlet 119, and the constant-temperature liquid can be conveniently provided for the mechanical arm 110; meanwhile, the drain pipe 102 is used for injecting the constant temperature liquid discharged from the drain port 105 into the drain pipe 204, so that the constant temperature liquid can circulate by flowing through the liquid inlet pipe 202 to enter the thermostat 200; the third negative pressure hole 103 is connected to a plant vacuum device (not shown), so that the plant vacuum device can extract the air in the first vacuum air channel 113 and the second vacuum air channel 116 through the third negative pressure hole 103 and the second negative pressure hole 106, and the first vacuum hole 115 and the second vacuum hole 1122 can adsorb and fix the wafer.
The above list of details is only for the practical implementation of the present invention, and they are not intended to limit the scope of the present invention, and all equivalent implementations or modifications that do not depart from the technical spirit of the present invention should be included in the scope of the present invention.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (6)
1. A robot arm, comprising:
the mechanical arm extends transversely to form at least two groups of mechanical fingers which are arranged in parallel;
it is characterized in that the preparation method is characterized in that,
an adsorption component and a temperature control component are arranged in the mechanical arm and the mechanical finger;
the adsorption assembly includes: the first vacuum air channel is internally arranged in the mechanical arm and used for air circulation, the first vacuum air channel and the first vacuum hole are respectively communicated with two ends of the first vacuum air channel, the second vacuum air channel is internally arranged in the mechanical finger and is communicated with the first vacuum air channel, and a second vacuum hole is formed at one end of the second vacuum air channel, which is far away from the first vacuum air channel, so that the wafer is adsorbed through the first vacuum hole and the second vacuum hole;
the temperature control assembly includes: the constant-temperature pipeline is internally arranged on the mechanical arm and the mechanical finger and surrounds the outer sides of the first vacuum air passage and the second vacuum air passage.
2. The robot arm according to claim 1, wherein the thermostatic conduit has an inlet and an outlet at two ends thereof for injecting and discharging the thermostatic liquid, and the second vacuum hole is disposed at the end of the robot finger.
3. A thermostatic control device, comprising:
a machine base, and
the robot arm of claim 2 disposed atop the robot base;
the mechanical base is constructed out the water filling port of intercommunication water inlet to through the water filling port to inject thermostatic liquid into in the constant temperature pipeline, the intercommunication the second negative pressure hole in first negative pressure hole, the intercommunication the outlet of delivery port, in order to pass through the outlet discharge warp the thermostatic liquid of delivery port outflow.
4. A thermostat control device according to claim 3,
the mechanical base is provided with a communicating water injection pipe of the water injection port, so that the water injection pipe can convey constant-temperature liquid to the water injection port and communicate with the water discharge pipe of the water discharge port, so that the constant-temperature liquid discharged from the water discharge port can be communicated with the third negative pressure hole of the second negative pressure hole.
5. The thermostat control device of claim 4, further comprising:
the thermostat is provided with a liquid outlet pipe used for injecting constant-temperature liquid into the water injection pipe, and a connecting pipe used for allowing the constant-temperature liquid to flow is formed between the liquid outlet pipe and the water injection pipe.
6. The thermostat device of claim 4, wherein the drain pipe is connected to a drain pipe for draining the thermostatic liquid, and the thermostat is provided with a liquid inlet pipe communicated with the drain pipe, the liquid inlet pipe being used for receiving the thermostatic liquid drained from the drain pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220914776.4U CN217620645U (en) | 2022-04-20 | 2022-04-20 | Mechanical arm and constant temperature control device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220914776.4U CN217620645U (en) | 2022-04-20 | 2022-04-20 | Mechanical arm and constant temperature control device |
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| Publication Number | Publication Date |
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| CN217620645U true CN217620645U (en) | 2022-10-21 |
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| CN202220914776.4U Active CN217620645U (en) | 2022-04-20 | 2022-04-20 | Mechanical arm and constant temperature control device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117507008A (en) * | 2023-11-29 | 2024-02-06 | 无锡艾方芯动自动化设备有限公司 | Temperature control device and method for mechanical arm |
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2022
- 2022-04-20 CN CN202220914776.4U patent/CN217620645U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117507008A (en) * | 2023-11-29 | 2024-02-06 | 无锡艾方芯动自动化设备有限公司 | Temperature control device and method for mechanical arm |
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