JP2021174963A - Component crimping device and component crimping method - Google Patents

Abstract

To provide a component crimping device and the like capable of performing heat crimping while properly cooling a circuit board.SOLUTION: A component crimping device 100 includes: a stage 49 on which a circuit board 3 is placed; a backup part 44 that supports an end 3e of the circuit board 3 placed on the stage 49; a heat crimping head 48 that heat-crimps the circuit board 3 supported by the backup part 44; a cooling unit 120 that cools the circuit board 3 by blowing a cooling gas to the circuit board 3; a temperature measuring unit 300 that measures a temperature of the circuit board 3; and a control unit 2a that controls the cooling unit 120. The cooling unit 120 includes: a gas blowing port 121 for blowing the cooling gas onto circuit board 3; and a flow rate adjustment unit 124 that adjusts a flow rate of the cooling gas supplied to the gas blowing port 121. The control unit 2a controls the flow rate adjustment unit 124 to adjust the flow rate of the cooling gas to be supplied to the gas blowing port 121 on the basis of the temperature of the circuit board 3 measured by the temperature measuring unit 300.SELECTED DRAWING: Figure 3

Description

The present invention relates to a component crimping device and a component crimping method for thermocompression bonding a component to a substrate.

Conventionally, a drive circuit or the like is provided via an ACF (Anisotropic Conductive Film), which is an anisotropic conductive member attached as an adhesive member to the end of a substrate such as a liquid crystal panel or a display panel such as an organic EL (Electroluminescence) panel. There is a component crimping device for thermocompression bonding an electronic component (hereinafter, simply referred to as “component”) to a substrate (see, for example, Patent Document 1).

The mounting device, which is an example of the component crimping device disclosed in Patent Document 1, includes a cooling device for cooling a liquid crystal panel, which is an example of a substrate.

By cooling the liquid crystal panel with a cooling device, deterioration of the liquid crystal panel due to heat can be suppressed.

Further, Patent Document 1 discloses a method of blowing a cooling gas onto a substrate as an example of a cooling method.

Japanese Unexamined Patent Publication No. 2001-230577

However, if the cooling gas is not properly sprayed on the substrate, such as when the amount of the cooling gas sprayed is insufficient or the position where the cooling gas is sprayed deviates from the predetermined position, the position to be cooled on the substrate is not cooled. That is, there is a problem that the substrate is not cooled properly.

The present invention provides a component crimping device or the like capable of thermocompression bonding while appropriately cooling a substrate.

The component crimping device according to one aspect of the present invention heats components on a stage on which a substrate is placed, a backup unit that supports the substrate mounted on the stage, and the substrate supported by the backup unit. A thermal crimping head for crimping, a cooling unit that cools the substrate by blowing a cooling gas onto the substrate while the substrate is supported by the backup unit, and a temperature measuring unit that measures the temperature of the substrate. The cooling unit includes a control unit that controls the cooling unit, and the cooling unit determines a gas outlet for blowing the supplied cooling gas onto the substrate and a flow rate of the cooling gas supplied to the gas outlet. The control unit includes a flow rate adjusting unit for adjusting, and the control unit causes the flow rate adjusting unit to adjust the flow rate of the cooling gas supplied to the gas outlet based on the temperature of the substrate measured by the temperature measuring unit. ..

Further, the component crimping method according to one aspect of the present invention includes a mounting step of mounting a substrate on a stage, a support step of supporting the substrate mounted on the stage by a backup unit, and a support by the backup unit. By the heat crimping step of heat-bonding the parts to the substrate with the heat-bonding head, and by blowing the cooling gas onto the substrate from the gas outlet provided in the cooling unit while the substrate is supported by the backup unit. A cooling step for cooling the substrate and a temperature measuring step for measuring the temperature of the substrate are provided. In the cooling step, the substrate is supplied to the gas outlet based on the temperature of the substrate measured in the temperature measuring step. The flow rate of the cooling gas is adjusted.

It should be noted that these comprehensive or specific embodiments may be realized by a recording medium such as a system, a method, an integrated circuit, a computer program, or a computer-readable CD-ROM, and the system, the method, the integrated circuit, or the computer program. And any combination of recording media may be realized.

According to the present invention, it is possible to provide a component crimping device or the like capable of thermocompression bonding while appropriately cooling a substrate.

FIG. 1 is a plan view showing a component mounting line according to an embodiment. FIG. 2 is a schematic configuration diagram showing a component mounting line according to an embodiment. FIG. 3 is a block diagram showing a functional configuration of the component crimping device according to the embodiment. FIG. 4 is a perspective view showing the main crimping portion according to the embodiment. FIG. 5 is a side view showing the main crimping portion according to the embodiment. FIG. 6 is a schematic view showing a cooling unit according to the embodiment. FIG. 7 is a schematic view showing a nozzle according to the embodiment. FIG. 8 is a diagram for explaining the position where the substrate is thermocompression bonded and the position of the thermocouple. FIG. 9 is a block diagram for explaining the processing of the control unit and the flow of the cooling gas included in the component crimping device according to the embodiment. FIG. 10 is a flowchart for explaining a processing procedure of an operation executed by the component crimping apparatus according to the embodiment.

Hereinafter, the component crimping device and the like according to the embodiment of the present invention will be described in detail with reference to the drawings. It should be noted that all of the embodiments described below show a specific example of the present invention. Therefore, the numerical values, shapes, materials, components, arrangement and connection forms of the components, steps and the order of steps shown in the following embodiments are examples, and are not intended to limit the present invention. Therefore, among the components in the following embodiments, the components not described in the independent claims indicating the highest level concept of the present invention will be described as arbitrary components.

Further, each figure is a schematic view and is not necessarily exactly illustrated. Further, in each figure, the same components are designated by the same reference numerals.

Further, in the present specification and drawings, the X-axis, the Y-axis, and the Z-axis represent the three axes of the three-dimensional Cartesian coordinate system. The X-axis and the Y-axis are orthogonal to each other and both are orthogonal to the Z-axis. Further, in the following embodiments, the X-axis positive direction of the substrate transport direction may be set, the Z-axis positive direction may be set upward, and the Z-axis negative direction may be set as downward.

(Embodiment)
[Overview]
First, an overall outline of the component mounting line including the component crimping device according to the embodiment will be described.

FIG. 1 is a plan view of the component mounting line 1 according to the embodiment. FIG. 2 is a schematic configuration diagram of a component mounting line 1 according to an embodiment.

The component mounting line 1 is a component mounting system for producing a liquid crystal panel or the like, and an electronic component such as a drive circuit (hereinafter referred to as a component 5) is thermocompression bonded to a substrate 3. Specifically, the component mounting line 1 is a device in which an anisotropic conductive member, ACF6, is attached to a substrate 3 on which an electrode portion 4 is formed, and the substrate 3 and the component 5 are thermocompression bonded via the ACF6. be.

The component mounting line 1 includes a board loading section 10, a sticking section 20, a temporary crimping section 30, a main crimping section 40, a board loading section 50, a transport section 60, and a computer 2. In FIG. 1, the computer 2 is shown as a functional block. The computer 2 is connected to each device such as the sticking portion 20, the temporary crimping portion 30, and the main crimping portion 40 by wireless communication or by wire communication by a control line or the like, and controls each device.

The substrate carry-in portion 10, the sticking portion 20, the temporary crimping portion 30, the main crimping portion 40, and the substrate carry-out portion 50 are connected in this order. In the component mounting line 1, the component 5 is mounted on each of a plurality of electrode portions 4 provided on the peripheral edge of a rectangular substrate 3 such as a liquid crystal panel substrate carried in from the substrate carry-in portion 10 on the upstream side to which the substrate 3 is conveyed. The component mounting work to be performed is executed, and the board 3 on which the component 5 is mounted is carried out from the board carry-out unit 50. Each of the plurality of electrode portions 4 is composed of, for example, a plurality of electrodes.

The board loading section 10 includes a stage 11 provided on the base 1a. The substrate 3 on which the electrode portion 4 is formed is placed on the stage 11.

The sticking portion 20 is a device that performs a sticking operation of sticking the ACF 6 which is an adhesive member to the electrode portion 4 of the substrate 3. The sticking portion 20 includes a stage moving portion 21 and a sticking mechanism 22.

The stage moving unit 21 is a mechanism for moving the substrate 3. The stage moving unit 21 includes, for example, an X-axis table movable in the X-axis direction, a Y-axis table movable in the Y-axis direction, a Z-axis table movable in the Z-axis direction, and a stage 23. The stage moving unit 21 moves the substrate 3 mounted on the stage 23 by the X-axis table, the Y-axis table, and the Z-axis table.

The sticking mechanism 22 includes a plurality of sticking heads arranged in the X-axis direction above the base 1b. In the present embodiment, the sticking mechanism 22 includes two sticking heads. Each sticking head includes a supply unit for supplying ACF6 and a sticking tool for sticking ACF6 to the substrate 3. The plurality of sticking heads stick the ACF 6 supplied from the supply section to the positions corresponding to the plurality of electrode sections 4 on the substrate 3.

The temporary crimping portion 30 is a device that executes a temporary crimping process in which the component 5 is mounted at the position where the ACF 6 is stuck on the sticking portion 20 on the substrate 3 and temporarily crimped.

The temporary crimping portion 30 includes a stage moving portion 31, a component mounting mechanism 32, and a component supply unit 33.

The stage moving unit 31 is a mechanism for moving the substrate 3. The stage moving unit 31 includes, for example, an X-axis table movable in the X-axis direction, a Y-axis table movable in the Y-axis direction, a Z-axis table movable in the Z-axis direction, and a stage 37.

The stage moving portion 31 has the same structure as the stage moving portion 21 of the sticking portion 20, and the substrate 3 is held by the X-axis table, the Y-axis table, and the Z-axis table and moved in a horizontal plane to move up and down. It has the function of moving up and down in the direction and rotating around the Z axis.

The component mounting mechanism 32 is provided on the base 1b, and includes a mounting head, a mounting head moving mechanism, and a mounting support base. The mounting head freely moves in the horizontal plane by the mounting head moving mechanism, moves up and down in the Z-axis direction, and picks up the component 5 supplied by the component supply unit 33 from above. The component mounting mechanism 32 temporarily crimps the component 5 to the substrate 3 by mounting the picked up component 5 on the ACF 6 and pressing the component 5 together with the substrate 3 against the mounting support.

The component supply unit 33 is a mechanism for supplying the component 5 to the component mounting mechanism 32.

The main crimping portion 40 is a device that executes a main crimping step (that is, a thermocompression bonding step) of main crimping (that is, thermocompression bonding) the component 5 temporarily crimped to the substrate 3 by the temporary crimping portion 30 to the substrate 3.

By doing so, the electrode portion 4 formed on the substrate 3 and the component 5 are electrically connected via the ACF 6. In the present embodiment, the main crimping portion 40 thermocompression-bonds the component 5 to the substrate 3 while cooling the substrate 3 by the cooling portion 120. The specific configuration of the crimping portion 40 will be described later.

The substrate carry-out portion 50 includes a stage 51 mounted on the base 1c, and holds the substrate 3 conveyed from the main crimping portion 40 on the stage 51. The substrate 3 held by the substrate carry-out unit 50 is carried out to another device on the downstream side, or is taken out from the stage 51 by an operator.

The transport unit 60 is a device that transports the substrate 3. Specifically, the transport unit 60 transfers the substrate 3 carried into the substrate carry-in portion 10 to the sticking portion 20, the temporary crimping portion 30, the main crimping portion 40, and the substrate carry-out portion 50 in this order. Transport between. The transport portion 60 is arranged in the front region (Y-axis negative direction side) of the sticking portion 20, the temporary crimping portion 30, and the main crimping portion 40.

The transfer unit 60 is placed on the base 1a, the base 1b, and the moving base 61 extending in the X-axis direction over the base 1c, in order from the upstream side, the substrate transfer mechanism 62A, the substrate transfer mechanism 62B, and the substrate transfer mechanism 62C. , And a substrate transfer mechanism 62D.

The substrate transport mechanisms 62A to 62D include a base 63 and one or more arm units 64, respectively. In this embodiment, the case where the substrate transport mechanisms 62A to 62D each include two arm units 64 is illustrated.

The base 63 is provided on the moving base 61 and freely moves in the X-axis direction. Two arm units 64 are provided side by side in the X-axis direction on the base portion 63. The arm unit 64 is provided with one or more arm-shaped suction nozzles extending in the horizontal direction arranged side by side in the X-axis direction, and the arm is provided with a suction pad with the suction surface facing downward. The arm unit 64 sucks the substrate 3 from above via the suction pad provided on the suction nozzle, and conveys the sucked substrate 3.

For example, the substrate transfer mechanism 62A receives the substrate 3 mounted on the stage 11 of the substrate carry-in portion 10 and delivers it to the stage 23 of the attachment portion 20. Further, for example, the substrate transport mechanism 62B receives the substrate 3 from the stage 23 of the sticking portion 20 and delivers it to the stage 37 of the temporary crimping portion 30. Further, for example, the substrate transfer mechanism 62C receives the substrate 3 from the stage 37 of the temporary crimping portion 30 and delivers it to the stage 49 of the main crimping portion 40. Further, for example, the substrate transfer mechanism 62D receives the substrate 3 from the stage 49 of the main crimping portion 40 and delivers it to the stage 51 of the substrate carry-out portion 50.

The computer 2 is a control device for controlling the operation of each device included in the component crimping device 100 and the component mounting line 1. The computer 2 includes a control unit 2a (see FIG. 3) and a storage unit 2b (see FIG. 3).

The control unit 2a controls the stage moving portion 21 of the sticking portion 20, the stage moving portion 31 of the temporary crimping portion 30, the stage moving portion 41 of the main crimping portion 40, and the transporting portion 60, and works on the substrate 3 for each operation. The board transfer work of transferring to the next work unit is executed between the units. The transfer of the substrate 3 from the upstream side to the downstream side in the substrate transfer work is performed synchronously between the work units.

Further, the control unit 2a controls the sticking portion 20, the temporary crimping portion 30, and the main crimping portion 40 to thermocompression-bond the component 5 to the substrate 3 via the ACF 6.

The control unit 2a is, for example, stored in the storage unit 2b and is realized by a control program for controlling each device included in the component mounting line 1 and a CPU (Central Processing Unit) that executes the control program.

The storage unit 2b conveys the size of the substrate 3 such as the liquid crystal panel substrate manufactured by the component mounting line 1, the type of the component 5 to be mounted on the substrate 3, the mounting position, the mounting direction, and the substrate 3 between the working units. It stores various data necessary for component mounting work such as timing to perform, a control program executed by the control unit 2a, and the like. The storage unit 2b is realized by a ROM (Read Only Memory), a RAM (Random Access Memory), or the like.

[composition]
Subsequently, a specific configuration of the component crimping device 100 will be described.

FIG. 3 is a block diagram showing a functional configuration of the component crimping device 100 according to the embodiment. FIG. 4 is a perspective view showing the main crimping portion 40 according to the embodiment. FIG. 5 is a side view showing the main crimping portion 40 according to the embodiment. FIG. 6 is a schematic view showing the cooling unit 120 according to the embodiment. FIG. 7 is a schematic view showing the nozzle 214 according to the embodiment. FIG. 8 is a diagram for explaining the position where the substrate 3 is thermocompression bonded and the position of the thermocouple 310.

In each figure, the direction in which the cooling gas is blown out from the gas outlet 121 is indicated by a broken line arrow.

The component crimping device 100 is a device that thermocompression-bonds a component 5 to a substrate 3 via an ACF 6 that is temporarily crimped to an electrode portion 4 of the substrate 3 by a temporary crimping portion 30 in a component mounting line 1 that produces a liquid crystal panel or the like. ..

In the present embodiment, the component crimping device 100 will be described as including the computer 2 included in the component mounting line 1. For example, the computer 2 that controls each component of the component crimping device 100 may be the same as the computer that controls each device such as the sticking portion 20 and the temporary crimping portion 30 other than the component crimping device 100 included in the component mounting line 1. And may be different.

As shown in FIG. 3, the component crimping device 100 includes a main crimping unit 40, a cooling unit 120, a temperature measuring unit 300, and a computer 2.

Further, as shown in FIGS. 3 to 5, the main crimping portion 40 includes a stage 49, a stage moving portion 41, a thermocompression bonding head 48, and a backup portion 44.

As shown in FIGS. 4 and 5, the stage 49 is a table on which a substrate 3 having an electrode portion 4 on which the component 5 is thermocompression bonded is mounted on an end portion 3e. Specifically, the stage 49 is a table on which the substrate 3 on which the electrode portion 4 to which the ACF 6 is attached is formed at the end portion 3e is placed.

In the present embodiment, the substrate 3 includes an upper substrate 3a, a lower substrate 3b, a polarizing plate 3c, and a polarizing plate 3d.

The upper substrate 3a and the lower substrate 3b are substrates on which a liquid crystal display or the like is sandwiched and wiring or the like is formed. The upper substrate 3a and the lower substrate 3b are, for example, glass substrates, respectively. In the present embodiment, the electrode portion 4 is formed at the end portion 3e of the lower substrate 3b.

The polarizing plate 3c and the polarizing plate 3d are polarizing plates sandwiching the upper substrate 3a and the lower substrate 3b. The substrate 3 is thermocompression-bonded to the component 5 with the polarizing plates 3c and 3d provided.

On the stage 49, the substrate 3 to which the component 5 is temporarily crimped by the temporary crimping portion 30 is placed by the conveying portion 60 (specifically, the substrate conveying mechanism 62C).

The stage moving portion 41 has the same structure as the stage moving portion 21 of the sticking portion 20, and moves the stage 49 on which the substrate 3 is placed in a horizontal plane, moves it up and down in the vertical direction, and rotates it around the Z axis. It is a device. For example, the stage moving unit 41 moves the stage 49 between the position where the substrate 3 is placed on the stage 49 and the position where the component 5 is thermocompression bonded to the substrate 3 by the thermocompression bonding head 48.

The stage moving unit 41 includes, for example, an X-axis table that is movable in the X-axis direction, a Y-axis table that is movable in the Y-axis direction, and a Z-axis table that is movable in the Z-axis direction. The stage moving unit 41 includes an X-axis table that is movable in the X-axis direction, a Y-axis table that is movable in the Y-axis direction, a Z-axis table that is movable in the Z-axis direction, and a stage on the base 1b in order from the bottom. 49 and 49 are provided in an overlapping manner.

The thermocompression bonding head 48 is a head for thermocompression bonding the component 5 to the electrode portion 4 of the end portion 3e of the substrate 3 supported by the backup portion 44. In the present embodiment, the component crimping device 100 includes a plurality of thermocompression bonding heads 48.

The plurality of thermocompression bonding heads 48 are arranged side by side in a row above the backup unit 44. With the plurality of thermocompression bonding heads 48, the operator adjusts the thermocompression bonding heads 48 to desired positions, so that the distance between the thermocompression bonding heads 48 can be changed according to the distance between the parts 5 temporarily crimped to the substrate 3. It is attached to the head moving mechanism 43 (more specifically, the guide portion 43b) so as to be able to do so.

Further, the thermocompression bonding head 48 has a built-in heating portion such as a heater, and is heated to a predetermined temperature by the heating portion before crimping the component 5. The thermocompression bonding head 48 is lowered by the drive of the pressurizing mechanism 47, and presses the component 5 mounted on the edge (end 3e) of the substrate 3 against the substrate 3 via the protective sheet 220 while heating the component 5. The component 5 is thermocompression bonded to the substrate 3. At this time, the ACF 6 is cured by the heat generated from the thermocompression bonding head 48.

As shown in FIG. 4, the thermocompression bonding head 48 is connected to the pressurizing mechanism 47 via a rod 47a.

The pressurizing mechanism 47 is a mechanism that supports the rod 47a so as to be vertically retractable. A thermocompression bonding head 48 is provided at the lower end of the rod 47a. The pressurizing mechanism 47 is attached to the head moving mechanism 43 by the attaching member 46. Specifically, the pressurizing mechanism 47 is attached to the guide portion 43b via the attachment member 46 so that the position of the pressurizing mechanism 47 can be adjusted in the X-axis direction with respect to the base portion 43a. The pressurizing mechanism 47 includes a motor or the like for moving the thermocompression bonding head 48 up and down.

The head moving mechanism 43 is a mechanism for moving the thermocompression bonding head 48. The head moving mechanism 43 includes a base portion 43a and a guide portion 43b.

The base portion 43a is a base provided with a guide portion 43b to which a plurality of thermocompression bonding heads 48 can be freely adjusted in the X-axis direction. The base portion 43a is provided with a pair of guide portions 43b extending in the X-axis direction.

The guide portion 43b is a guide in which a plurality of rectangular flat plate-shaped mounting members 46 arranged in a vertical posture are mounted so as to be adjustable in the X-axis direction.

The backup unit 44 is a support base that is arranged adjacent to the stage 49 and supports the end portion 3e of the substrate 3 mounted on the stage 49 from below.

The cooling unit 120 is a mechanism for cooling the substrate 3 with the cooling gas by blowing the cooling gas onto the substrate 3 while the substrate 3 is supported by the backup unit 44. Specifically, the cooling unit 120 cools the substrate 3 by blowing out the cooling gas supplied from the gas pipe 210 from the gas outlet 121 and blowing the cooling gas onto the substrate 3.

The cooling unit 120 includes a gas outlet 121, a flow rate adjusting unit 124, and a flow rate sensor 125.

The gas outlet 121 is a mechanism for blowing the supplied cooling gas onto the substrate 3. In the present embodiment, the gas outlet 121 is an opening provided in the nozzle 214.

Further, in the present embodiment, the cooling unit 120 includes a plurality of gas outlets 121. Cooling gas is blown out from each of the plurality of gas outlets 121. Each of the plurality of gas outlets 121 is arranged so as to blow the cooling gas to different positions (sites) on the substrate 3. In other words, the substrate 3 is cooled at a plurality of different locations by the cooling gas blown out from each of the plurality of gas outlets 121.

The flow rate adjusting unit 124 is a device for adjusting (adjusting) the flow rate of the cooling gas supplied to the gas outlet 121. That is, the flow rate adjusting unit 124 adjusts the flow rate of the cooling gas to be blown onto the substrate 3 from the gas outlet 121. The flow rate adjusting unit 124 is, for example, an electromagnetic valve whose flow rate can be adjusted. The method of adjusting the flow rate of the cooling gas supplied by the flow rate adjusting unit 124 to the gas outlet 121 is not particularly limited. The flow rate adjusting unit 124 may be, for example, an opening capable of adjusting the passing amount of the cooling gas (for example, having a variable diameter), or a solenoid valve for switching whether or not the cooling gas can pass (that is, switching on / off). .. In this case, the flow rate adjusting unit 124 may adjust the flow rate of the cooling gas supplied to the gas outlet 121 per unit time.

The flow rate sensor 125 is a sensor for measuring the flow rate of the cooling gas supplied to the gas outlet 121. The flow rate sensor 125 may be a so-called impeller type flow meter including an impeller that is rotated by the cooling gas, as long as the control unit 2a can acquire the flow rate of the cooling gas. Alternatively, the flow rate sensor 125 may be a pressure sensor that detects the air pressure of the cooling gas. In this case, for example, the control unit 2a calculates and acquires the flow rate of the cooling gas by converting the air pressure (value) of the cooling gas detected by the pressure sensor based on a predetermined calculation formula. You may. The predetermined calculation formula may be arbitrarily determined in advance.

Further, the cooling unit 120 cools the substrate 3 by blowing a cooling gas onto the substrate 3 from the side opposite to the thermocompression bonding head 48.

For example, the cooling unit 120 is attached to a table or the like on which the backup unit 44 is removably arranged by bolts or the like. The cooling unit 120 cools the substrate 3 from the side opposite to the thermocompression bonding head 48 with respect to the substrate 3 in a state where the substrate 3 is supported by the backup unit 44, for example.

The type of cooling gas is not particularly limited. In the present embodiment, the cooling gas is air at room temperature of about 25 ° C.

As shown in FIG. 6, the cooling unit 120 includes a gas supply source 211, a gas pipe 210, an electromagnetic valve 212, a speed controller 213, and a nozzle 214.

The gas supply source 211 is a gas tank for supplying cooling gas.

The gas pipe 210 is a pipe that is connected to the gas supply source 211 and the solenoid valve 212 and supplies the cooling gas supplied from the gas supply source 211 to the solenoid valve 212.

The solenoid valve 212 is connected to the speed controller 213 via a gas pipe 210, and is a solenoid valve for switching whether or not to blow out the cooling gas supplied from the gas supply source 211 from the nozzle 214.

The speed controller 213 is connected to the nozzle 214 via the gas pipe 210, and adjusts the flow rate of the cooling gas that blows out the cooling gas supplied from the gas supply source 211 via the electromagnetic valve 212 from the nozzle 214.

The speed controller 213 includes a flow rate adjusting unit 124 and a flow rate sensor 125. The control unit 2a is communicably connected to the speed controller 213, acquires the flow rate of the cooling gas from the flow rate sensor 125, and causes the flow rate adjusting unit 124 to adjust the flow rate of the cooling gas. The control unit 2a and the speed controller 213 may be connected so as to be capable of wired communication or may be connected so as to be capable of wireless communication.

The nozzle 214 is a nozzle provided with a gas outlet 121 for blowing out the cooling gas. In the present embodiment, the nozzle 214 is held on a table on which the backup unit 44 is arranged.

As shown in FIG. 7, the nozzle 214 is provided with a gas outlet 121 that blows out cooling gas and a flow path 240 that communicates with the gas outlet 121 and allows the cooling gas to pass through.

In this embodiment, the component crimping device 100 includes eight nozzles 214. The number of nozzles 214 included in the component crimping device 100 is not particularly limited. Further, in the present embodiment, one speed controller 213 is connected to one nozzle 214. As a result, the control unit 2a can individually control the flow rate of the cooling gas blown out from each of the plurality of nozzles 214. One speed controller 213 may be connected to the plurality of nozzles 214.

Further, the nozzle 214 includes a cock 230 for switching whether or not to blow out the cooling gas from the nozzle 214.

The cock 230 is a stopper for switching the opening and closing of the flow path 240 by being operated by an operator. For example, the cock 230 is provided with a through hole extending in one direction. When the direction of the through hole is located along the flow path 240, the cock 230 is in an open state to move the cooling gas, and the cock 230 is located in a direction in which the direction of the through hole is orthogonal to the flow path 240. Occasionally, it will be open and the cooling gas will not move.

In the present embodiment, the cock 230 is a manual cock that is manually rotated by an operator. The cock 230 may be an automatic cock that can be electrically operated by the control unit 2a.

Further, in the present embodiment, the cooling unit 120 includes a plurality of nozzles 214. That is, the cooling unit 120 includes a plurality of gas outlets 121.

The temperature measuring unit 300 is a temperature detector for measuring the temperature of the substrate 3. The temperature measuring unit 300 includes, for example, a thermocouple 310. In this embodiment, the temperature measuring unit 300 includes a plurality of thermocouples 310.

FIG. 8 is a diagram for explaining a position where the substrate 3 is thermocompression bonded to the thermocompression bonding head 48 and a position where the thermocouple 310 is thermocompression bonded.

The plurality of thermocouples 310 are arranged on the stage 49, for example. Specifically, as shown in FIG. 8, the plurality of thermocouples 310 are arranged on the stage 49 so as to have a one-to-one correspondence with the plurality of thermocompression bonding heads 48. As a result, the control unit 2a can acquire the temperature (more specifically, the temperature distribution) at the position of the substrate 3 which is thermocompression-bonded by the plurality of thermocompression-bonding heads 48 and whose temperature is likely to rise. Further, for example, when the component crimping device 100 includes a plurality of gas outlets 121, the control unit 2a supplies the flow rate adjusting unit 124 with the cooling gas for each of the plurality of gas outlets 121 based on the acquired temperature distribution. You may adjust the flow rate of. According to this, the temperature variation (in-plane variation) with respect to the portion of the substrate 3 can be suppressed.

Further, for example, at least a part of the thermocouple 310 is exposed from the surface (upper surface) of the stage 49 so as to come into contact with the substrate 3 mounted on the stage 49. According to this, since the thermocouple 310 comes into direct contact with the substrate 3, the temperature of the substrate 3 can be measured with high accuracy.

Further, the temperature measuring unit 300 includes, for example, a thermo camera 320.

The thermo camera 320 is a thermal image camera for measuring the temperature (more specifically, the temperature distribution) of the substrate 3 by imaging the substrate 3 and generating a thermal image.

The temperature measuring unit 300 may include at least one of a thermocouple 310 and a thermo camera 320.

The temperature measuring unit 300 is communicably connected to the control unit 2a. The control unit 2a and the speed controller 213 may be connected so as to be capable of wired communication or may be connected so as to be capable of wireless communication.

In the control unit 2a included in the computer 2, for example, the substrate 3 is mounted on the stage 49 by the transport unit 60, and the component 5 is thermocompression bonded by controlling the thermocompression bonding head 48 on the substrate 3 mounted on the stage 49. It is a processing unit to be made to.

Further, the control unit 2a controls the cooling unit 120 to blow the cooling gas from the gas outlet 121 onto the substrate 3. For example, the control unit 2a causes the cooling unit 120 to cool the substrate 3 by blowing the cooling gas from the gas outlet 121 toward the substrate 3 from the side opposite to the thermocompression bonding head 48 to the substrate 3. In the present embodiment, the cooling unit 120 is arranged below the thermocompression bonding head 48. Further, the cooling unit 120 (more specifically, the gas outlet 121) is arranged so as to blow out the cooling gas upward. The control unit 2a controls the stage moving unit 41 to arrange the substrate 3 arranged on the stage 49 between the thermocompression bonding head 48 and the cooling unit 120. As a result, the control unit 2a controls the stage moving unit 41 to blow out the cooling gas from the gas outlet 121 toward the substrate 3 from the side opposite to the thermocompression bonding head 48 to the substrate 3. The substrate 3 is positioned at a position where the cooling unit 120 can cool the substrate 3.

Further, for example, the control unit 2a controls the stage moving unit 41 to arrange the substrate 3 arranged on the stage 49 between the thermocompression bonding head 48 and the cooling unit 120. As a result, the control unit 2a controls the stage moving unit 41 so that the thermocompression bonding head 48 thermocompression-bonds the component 5 to the electrode portion 4 of the end portion 3e, and the electrode portion 4 and the back of the substrate 3 are bonded. The substrate 3 is moved to a position where the cooling unit 120 cools the substrate 3 with the facing position as the spraying range.

Further, the control unit 2a controls the stage moving unit 41 to move the stage 49 to the stage moving unit 41 so that the end portion 3e of the substrate 3 is supported by the backup unit 44.

Further, the control unit 2a causes the flow rate adjusting unit 124 to adjust the flow rate of the cooling gas supplied to the gas outlet 121 based on the temperature of the substrate 3 measured by the temperature measuring unit 300.

As described above, in the present embodiment, the temperature measuring unit 300 measures the temperature distribution of the substrate 3 by at least one of the plurality of thermocouples 310 and the thermocamera 320. Further, the plurality of nozzles 214 are connected to different speed controllers 213. That is, the flow rates of the cooling gas blown out from the plurality of gas outlets 121 are individually adjusted by the flow rate adjusting unit 124. The control unit 2a causes the flow rate adjusting unit 124 to individually adjust the flow rate of the cooling gas supplied to each of the plurality of gas outlets 121 based on, for example, the temperature distribution of the substrate 3 measured by the temperature measuring unit 300.

[Processing procedure]
Subsequently, the specific operation of the component crimping device 100 will be described.

FIG. 9 is a block diagram for explaining the processing of the control unit 2a and the flow of the cooling gas included in the component crimping device 100 according to the embodiment. In FIG. 9, the flow of the cooling gas is indicated by a broken line arrow, and the flow of various information (data) such as information indicating the temperature of the substrate 3 and information indicating the flow rate of the cooling gas is indicated by a solid line arrow. Further, as shown by the alternate long and short dash arrow in FIG. 9, the temperature measuring unit 300 measures the temperature of the substrate 3. FIG. 10 is a flowchart for explaining a processing procedure of an operation executed by the component crimping device 100 according to the embodiment.

First, the control unit 2a controls the transport unit 60, the stage moving unit 41, and the like to mount the substrate 3 having the electrode portion 4 on which the component 5 is thermocompression bonded on the end portion 3e on the stage 49 (step S101). ). Next, the control unit 2a controls the stage moving unit 41 after mounting the substrate 3 on the stage 49, so that the end portion 3e of the substrate 3 is between the thermocompression bonding head 48 and the backup unit 44. Move the stage 49 so that it is positioned.

Next, the control unit 2a controls the stage moving unit 41 so that the backup unit 44 supports the end portion 3e of the substrate 3 mounted on the stage 49 from below (step S102).

Next, the component crimping device 100 is a step of adjusting the amount of cooling gas (that is, the flow rate of the cooling gas) drawn out from the gas outlet 121 included in the cooling unit 120 before thermocompression bonding the component 5 to the substrate 3. A flow rate adjusting step 1 is performed.

The temperature measuring unit 300 measures the temperature of the substrate 3 (step S103). For example, the control unit 2a acquires information indicating the temperature of the substrate 3 measured by the temperature measurement unit 300 from the temperature measurement unit 300.

Next, the control unit 2a starts cooling the substrate 3 by blowing the cooling gas from the cooling unit 120 provided with the gas outlet 121 for blowing out the cooling gas onto the substrate 3 (step S104). In this way, the control unit 2a causes the cooling unit 120 to start cooling the substrate 3 before the component 5 is thermocompression bonded to the substrate 3 in a state where the substrate 3 is supported by the backup unit 44.

Next, the control unit 2a calculates the correction amount of the flow rate of the cooling gas supplied to the gas outlet 121 based on the temperature of the substrate 3 (step S105). For example, when the temperature of the substrate 3 is higher than a predetermined temperature (first temperature), the control unit 2a determines the correction amount so that the flow rate of the cooling gas supplied to the gas outlet 121 increases. On the other hand, when the temperature of the substrate 3 is lower than the predetermined temperature, the control unit 2a determines the correction amount so that the flow rate of the cooling gas supplied to the gas outlet 121 is reduced. The control unit 2a acquires, for example, the flow rate of the cooling gas currently supplied to the gas outlet 121 from the flow rate sensor 125 in order to calculate the correction amount. The control unit 2a calculates the correction amount based on the current temperature of the substrate 3 and the flow rate of the cooling gas supplied to the gas outlet 121.

The method of calculating the correction amount may be arbitrarily determined. For example, the storage unit 2b may store table information that determines the flow rate of the cooling gas supplied to the gas outlet 121 with respect to the temperature of the substrate 3. The control unit 2a calculates the flow rate of the cooling gas supplied to the gas outlet 121 to be adjusted by the flow rate adjusting unit 124 based on the current temperature of the substrate 3 and the table information, and the calculated flow rate of the cooling gas and the gas. The correction amount may be calculated from the difference from the flow rate of the cooling gas currently supplied to the outlet 121.

Further, the predetermined temperature (first temperature) may be arbitrarily determined. For example, information indicating a predetermined temperature may be stored in the storage unit 2b in advance. For example, when the predetermined temperature is 100 ° C., when the temperature acquired from the temperature measuring unit 300 is higher than 100 ° C., the control unit 2a applies a cooling gas having a flow rate larger than the current flow rate to the flow rate adjusting unit 124. The correction value is calculated so as to supply the gas to the gas outlet 121. Alternatively, for example, when the predetermined temperature is 100 ° C., the control unit 2a adjusts the flow rate of the cooling gas having a flow rate smaller than the current flow rate when the temperature obtained from the temperature measuring unit 300 is lower than 100 ° C. The correction value is calculated so that the unit 124 supplies the gas outlet 121. By doing so, the control unit 2a causes the flow rate adjusting unit 124 to supply the cooling gas to the gas outlet 121 so that the temperature of the substrate 3 approaches a predetermined temperature.

Next, the control unit 2a determines whether or not the calculated correction amount exceeds a predetermined reference flow rate (first reference flow rate) (step S106). The reference flow rate may be arbitrarily determined in advance. Information indicating the reference flow rate is stored in the storage unit 2b in advance, for example.

When the control unit 2a determines that the calculated correction amount exceeds a predetermined reference flow rate (Yes in step S106), the control unit 2a urgently stops each equipment provided in the component crimping device 100 such as the thermocompression bonding head 48 (step S117). ). When the control unit 2a determines that the correction amount exceeds the reference flow rate, for example, the heat generated when thermocompression bonding is executed in front of the substrate 3 currently mounted on the stage 49 may remain. Be done. Alternatively, it is conceivable that insufficient cooling by the cooling unit 120 has occurred due to a failure of the solenoid valve 212 or the speed controller 213, a malfunction of the cooling unit 120 such as clogging of the gas pipe 210 or the nozzle 214. Therefore, when the control unit 2a determines that the correction amount exceeds the reference flow rate, the control unit 2a can prevent the substrate 3 from being deteriorated by heat by urgently stopping the operation of the equipment provided in the component crimping device 100. The control unit 2a does not have to stop all the equipment included in the component crimping device 100. For example, in step S111, the control unit 2a may operate the thermocompression bonding head 48 so as to separate it from the substrate 3 and then stop it, and further, the cooling unit 120 may continue to operate.

On the other hand, when the control unit 2a determines that the calculated correction amount does not exceed the predetermined reference flow rate (No in step S106), the flow rate of the cooling gas supplied to the gas outlet 121 changes by the calculated correction amount. The flow rate adjusting unit 124 adjusts the flow rate of the cooling gas supplied to the gas outlet 121 (step S107).

As shown in FIG. 9, the flow rate adjusting unit 124 adjusts the flow rate of the cooling gas supplied from the gas supply source 211 and supplies the cooling gas to the gas outlet 121. The cooling gas is blown out from the gas outlet 121 at a flow rate adjusted to the flow rate adjusting unit 124, so that the cooling gas is blown onto the substrate 3. The flow rate sensor 125 measures, for example, the flow rate of the cooling gas that passes through the flow rate adjusting unit 124 and is supplied to the gas outlet 121.

Further, the flow rate adjusting unit 124 acquires a correction amount from the control unit 2a, and adjusts the supply amount of the cooling gas to be supplied to the gas outlet 121 based on the acquired correction amount.

The flow rate of the cooling gas that the flow rate adjusting unit 124 first supplies to the gas outlet 121 (for example, only after the component crimping device 100 is started) may be arbitrarily determined in advance.

With reference to FIG. 10 again, after step S107, the control unit 2a determines whether or not a predetermined time (first predetermined time) has elapsed since the cooling unit 120 was started to blow the cooling gas (step S108). ). The control unit 2a may be provided with a time measuring unit such as an RTC (Real Time Clock) for measuring the time.

When the control unit 2a determines that a predetermined time has not elapsed since the cooling unit 120 was heated to start blowing the cooling gas (No in step S108), the process returns to step S103.

The component crimping device 100 stabilizes the temperature of the substrate 3 and the flow rate of the cooling gas by repeatedly executing the flow rate adjusting step 1 (steps S103 to S107).

When the control unit 2a determines that the first predetermined time has elapsed since the cooling gas 120 was started to blow the cooling gas, the control unit 2a controls the thermocompression bonding head 48, the pressurizing mechanism 47, and the like to control the thermocompression bonding head 48. The electrode portion 4 of the end portion 3e that is lowered and supported by the backup portion 44 is started to be thermocompression bonded by the thermocompression bonding head 48 (step S109).

Next, the component crimping device 100 is a step of adjusting the amount of gas (that is, the flow rate of the gas) drawn from the gas outlet 121 included in the cooling unit 120 before thermocompression bonding the component 5 to the substrate 3. The adjustment step 2 is executed. The processing contents of the flow rate adjusting step 1 and the flow rate adjusting step 2 are substantially the same.

The temperature measuring unit 300 measures the temperature of the substrate 3 (step S110). For example, the control unit 2a acquires information indicating the temperature of the substrate 3 measured by the temperature measurement unit 300 from the temperature measurement unit 300.

Next, the control unit 2a causes the substrate 3 to be blown with the cooling gas from the cooling unit 120 provided with the gas outlet 121 for blowing out the cooling gas (step S111). In this way, the control unit 2a causes the cooling unit 120 to cool the substrate 3 when the component 5 is thermocompression bonded to the substrate 3 in a state where the substrate 3 is supported by the backup unit 44. The control unit 2a may continue to cool the cooling unit 120 from the start of cooling by the cooling unit 120 in step S104 to the end of thermocompression bonding described later, and each time the cooling unit 120 and step S111 are executed. In addition, the cooling unit 120 may be cooled for a predetermined time, flow rate, etc., and then the cooling may be stopped.

Next, the control unit 2a calculates the correction amount of the flow rate of the cooling gas supplied to the gas outlet 121 based on the temperature of the substrate 3 (step S112). For example, the control unit 2a corrects the flow rate of the cooling gas supplied to the gas outlet 121 when the temperature of the substrate 3 is higher than the predetermined temperature (second temperature), as in step S112. Determine the amount. On the other hand, when the temperature of the substrate 3 is lower than the predetermined temperature, the control unit 2a determines the correction amount so that the flow rate of the cooling gas supplied to the gas outlet 121 is reduced.

The method of calculating the correction amount may be arbitrarily determined. For example, the storage unit 2b may store table information that determines the flow rate of the cooling gas supplied to the gas outlet 121 with respect to the temperature of the substrate 3. The control unit 2a calculates the flow rate of the cooling gas supplied to the gas outlet 121 to be adjusted by the flow rate adjusting unit 124 based on the current temperature of the substrate 3 and the table information, and the calculated flow rate of the cooling gas and the gas. The correction amount may be calculated from the difference from the flow rate of the cooling gas currently supplied to the outlet 121. Further, the method of calculating the correction amount in step S112 and the method of calculating the correction amount in step S105 may be the same or different. For example, the control unit 2a may use different table information in step S112 and step S105.

Further, the predetermined temperature (second temperature) may be arbitrarily determined. Further, the first temperature and the second temperature may be the same or different.

Next, the control unit 2a determines whether or not the calculated correction amount exceeds a predetermined reference flow rate (second reference flow rate) (step S113). The reference flow rate (second reference flow rate) may be arbitrarily determined in advance. Further, the first reference flow rate and the second reference flow rate may be the same or different.

When the control unit 2a determines that the calculated correction amount exceeds a predetermined reference flow rate (Yes in step S113), the control unit 2a urgently stops each equipment provided in the component crimping device 100 such as the thermocompression bonding head 48 (step S117). ). When the control unit 2a determines that the correction amount exceeds the reference flow rate, it is conceivable that the temperature of the substrate 3 has risen abnormally due to, for example, a defect in the thermocompression bonding head 48. Alternatively, it is conceivable that insufficient cooling by the cooling unit 120 has occurred due to a failure of the solenoid valve 212 or the speed controller 213, a malfunction of the cooling unit 120 such as clogging of the gas pipe 210 or the nozzle 214. Therefore, when the control unit 2a determines that the correction amount exceeds the reference flow rate, the control unit 2a can prevent the substrate 3 from being deteriorated by heat by urgently stopping the operation of the equipment provided in the component crimping device 100. The control unit 2a does not have to stop all the equipment included in the component crimping device 100. For example, in step S111, the control unit 2a may operate the thermocompression bonding head 48 so as to separate it from the substrate 3 and then stop it, and further, the cooling unit 120 may continue to operate.

On the other hand, when the control unit 2a determines that the calculated correction amount does not exceed the predetermined reference flow rate (No in step S113), the control unit 2a supplies the calculated correction amount to the gas outlet 121 as in step S107. The flow rate adjusting unit 124 adjusts the flow rate of the cooling gas supplied to the gas outlet 121 so that the flow rate of the cooling gas changes (step S114).

Next, the control unit 2a determines whether or not a predetermined time has elapsed since the component 5 was thermocompression-bonded by the thermocompression-bonding head 48 (step S115). When it is determined that a predetermined time has elapsed since the component 5 was thermocompression-bonded by the thermocompression-bonding head 48 (Yes in step S115), the control unit 2a ends the thermocompression-bonding process (step S116). For example, the control unit 2a controls the thermocompression bonding head 48, the pressurizing mechanism 47, and the like to raise the thermocompression bonding head 48 to end the thermocompression bonding of the component 5, and controls the cooling unit 120 to cool the component 5. By stopping the blowing of the cooling gas onto the substrate 3 to the unit 120, the cooling of the substrate 3 is completed, and by controlling the stage moving unit 41, the substrate 3 is separated from the backup unit 44, and the transport unit 60 and the stage are moved. By controlling the unit 41 and the like, the substrate 3 is retracted from the stage 49.

On the other hand, when the control unit 2a determines that a predetermined time has not elapsed since the thermocompression bonding head 48 thermocompression-bonded the component 5 (No in step S115), the process returns to step S110.

The component crimping device 100 stabilizes the temperature of the substrate 3 and the flow rate of the cooling gas by repeatedly executing the flow rate adjusting step 2 (steps S110 to S114).

As described above, the component crimping device 100 keeps the substrate 3 at an appropriate temperature by executing the flow rate adjusting step 1 (first flow rate adjusting step) and the flow rate adjusting step 2 (second flow rate adjusting step).

Although the control unit 2a calculated the correction amount in steps S105 and S112, the control unit 2a may calculate the flow rate of the cooling gas supplied to the gas outlet 121 by the flow rate adjusting unit 124. That is, the control unit 2a may calculate the flow rate of the cooling gas supplied by the flow rate adjusting unit 124 to the gas outlet 121 instead of the flow rate changed by the flow rate adjusting unit 124. In this case, the reference flow rate may be appropriately determined based on the flow rate of the cooling gas supplied by the flow rate adjusting unit 124 to the gas outlet 121.

Further, as described above, in the flow rate adjusting step 1 and the flow rate adjusting step 2, various threshold values such as a predetermined temperature and a reference flow rate may be the same or different.

Further, steps S103 to S108 do not have to be executed.

[Effects, etc.]
As described above, the component crimping apparatus 100 according to the embodiment is supported by the stage 49 on which the substrate 3 is mounted, the backup unit 44 that supports the substrate 3 mounted on the stage 49, and the backup unit 44. A thermocompression bonding head 48 for thermocompression bonding the component 5 to the substrate 3 and a cooling unit 120 for cooling the substrate 3 by blowing a cooling gas onto the substrate 3 while the substrate 3 is supported by the backup unit 44. A temperature measuring unit 300 for measuring the temperature of the substrate 3 and a control unit 2a for controlling the cooling unit 120 are provided. The cooling unit 120 includes a gas outlet 121 for blowing the supplied cooling gas onto the substrate 3, and a flow rate adjusting unit 124 for adjusting the flow rate of the cooling gas supplied to the gas outlet 121. The control unit 2a causes the flow rate adjusting unit 124 to adjust the flow rate of the cooling gas supplied to the gas outlet 121 based on the temperature of the substrate 3 measured by the temperature measuring unit 300.

According to this, the control unit 2a can be adjusted by the flow rate adjusting unit 124 so that the flow rate of the cooling gas becomes appropriate based on the temperature of the substrate 3. Therefore, the component crimping device 100 can perform thermocompression bonding while appropriately cooling the substrate 3.

Further, for example, the control unit 2a causes the cooling unit 120 to cool the substrate 3 by blowing the cooling gas onto the substrate 3 from the gas outlet 121 from the side opposite to the thermocompression bonding head 48 to the substrate 3.

For example, the thermocompression bonding head 48 is heated to about 150 ° C. to 300 ° C. in order to thermocompression bond the component 5 to the substrate 3. On the other hand, the temperature of the substrate 3 is preferably lowered to about 100 ° C. or lower in order to suppress thermal deterioration of the substrate 3. Therefore, the control unit 2a causes the substrate 3 to blow the cooling gas from the gas outlet 121 from the side opposite to the thermocompression bonding head 48 (lower side in the present embodiment). As a result, the cooling gas can be prevented from being sprayed on the thermocompression bonding head 48 by the substrate 3. Therefore, the temperature of the thermocompression bonding head 48 is suppressed from being changed by the cooling gas. As a result, the temperature of the thermocompression bonding head 48 is changed, so that problems such as the component 5 not being thermocompression bonded to the substrate 3 are suppressed. Further, since the thermocompression bonding head 48 is not located on the cooling unit 120 side, the gas outlet 121 of the cooling unit 120 can be brought closer to the substrate 3. Therefore, the control unit 2a can more effectively cool the substrate 3 with the cooling unit 120.

Further, for example, the temperature measuring unit 300 includes a thermocouple 310.

According to this, the temperature measuring unit 300 can easily measure the temperature of the substrate 3 by the thermocouple 310.

Further, for example, the thermocouple 310 is arranged on the stage 49.

According to this, the component crimping device 100 can measure the temperature of the substrate 3 without providing a mechanism or the like for moving the thermocouple 310.

Further, for example, the temperature measuring unit 300 includes a thermo camera 320.

According to this, the component crimping device 100 can measure the temperature distribution of the substrate 3 in detail with a simple structure as compared with the case where a plurality of thermocouples 310 are provided on the stage 49, for example.

Further, for example, the cooling unit 120 includes a plurality of gas outlets 121. Further, for example, the temperature measuring unit 300 measures the temperature distribution of the substrate 3. In this case, for example, the control unit 2a causes the flow rate adjusting unit 124 to adjust the flow rate of the cooling gas supplied to each of the plurality of gas outlets 121 based on the temperature distribution of the substrate 3 measured by the temperature measuring unit 300.

According to this, the control unit 2a determines the flow rate of the cooling gas to be supplied to the flow rate adjusting unit 124 for each of the plurality of gas outlets 121 based on the temperature (temperature distribution) of the substrate 3 acquired from the temperature measuring unit 300. It can be adjusted individually. According to this, the temperature variation (in-plane variation) with respect to the portion of the substrate 3 can be suppressed.

Further, the component crimping method according to the embodiment includes a mounting step of mounting the substrate 3 on the stage 49 (step S101) and a supporting step of supporting the substrate 3 mounted on the stage 49 by the backup unit 44 (step). S102) and the thermocompression bonding step (steps S109 to S116) in which the component 5 is thermocompression bonded to the substrate 3 supported by the backup unit 44 by the thermocompression bonding head 48, and the substrate 3 is supported by the backup unit 44. A cooling step of cooling the substrate 3 by blowing cooling gas onto the substrate 3 from a gas outlet 121 provided in the cooling unit 120 (steps S104 to S107 of the above-mentioned flow adjustment step 1 and the above-mentioned flow adjustment step 2). Steps S111 to S114) and a temperature measuring step (step S103 and step S110) for measuring the temperature of the substrate 3 are provided. In the cooling step, the flow rate of the cooling gas supplied to the gas outlet 121 is adjusted (steps S107 and S114) based on the temperature of the substrate 3 measured in the temperature measuring step.

According to this, the flow rate adjusting unit 124 can adjust the flow rate of the cooling gas to be appropriate based on the temperature of the substrate 3. Therefore, according to the component crimping method according to the embodiment, the substrate 3 can be thermocompression bonded while being appropriately cooled.

(Other embodiments)
The parts crimping device and the like according to the present embodiment have been described above based on the above-described embodiment, but the present invention is not limited to the above-described embodiment.

For example, in the above embodiment, all or a part of the components of the computer 2 may be configured by dedicated hardware, or may be realized by executing a software program suitable for each component. good. Each component may be realized by a program execution unit such as a CPU (Central Processing Unit) or a processor reading and executing a software program recorded on a recording medium such as an HDD (Hard Disk Drive) or a semiconductor memory. good.

Further, the component of the computer 2 may be composed of one or a plurality of electronic circuits. The one or more electronic circuits may be general-purpose circuits or dedicated circuits, respectively.

The one or more electronic circuits may include, for example, a semiconductor device, an IC (Integrated Circuit), an LSI (Large Scale Integration), or the like. The IC or LSI may be integrated on one chip or may be integrated on a plurality of chips. Here, it is called IC or LSI, but the name changes depending on the degree of integration, and it may be called system LSI, VLSI (Very Large Scale Integration), or ULSI (Ultra Large Scale Integration). Further, an FPGA (Field Programmable Gate Array) programmed after manufacturing the LSI can also be used for the same purpose.

In addition, it is realized by arbitrarily combining the components and functions in each embodiment within the range obtained by applying various modifications to each embodiment and the gist of the present invention. Forms are also included in the present invention.

The present invention can be used in a component crimping device for thermocompression bonding a component to a substrate, which is possessed by a component mounting line or the like for producing a liquid crystal panel.

1 Parts mounting line 1a, 1b, 1c Base 2 Computer 2a Control part 2b Storage part 3 Board 3a Upper board 3b Lower board 3c, 3d Polarizing plate 3e End part 4 Electrode part 5 Parts 6 Anisotropic conductive member (ACF)
10 Board carry-in part 11, 23, 37, 49, 51 Stage 20 Sticking part 21, 31, 41 Stage moving part 22 Sticking mechanism 30 Temporary crimping part 32 Parts mounting mechanism 33 Parts supply part 40 Crimping parts 43 Head moving mechanism 43a Base part 43b Guide part 44 Backup part 46 Mounting member 47 Pressurizing mechanism 47a Rod 48 Thermocompression bonding head 50 Board carrying part 60 Transporting part 61 Moving base 62A, 62B, 62C, 62D Board transporting mechanism 63 Base 64 Arm unit 100 Parts crimping Equipment 120 Cooling unit 121 Gas outlet 124 Flow control unit 125 Flow sensor 210 Gas pipe 211 Gas supply source 212 Solenoid valve 213 Speed controller 214 Nozzle 220 Protective sheet 230 Cock 240 Flow path 300 Temperature measuring unit 310 Thermocouple 320 Thermocouple

Claims (7)

The stage on which the board is placed and
A backup unit that supports the substrate mounted on the stage and
A thermocompression bonding head that thermocompression-bonds parts to the substrate supported by the backup unit,
A cooling unit that cools the substrate by blowing a cooling gas onto the substrate while the substrate is supported by the backup unit.
A temperature measuring unit that measures the temperature of the substrate,
A control unit that controls the cooling unit is provided.
The cooling unit includes a gas outlet for blowing the supplied cooling gas onto the substrate, and a flow rate adjusting unit for adjusting the flow rate of the cooling gas supplied to the gas outlet.
The control unit causes the flow rate adjusting unit to adjust the flow rate of the cooling gas supplied to the gas outlet based on the temperature of the substrate measured by the temperature measuring unit.
Parts crimping device. The control unit causes the cooling unit to cool the substrate by blowing the cooling gas onto the substrate from the side opposite to the thermocompression bonding head from the gas outlet.
The component crimping device according to claim 1. The temperature measuring unit includes a thermocouple.
The component crimping device according to claim 1 or 2. The thermocouple is placed on the stage.
The component crimping device according to claim 3. The temperature measuring unit includes a thermo camera.
The component crimping device according to claim 1 or 2. The cooling unit includes a plurality of the gas outlets.
The temperature measuring unit measures the temperature distribution of the substrate and measures the temperature distribution of the substrate.
The control unit causes the flow rate adjusting unit to adjust the flow rate of the cooling gas supplied to each of the plurality of gas outlets based on the temperature distribution of the substrate measured by the temperature measuring unit.
The component crimping device according to any one of claims 1 to 5. The mounting process of mounting the board on the stage and
A support process in which the substrate mounted on the stage is supported by a backup unit, and
A thermocompression bonding step in which a component is thermocompression bonded to the substrate supported by the backup unit with a thermocompression bonding head.
A cooling step of cooling the substrate by blowing cooling gas onto the substrate from a gas outlet provided in the cooling unit while the substrate is supported by the backup unit.
A temperature measuring step for measuring the temperature of the substrate is provided.
In the cooling step, the flow rate of the cooling gas supplied to the gas outlet is adjusted based on the temperature of the substrate measured in the temperature measuring step.
Parts crimping method.

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