JP2022062382A - Component mounting system and component mounting method - Google Patents

Abstract

To provide a component mounting system or the like capable of stabilizing mounting accuracy.SOLUTION: A component mounting system 1 includes a mounting device 100 that mounts a component 440 on a board 400, a storage unit 370 that stores the correction amount for the mounting device 100 to correct the mounting position for mounting the component 440 on the board 400 in the mounting device 100 for each type of a plurality of boards 400 on which the component 440 is mounted by the mounting device 100, an acquisition unit 310 that acquires product type information indicating the product type of the board 400 on which the component 440 is mounted by the mounting device 100, and a control unit 340 that reads the correction amount associated with the product type of the board 400 indicated by the product type information acquired by the acquisition unit 310 from the storage unit 370 and causes the mounting device 100 to correct the mounting position on the basis of the read correction amount.SELECTED DRAWING: Figure 2

Description

The present invention relates to a component mounting system and a component mounting method.

Conventionally, there is a system in which an electronic component such as a drive circuit is mounted on a substrate such as a display panel such as a liquid crystal panel or an organic EL (Electroluminescence) panel (see, for example, Patent Document 1).

The electronic component bonding apparatus disclosed in Patent Document 1 includes an outer lead bonding portion, a first crimping portion, and a second crimping portion. In the bonding apparatus, after the alignment is performed at the outer lead bonding portion, the main crimping is performed at the first crimping portion and the second crimping portion. The bonding device aligns the electronic component and the display panel in advance by anticipating the misalignment that occurs when the electronic component is crimped to a display panel such as an LCD (Liquid Crystal Display). As a result, the bonding apparatus can perform accurate bonding.

Japanese Unexamined Patent Publication No. 7-201932

In recent years, in a system in which a component is mounted on a board, the component may be mounted on a plurality of types of boards.

Here, it is assumed that the mounting device mounts a component on a board of one type while correcting the mounting position, and then the mounting device mounts the component on a board of another type. At this time, the correction amount for correcting the mounting position where the mounting device mounts the component on the board of one type and the mounting position where the mounting device mounts the component on the board of the other type are corrected. The amount of correction for this may differ. In this case, the mounting accuracy is not good because an appropriate correction amount is not set at the timing when the type of the board to be mounted by the mounting device is switched. As described above, in a system in which components are mounted on a plurality of types of boards, the mounting accuracy is lowered every time the board types are switched, so that the mounting accuracy is not stabilized.

The present invention provides a component mounting system or the like capable of stabilizing mounting accuracy.

In the component mounting system according to one aspect of the present invention, the mounting device measures a mounting device for mounting a component on a board and a correction amount for causing the mounting device to correct a mounting position for mounting the component on the board. A storage unit that stores each type of a plurality of boards on which components are mounted, an acquisition unit that acquires type information indicating the type of board on which components are mounted by the mounting device, and the type acquired by the acquisition unit. It is provided with a control unit that reads a correction amount associated with the type of substrate indicated by the information from the storage unit and causes the mounting device to correct the mounting position based on the read correction amount.

Further, in the component mounting method according to one aspect of the present invention, a plurality of boards on which a component is mounted by the mounting device is provided with a correction amount for causing the mounting device to correct the mounting position where the mounting device mounts the component on the board. The product type is stored in the storage unit for each product type, the product type information indicating the product type of the board on which the component is mounted by the mounting device is acquired, and the correction amount associated with the board type indicated by the acquired product type information is stored. The mounting position is corrected by the mounting device based on the correction amount read out from the unit, and the component is mounted on the substrate by the mounting device.

It should be noted that these comprehensive or specific embodiments may be realized by a recording medium such as a system, a method, an integrated circuit, a computer program or a computer-readable CD-ROM, and the system, a method, an integrated circuit, or a computer program. And may be realized by any combination of recording media.

According to the present invention, it is possible to provide a component mounting system or the like capable of stabilizing mounting accuracy.

FIG. 1 is a plan view showing a component mounting system according to an embodiment. FIG. 2 is a block diagram showing a configuration of a component mounting system according to an embodiment. FIG. 3 is a schematic perspective view for explaining a position where the image pickup unit takes an image of the substrate. FIG. 4 is a back view showing a board on which components are mounted. FIG. 5 is a diagram for explaining the amount of deviation measured by the inspection device according to the embodiment. FIG. 6 is a flowchart showing a processing procedure of the component mounting system according to the embodiment.

Hereinafter, the component mounting system and the like according to the embodiment of the present invention will be described in detail with reference to the drawings. In addition, all of the embodiments described below show a specific example of the present invention. Therefore, the numerical values, shapes, materials, components, arrangement and connection forms of components, steps, order of steps, etc. shown in the following embodiments are examples, and are not intended to limit the present invention. Therefore, among the components in the following embodiments, the components not described in the independent claims indicating the highest level concept of the present invention will be described as arbitrary components.

Further, each figure is a schematic view and is not necessarily exactly illustrated. Further, in each figure, the same components are designated by the same reference numerals.

Further, in the present specification and the drawings, the X-axis, the Y-axis, and the Z-axis represent the three axes of the three-dimensional Cartesian coordinate system. The X-axis and the Y-axis are orthogonal to each other and both are orthogonal to the Z-axis. Further, in the following embodiments, the transport direction of the substrate may be described as the X-axis positive direction, the Z-axis positive direction as the upper direction, and the Z-axis negative direction as the lower direction.

(Embodiment)
[Constitution]
First, the configuration of the component mounting system according to the embodiment will be described.

FIG. 1 is a plan view showing a component mounting system 1 according to an embodiment. FIG. 2 is a block diagram showing a configuration of a component mounting system 1 according to an embodiment. FIG. 3 is a schematic perspective view for explaining a position where the image pickup unit 37 takes an image of the substrate 400.

In FIG. 1, the inspection device 200 and the control device 300 are shown as functional blocks. For example, the inspection device 200 is connected to the control device 300 so as to be capable of wireless communication or wire communication by a control line or the like. Further, for example, the control device 300 enables wireless communication with each device included in the mounting device 100 such as the sticking portion 20, the temporary crimping portion 30, the main crimping portion 40, and the transport portion 60, or a control line or the like. It is connected to enable wired communication and controls each device.

Further, in FIG. 3, a part of the components included in the stage 31 on which the substrate 400 is placed and the temporary crimping portion 30 such as the backup stage is omitted. Further, in FIG. 3, the mounting head moving mechanism 36 is shown as a functional block.

The component mounting system 1 is a system for mounting components 440 on a board 400. Specifically, the component mounting system 1 is a system in which the anisotropic conductive member ACF430 is attached to the substrate 400 on which the electrode portion 410 is formed, and the component 440 is mounted on the substrate 400 via the ACF430. In this embodiment, the component mounting system 1 (more specifically, the mounting device 100) thermocompression-bonds the component 440 to the substrate 400 via the ACF 430.

The substrate 400 is a display panel such as a liquid crystal display panel or an organic EL panel. In this embodiment, the substrate 400 is a translucent (more specifically, transparent) substrate.

The electrode portion 410 is composed of, for example, electrodes.

The component 440 is, for example, an electronic component in which a drive circuit or the like is formed, and examples thereof include flexible components such as TCP (Tape Carrier Package) and FPC (Flexible Printed Circuits).

The component mounting system 1 includes a mounting device 100, an inspection device 200, and a control device 300.

The mounting device 100 is a device (system) for mounting the component 440 on the board 400. In this embodiment, the mounting device 100 thermocompression-bonds the component 440 to the substrate 400. Specifically, the mounting device 100 mounts the component 440 on the substrate 400 based on the positions of the mark 420 provided on the substrate 400 and the mark 421 (see FIG. 4) provided on the back surface of the component 440. After (temporary crimping), the temporarily crimped component 440 is thermocompression-bonded (main crimped) to the substrate 400.

The mounting device 100 includes a substrate carry-in portion 10, a sticking portion 20, a temporary crimping portion 30, a main crimping portion 40, a board carry-out portion 50, and a transport portion 60. The substrate carry-in portion 10, the sticking portion 20, the temporary crimping portion 30, the main crimping portion 40, and the substrate carry-out portion 50 are connected in this order. The mounting device 100 mounts the component 440 on the electrode portion 410 provided on the peripheral edge of the substrate 400 carried in from the board carry-in portion 10 on the upstream side to which the board 400 is conveyed (in this embodiment, temporary crimping and main crimping). ) Perform the component mounting process (component crimping process). The board 400 on which the component 440 is mounted is conveyed to the board carry-out section 50, and is carried out from the board carry-out section 50 to the inspection device 200.

The board loading section 10 includes a stage 11 provided on the base 1a. The substrate 400 on which the electrode portion 410 is formed is placed on the stage 11.

The sticking portion 20 is a device that performs a sticking step of sticking (sticking) ACF430, which is an adhesive member, to the electrode portion 410 of the substrate 400. The sticking portion 20 includes a stage 21, a stage moving portion 22, and a sticking mechanism 23.

The stage 21 is a stage on which the substrate 400 conveyed from the stage 11 is placed.

The stage moving unit 22 is a mechanism for moving the substrate 400 mounted on the stage 21. The stage moving unit 22 includes, for example, an X-axis table movable in the X-axis direction, a Y-axis table movable in the Y-axis direction, and a Z-axis table movable in the Z-axis direction. The stage moving unit 22 moves the substrate 400 mounted on the stage 21 by the X-axis table, the Y-axis table, and the Z-axis table.

The sticking mechanism 23 is a device for sticking the ACF 430 to the electrode portion 410 of the substrate 400. The sticking mechanism 23 includes, for example, a supply unit for supplying the ACF 430 and a sticking tool for sticking the ACF 430 to the substrate 400. The sticking tool is, for example, arranged above the base 1b and has a sticking head for sticking the ACF 430 supplied from the supply unit to a position corresponding to the electrode portion 410 of the substrate 400.

The temporary crimping portion 30 is a device that executes a temporary crimping step of placing (more specifically, temporarily crimping) the component 440 at the position where the ACF 430 is stuck on the sticking portion 20 on the substrate 400.

The temporary crimping portion 30 includes a stage 31, a stage moving portion 32, a component supply portion 33, and a temporary crimping tool 34.

The stage 31 is a stage on which the substrate 400 to which the ACF 430 is attached is placed.

The stage moving unit 32 is a mechanism for moving the substrate 400. The stage moving unit 32 includes, for example, an X-axis table movable in the X-axis direction, a Y-axis table movable in the Y-axis direction, and a Z-axis table movable in the Z-axis direction.

The stage moving portion 32 has the same structure as the stage moving portion 22 of the sticking portion 20, and the substrate 400 is held by the X-axis table, the Y-axis table, and the Z-axis table and moved in a horizontal plane to move up and down. It has a function to move up and down in the direction and rotate around the Z axis.

The component supply unit 33 is a mechanism for supplying the component 440 to the temporary crimping tool 34.

The temporary crimping tool 34 is a device for mounting the component 440 on the substrate 400 via the ACF 430. The temporary crimping tool 34 includes a mounting head 35 shown in FIG. 3, a mounting head moving mechanism 36 shown in FIG. 3 for moving the mounting head 35, and an imaging unit 37 shown in FIG. 3 provided on the base 1b. And a mounting support base (so-called backup stage) for supporting the substrate 400.

The mounting head 35 is a head for picking up (suctioning) the component 440 and mounting the picked up component 440 on the substrate 400.

The mounting head moving mechanism 36 is a device for moving the mounting head 35. The mounting head moving mechanism 36 is realized by, for example, a motor and a guide for moving the mounting head 35.

The image pickup unit 37 is a camera that images the substrate 400 and the component 440 so that the mounting head 35 can mount the component 440 on the substrate 400 at an appropriate position.

The mounting head 35 freely moves in the horizontal plane by the mounting head moving mechanism 36, moves up and down in the Z-axis direction, and picks up the component 440 supplied by the component supply unit 33 from above. The temporary crimping tool 34 mounts the component 440 on the substrate 400 by mounting the component 440 picked up by the mounting head 35 on the ACF 430 and pressing the component 440 together with the substrate 400 against the mounting support using the information obtained from the image pickup unit 37. Place.

The main crimping portion 40 is a device that executes a main crimping step (that is, a thermocompression bonding step) of main crimping (that is, thermocompression bonding) the component 440 placed on the substrate 400 by the temporary crimping portion 30 to the substrate 400.

By doing so, the electrode portion 410 formed on the substrate 400 and the component 440 are electrically connected via the ACF 430.

The crimping portion 40 includes a stage 41, a stage moving portion 42, and a crimping tool 43.

The stage 41 is a stage on which the substrate 400 on which the component 440 is temporarily crimped is placed.

The stage moving portion 42 has the same structure as the stage moving portion 22 of the sticking portion 20, and the substrate 400 is held by the X-axis table, the Y-axis table, and the Z-axis table and moved in a horizontal plane to move up and down. It has a function to move up and down in the direction and rotate around the Z axis. The stage moving unit 42, for example, moves the substrate 400 held by the stage 41 in a predetermined direction, and moves the substrate 400 on which the component 440 is placed at the component crimping position where the thermocompression bonding of the component 440 is performed.

The crimping tool 43 is a mechanism for thermocompression bonding the component 440 to the substrate 400. The crimping tool 43 includes, for example, a crimping head and a heater for heating the crimping head. The crimping tool 43 is thermocompression-bonded by pressing the component 440 against the substrate 400 via the ACF 430 while heating it by the crimping head heated by the heater.

The board carry-out unit 50 includes a stage 51 mounted on the base 1c. The stage 51 holds the substrate 400 conveyed from the crimping portion 40 on the stage 51. The board 400 held by the board carry-out unit 50 is carried out to the inspection device 200 located downstream of the mounting device 100.

The transport unit 60 is a device for transporting the substrate 400. Specifically, the transport section 60 transfers the substrate 400 carried into the board carry-in section 10 to the sticking section 20, the temporary crimp section 30, the main crimp section 40, and the board carry-out section 50 in this order. Transport between. The transport portion 60 is arranged in the front region (Y-axis negative direction side) of the sticking portion 20, the temporary crimping portion 30, and the main crimping portion 40.

The transport unit 60 is placed on the base 1a, the base 1b, and the moving base 61 extending in the X-axis direction over the base 1c, in order from the upstream side, the substrate transfer mechanism 62A, the substrate transfer mechanism 62B, and the substrate transfer mechanism 62C. , And a substrate transfer mechanism 62D.

The substrate transfer mechanisms 62A to 62D include a base 63 and one or more arm units 64, respectively. In this embodiment, the case where the substrate transport mechanisms 62A to 62D each include two arm units 64 is illustrated.

The base 63 is provided on the movement base 61 and freely moves in the X-axis direction. Two arm units 64 are provided side by side in the X-axis direction on the base portion 63. The arm unit 64 is provided with one or more arm-shaped suction nozzles extending in the horizontal direction arranged side by side in the X-axis direction, and the arm is provided with a suction pad with the suction surface facing downward. The arm unit 64 sucks the substrate 400 from above via the suction pad provided on the suction nozzle, and conveys the sucked substrate 400.

For example, the substrate transfer mechanism 62A receives the substrate 400 mounted on the stage 11 of the substrate carry-in portion 10 and delivers it to the stage 21 of the attachment portion 20. Further, for example, the substrate transfer mechanism 62B receives the substrate 400 from the stage 21 of the sticking portion 20 and delivers it to the stage 31 of the temporary crimping portion 30. Further, for example, the substrate transfer mechanism 62C receives the substrate 400 from the stage 31 of the temporary crimping portion 30 and delivers it to the stage 41 of the main crimping portion 40. Further, for example, the substrate transfer mechanism 62D receives the substrate 400 from the stage 41 of the main crimping portion 40 and delivers it to the stage 51 of the substrate carry-out portion 50.

The inspection device 200 is a device that measures (inspects) the position on which the component 440 is mounted on the substrate 400. Specifically, the inspection device 200 is a device that inspects the position deviation (the deviation amount L shown in FIG. 5) of the position where the component 440 is mounted from a predetermined position. The inspection device 200 is, for example, a computer including a camera. The computer has, for example, a communication interface for communicating with the image pickup unit 210 and the control device 300, a non-volatile memory in which the program is stored, a volatile memory which is a temporary storage area for executing the program, and transmission / reception of signals. It is realized by an input / output port for performing a program, a processor that executes a program, and the like.

The inspection device 200 includes an image pickup unit 210 and a measurement unit 220.

The image pickup unit 210 is a camera for identifying the position of the mark 420 on the substrate 400 and the position of the mark 421 of the component 440.

FIG. 4 is a back view showing the substrate 400 on which the component 440 is mounted. Since the substrate 400 is a transparent substrate in the present embodiment, the configuration of the component 440 and the like located above the substrate 400 is also shown in FIG. 4 so as to be visible.

The image pickup unit 210, for example, takes an image of the substrate 400 from the lower side of the substrate 400 to generate an image including the mark 420 provided on the substrate 400 and the mark 421 provided on the component 440.

The measuring unit 220 is a processing unit that measures (inspects) the position on which the component 440 is mounted on the substrate 400 based on the image generated by the imaging unit 210.

FIG. 5 is a diagram for explaining a deviation amount L measured by the inspection device 200 according to the embodiment. FIG. 5 is a diagram schematically showing an example of an image generated by, for example, the image pickup unit 210.

For example, the control device 300 controls the temporary crimping portion 30 to mount the component 440 on the substrate 400. Here, when the component 440 is placed on the substrate 400, the position of the component 440 with respect to the substrate 400 may deviate from a desired position.

For example, the control device 300 attempts to place the component 440 on the substrate 400 so that the mark 421 shown in FIG. 5 overlaps the predetermined position 450 by controlling the temporary crimping portion 30. However, when the component 440 is actually placed on the substrate 400, the mark 421 may deviate from the predetermined position 450. In particular, in the present embodiment, after the temporary crimping portion 30 places the component 440 on the substrate 400, the main crimping portion 40 actually crimps the component 440 on the substrate 400. Therefore, even if the temporary crimping portion 30 properly places the component 440 on the substrate 400, the component 440 may be displaced from the substrate 400 when the main crimping portion 40 actually crimps the component 440 to the substrate 400. ..

The measuring unit 220 measures, for example, the amount of deviation L (for example, a distance) between the mark 421 and the predetermined position 450 based on the image generated by the imaging unit 210.

The measuring unit 220 outputs information indicating the measured deviation amount L to the control device 300.

For example, in the component mounting system 1, component 440 is sequentially mounted (temporarily crimped and main crimped) on a plurality of boards 400. The image pickup unit 210 generates an image by sequentially taking an image of a plurality of substrates 400 on which the component 440 is mounted, and sequentially outputs the generated image to the measurement unit 220. The measuring unit 220 sequentially calculates the deviation amount L based on the acquired image, and sequentially outputs the calculated deviation amount L to the control device 300.

When two or more images are acquired from the imaging unit 210, the measuring unit 220 collectively calculates the deviation amount L of two or more based on each of the two or more images, and calculates the deviation amount of two or more. They may be collectively output to the control device 300.

The measuring unit 220 is stored in a memory of the inspection device 200, for example, and has a control program indicating a processing procedure executed by the measuring unit 220, a CPU (Central Processing Unit) that executes the control program, and an image from the imaging unit 210. Is realized by a communication interface for acquiring the deviation amount L and transmitting the deviation amount L to the control device 300.

The control device 300 is a computer that controls the operation of each device of the mounting device 100. Specifically, the control device 300 communicates with each device of the mounting device 100, such as the sticking portion 20, the temporary crimping portion 30, the main crimping portion 40, and the transport portion 60, by a control line (not shown) or the like. It is connected so that it can be connected, and controls the operation of each device, the timing of the operation, and the like. For example, the control device 300 controls the sticking portion 20, the temporary crimping portion 30, and the main crimping portion 40 to the above-mentioned sticking, temporary crimping, main crimping, etc. to the substrate 400 on each device. By executing the predetermined work of the above and controlling the transport unit 60, the board transport work of transporting the substrate 400 to the next process between the devices included in the component mounting system 1 is executed. The control device 300 synchronously transfers the substrate 400 from the upstream side to the downstream side between the devices included in the component mounting system 1.

The control device 300 is, for example, a communication interface for communicating with the mounting device 100 and the inspection device 200, a non-volatile memory in which the program is stored, a volatile memory which is a temporary storage area for executing the program, and a signal. It is realized by an input / output port for transmission / reception, a processor that executes a program, a display device that displays an image, and the like.

As shown in FIG. 2, the control device 300 includes an acquisition unit 310, a calculation unit 320, a control unit 340, an input unit 330, an output unit 350, a display unit 360, and a storage unit 370.

The acquisition unit 310 acquires information indicating the deviation amount L (hereinafter, also simply referred to as the deviation amount L) from the inspection device 200. The acquisition unit 310 is, for example, a communication interface for communicating with the inspection device 200. For example, the acquisition unit 310 acquires the deviation amount L sequentially output from the inspection device 200, and sequentially outputs the acquired deviation amount L to the calculation unit 320.

Further, the acquisition unit 310 acquires the product type information indicating the product type of the substrate 400 on which the component 440 is mounted by the mounting device 100. The mounting device 100, for example, mounts components corresponding to the respective boards on each of a plurality of boards of different types. Here, the boards having different types are, for example, boards having at least one different size, shape, material, and mounted components.

The acquisition unit 310 acquires, for example, product type information indicating the product type of the substrate 400 from the input unit 330. The acquisition unit 310 outputs the acquired product type information to the calculation unit 320 and the control unit 340.

The product type information may be output to the control unit 340 via the calculation unit 320, or may be output from the input unit 330 to the control unit 340.

The calculation unit 320 is from a predetermined position 450 of the position of the component 440 (in this embodiment, the mark 421 provided on the component 440) mounted on the substrate 400 by the mounting device 100, which is measured by the inspection device 200. Based on the deviation amount L, the correction amount for correcting the mounting position where the mounting device 100 mounts the component 440 on the board 400 is calculated. Specifically, the calculation unit 320 holds a correction amount for correcting the mounting position, which is a target position when the mounting device 100 mounts the component 440 on the substrate 400, and more specifically, the component 440. The correction amount for correcting the holding position to be used and the position of the mounting head 35 when the component 440 is mounted on the substrate 400 is calculated. The correction amount is, for example, the coordinates indicating the holding position for holding the component 440, the coordinates indicating the position of the mounting head 35 when the component 440 is mounted on the substrate 400, and the mounting head 35 moved by the mounting head moving mechanism 36. It is a value indicating the direction to move and the amount of movement (distance).

In the present embodiment, the mounting apparatus 100 has a temporary crimping portion 30 for mounting the component 440 on the substrate 400, and a main crimping portion for thermocompression bonding the component 440 mounted on the substrate 400 by the temporary crimping portion 30 to the substrate 400. 40 and. The calculation unit 320 corrects the mounting position by correcting the mounting position of the component 440 on the substrate 400 based on the deviation amount L measured by the inspection device 200. Is calculated for each type of substrate 400. In other words, the calculation unit 320 corrects the mounting position on the temporary crimping unit 30 based on the deviation amount L, so that the mounting device 100 corrects the mounting position on the substrate 400. Calculated for each product type.

The calculation unit 320 calculates the correction amount based on, for example, the deviation amount L in one substrate 400. Next, the calculation unit 320 recalculates the correction amount based on, for example, the calculated correction amount and the deviation amount L in the other substrate 400. For example, the calculation unit 320 calculates the average value of the deviation amount L in one substrate 400 and the deviation amount L in the other substrate 400, and calculates the correction amount based on the calculated average value. Alternatively, for example, the calculation unit 320 newly corrects the average value of the correction amount calculated based on the deviation amount L in one substrate 400 and the correction amount calculated based on the deviation amount L in the other substrate 400. Calculated as a quantity.

In this way, the calculation unit 320 sequentially calculates (corrects) the correction amount based on the deviation amount L sequentially acquired by the acquisition unit 310. Further, the calculation unit 320 generates the type correction information 371 in which the product type information acquired by the acquisition unit 310 and the calculated correction amount are associated with each other. As a result, the type correction information 371 indicating the correction amount according to the type of the substrate 400 is generated.

The calculation unit 320 outputs information indicating the calculated correction amount (more specifically, the type correction information 371) to the control unit 340.

In addition, when the number of processed pieces, which is the number of parts 440 mounted on the board 400 by the mounting device 100, reaches the specified number, the calculation unit 320 measures the deviation amount from each of the specified number of boards 400 by the inspection device 200. The correction amount may be calculated based on L.

Here, the specified number of sheets is a number arbitrarily determined in advance, and information indicating the specified number of sheets is stored in advance in, for example, a storage unit 370. The number of processed sheets is the number of components 440 mounted on the board 400 by the mounting device 100. More specifically, the number of processed sheets is the number of parts 440 placed on the substrate 400 by the temporary crimping portion 30.

The input unit 330 receives input of product type information indicating the product type of the board on which the component is mounted by the mounting device. The input unit 330 is, for example, a user interface such as a touch panel that accepts the operation of the operator, and receives the product type information by accepting the operation of the operator. The acquisition unit 310 acquires, for example, the product type information received by the input unit 330.

The input unit 330 may be realized by a communication interface or the like for acquiring information from a user interface such as a touch panel.

The control unit 340 is a processing unit that controls the operation of the mounting device 100 via the output unit 350. For example, the control unit 340 identifies the positions of the marks 420 and 421 by analyzing the image generated by the image pickup unit 37, and mounts the component 440 on the substrate 400 based on the identified positions of the marks 420 and 421. Determine the position to make. More specifically, the control unit 340 determines the position of the mounting head 35 holding the component 440 based on the positions of the identified marks 420 and 421. By controlling the temporary crimping portion 30, the control device 300 mounts the component 440 on the substrate 400 at the position where the component 440 is mounted on the determined substrate 400.

Further, the control unit 340 reads the correction amount associated with the product type of the board 400 indicated by the product type information acquired by the acquisition unit 310 from the storage unit 370, and based on the read correction amount, the component is mounted on the board 400 on the mounting device 100. The mounting position, which is the position where the 440 is mounted, is corrected. In the present embodiment, the type correction information 371 is stored in advance in the storage unit 370. Specifically, the control unit 340 corrects (changes) the position of the mounting head 35 when the component 440 of the temporary crimping portion 30 is mounted on the substrate 400 based on the correction amount based on the type correction information 371. In addition, the operation of the mounting head moving mechanism 36 is corrected (changed).

For example, the control unit 340 initially determines the correction amount based on the type correction information 371 stored in advance in the storage unit 370. After that, for example, when the component 440 is mounted on the specified number of boards 400 and the calculation unit 320 calculates the correction amount based on the deviation amount L measured from each of the specified number of boards 400 by the inspection device 200, the control unit 340. Causes the mounting device 100 to correct the mounting position based on the correction amount calculated by the calculation unit 320. In this case, for example, the control unit 340 uses the correction amount calculated by the calculation unit 320 to indicate the product type of the substrate 400 indicated by the product type information acquired by the acquisition unit 310 in the type correction information 371 stored in the storage unit 370. Update the correction amount according to.

The type correction information 371 may not be stored in the storage unit 370 in advance before the mounting device 100 mounts the component 440 on the board 400. In this case, when the calculation unit 320 generates the type correction information 371, the control unit 340 stores the type correction information 371 generated by the calculation unit 320 in the storage unit 370. As described above, for example, the control unit 340 associates the correction amount calculated by the calculation unit 320 with the product type of the substrate 400 indicated by the product type information acquired by the acquisition unit 310, and stores the correction amount in the storage unit 370.

For example, when the mounting device 100 is stopped once and then the mounting is restarted, the control unit 340 corrects based on the product type information acquired by the acquisition unit 310 and the type correction information 371 stored in the storage unit 370. The amount is determined, the mounting position is corrected by the mounting device 100 with the determined correction amount, and then the mounting device 100 restarts the mounting.

As described above, the mounting device 100 mounts the component 440 on the substrates 400 of a plurality of types. The type correction information 371 includes information indicating a correction amount corresponding to each of the plurality of types of substrates 400. Further, for example, the calculation unit 320 calculates a correction amount corresponding to each of the plurality of types of substrates 400. The control unit 340 determines, for example, a correction amount according to the product type information acquired by the acquisition unit 310, and causes the mounting device 100 to correct the mounting position using the determined correction amount.

In this way, for example, the control unit 340 causes the mounting device 100 to correct the mounting position based on the first correction amount, and controls the mounting device 100 so that the first component is mounted on the first board. And a second mode in which the mounting position is corrected based on the second correction amount and the mounting device 100 is controlled so that the second component is mounted on a second board different from the first board. Selectively execute the process.

The first correction amount is a correction amount according to the first substrate. The second correction amount is a correction amount according to the second substrate. The first part and the second part may have the same type or different types. The control unit 340 selects, for example, which process to execute, the first mode or the second mode, based on the product type information acquired by the acquisition unit 310. For example, the control unit 340 selects the first mode when the product type information indicates the product type of the first substrate, and selects the second mode when the product type information indicates the product type of the second substrate. Further, for example, when the acquisition unit 310 acquires the product type information indicating the product type of the second substrate while the process of the first mode is being executed, the control unit 340 changes the process from the first mode to the second mode. On the other hand, for example, when the acquisition unit 310 acquires the product type information indicating the product type of the first substrate while the process of the second mode is being executed, the control unit 340 changes the process from the second mode to the first mode.

As described above, the control unit 340 updates the type correction information 371 stored in the storage unit 370 with the type correction information 371 generated by the calculation unit 320, for example. That is, the control unit 340 stores, for example, the type correction information 371 generated by the calculation unit 320 in the storage unit 370. Here, the timing at which the control unit 340 stores the type correction information 371 generated by the calculation unit 320 in the storage unit 370 may be immediately after the calculation unit 320 generates the type correction information 371, or the calculation unit 320 may perform the type correction. It does not have to be immediately after the information 371 is generated.

For example, when the process is changed from the first mode to the second mode, the control unit 340 stores the product of the first substrate and the first correction amount in the storage unit 370 in association with each other. Further, for example, when the control unit 340 changes the process from the second mode to the first mode, the first correction amount is read from the storage unit 370, and the mounting position is mounted on the mounting device 100 based on the read first correction amount. To correct. According to this, for example, the control unit 340 stores the first correction amount at the end of the processing of the first mode in the storage unit 370, and when the processing of the first mode is executed again, the first execution is executed. The mounting position can be corrected by the mounting device 100 by immediately using the first correction amount at the end of the processing of one mode.

Alternatively, for example, when changing the process from the second mode to the first mode, the control unit 340 stores the product of the second substrate and the second correction amount in the storage unit 370 in association with each other. Further, for example, when the control unit 340 changes the process from the first mode to the second mode, the second correction amount is read from the storage unit 370, and the mounting position is mounted on the mounting device 100 based on the read second correction amount. To correct. According to this, the control unit 340 stores, for example, the second correction amount at the time of ending the processing of the second mode in the storage unit 370, and when the processing of the second mode is executed again, the second execution is executed last time. The mounting position can be corrected by the mounting device 100 by immediately using the second correction amount at the end of the processing of the two modes.

The output unit 350 is a communication interface for outputting information indicating the processing executed by the control unit 340 to the control device 300.

The calculation unit 320 and the control unit 340 are realized by, for example, a control program stored in the storage unit 370 and indicating a processing procedure executed by each of the calculation unit 320 and the control unit 340, and a CPU that executes the control program. To.

The calculation unit 320 and the control unit 340 may be realized by one CPU or may be realized by different CPUs.

The storage unit 370 includes the size of the substrate 400, the type of the component 440, the mounting position (attachment of the ACF 430 and the mounting and crimping of the component 440), the mounting direction, the timing of transporting the substrate 400 between the devices, and the like. Various data necessary for executing the process, a control program executed by each processing unit included in the control device 300, and the like are stored. For example, the storage unit 370 has a plurality of boards on which the component 440 is mounted by the mounting device 100 so that the control unit 340 corrects the mounting position for mounting the component 440 on the board 400. Store for each of 400 varieties. In the present embodiment, the storage unit 370 stores the type correction information 371 including the product types of the plurality of substrates 400 and the correction amount associated with each of the product types of the plurality of substrates 400.

The storage unit 370 is realized by a ROM (Read Only Memory), a RAM (Random Access Memory), or the like.

[Processing procedure]
Subsequently, the processing procedure of the component mounting system 1 according to the embodiment will be described in detail.

FIG. 6 is a flowchart showing a processing procedure of the component mounting system 1 according to the embodiment. In the example shown below, the control unit 340 will be described as executing either the first mode or the second mode. Of course, the number of modes executed by the control unit 340 may be two or three or more.

First, the control unit 340 stores the correction amount for each type of the substrate 400 in the storage unit 370 (step S101). For example, the worker inputs the type correction information 371. The control unit 340 stores the type correction information 371 input by the input unit 330 in the storage unit 370.

Next, the acquisition unit 310 acquires the product type information (step S102).

Next, the control unit 340 selects a mode (step S103). For example, the control unit 340 determines whether to use the first mode or the second mode based on the product type information acquired by the acquisition unit 310.

For example, the control unit 340 selects the first mode when the product type of the substrate 400 indicated by the product type information acquired by the acquisition unit 310 in step S102 is the product type of the first substrate (“first mode” in step S103). ..

Next, the control unit 340 reads out the first correction amount, which is the correction amount according to the type of the first substrate, from the storage unit 370 (step S104).

Next, the control unit 340 causes the mounting device 100 to correct the mounting position based on the first correction amount (step S105).

Next, the mounting device 100 mounts the first component on the first board (step S106). Specifically, the control unit 340 controls the mounting device 100 so that the temporary crimping portion 30 mounts the component 440 on the substrate 400, and the main crimping portion 40 thermocompression-bonds the first component to the first substrate. ..

Next, the inspection device 200 measures the deviation amount L from the predetermined position of the position where the first component is mounted on the first substrate (step S107). For example, the inspection device 200 generates an image by imaging a first substrate on which the first component is mounted, and based on the generated image, for example, as shown in FIG. 5, the first component (in FIG. 5). The deviation amount L of the mark 421 provided on the component 440) from the predetermined position 450 is measured. The inspection device 200 sequentially outputs the measured deviation amount L to the control device 300.

Next, the calculation unit 320 causes the mounting device 100 to correct the mounting position where the mounting device 100 mounts the first component on the first board based on the deviation amount L measured by the inspection device 200. Is calculated (step S108).

Next, the control unit 340 updates the first correction amount so that the correction amount of the mounting position to be corrected by the mounting device 100 is the first correction amount calculated by the calculation unit 320 in step S108 (step S109). .. Here, the control unit 340 may or may not store the first correction amount calculated by the calculation unit 320 in step S108 in the storage unit 370. That is, the control unit 340 may or may not update the type correction information 371 stored in the storage unit 370 with the first correction amount calculated by the calculation unit 320 in step S108.

In step S108, the calculation unit 320 may calculate the first correction amount when the number of processed sheets of the mounting device 100 reaches the specified number of sheets. In this case, for example, when the number of processed devices 100 has reached the specified number, steps S108 and S109 may not be executed.

Next, the control unit 340 determines whether or not to change the mode (step S110). For example, the control unit 340 determines whether or not the acquisition unit 310 has acquired the product type information indicating the product type of the second substrate after selecting the first mode in step S103.

When the control unit 340 determines that the mode is not changed (No in step S110), the control unit 340 returns the process to step S105. For example, if the control unit 340 determines that the acquisition unit 310 has not acquired the product type information indicating the product type of the second substrate after selecting the first mode in step S103, the process returns to step S105.

When the process is returned to step S105, for example, when the first correction amount is updated in step S109, the mounting device 100 is made to correct the mounting position by using the updated first correction amount.

On the other hand, when the control unit 340 determines that the mode is to be changed (Yes in step S110), the control unit 340 stores the last updated first correction amount in the storage unit 370 (step S111). Specifically, the control unit 340 updates the first correction amount stored in the storage unit 370 according to the type of the first substrate, which is the first correction amount finally calculated in the calculation unit 320 in step S108. do. For example, if the control unit 340 determines that the acquisition unit 310 has acquired the product type information indicating the product type of the second substrate after selecting the first mode of step S103, the process shifts to step S111.

When the product type of the substrate 400 indicated by the product type information acquired by the acquisition unit 310 in step S102 is the product type of the second substrate after step S111 or in step S103 (“second mode” in step S103), control is performed. The unit 340 reads out the second correction amount, which is the correction amount according to the type of the second substrate, from the storage unit 370 (step S104a).

Next, the control unit 340 causes the mounting device 100 to correct the mounting position based on the second correction amount (step S105a).

Next, the mounting device 100 mounts the second component on the second board (step S106a). Specifically, the control unit 340 controls the mounting device 100 to mount the component 440 on the substrate 400 on the temporary crimping portion 30, and thermocompression-bond the second component on the second substrate on the main crimping portion 40. ..

Next, the inspection device 200 measures the deviation amount L from the predetermined position of the position where the second component is mounted on the second substrate (step S107a). For example, the inspection device 200 generates an image by imaging a second substrate on which the second component is mounted, and based on the generated image, for example, as shown in FIG. 5, the second component (in FIG. 5). The deviation amount L of the mark 421 provided on the component 440) from the predetermined position 450 is measured. The inspection device 200 sequentially outputs the measured deviation amount L to the control device 300.

Next, the calculation unit 320 causes the mounting device 100 to correct the mounting position where the mounting device 100 mounts the second component on the second board based on the deviation amount L measured by the inspection device 200. Is calculated (step S108a).

Next, the control unit 340 updates the second correction amount so that the correction amount of the mounting position to be corrected by the mounting device 100 is the second correction amount calculated by the calculation unit 320 in step S108a (step S109a). .. Here, the control unit 340 may or may not store the second correction amount calculated by the calculation unit 320 in step S108a in the storage unit 370. That is, the control unit 340 may or may not update the type correction information 371 stored in the storage unit 370 with the second correction amount calculated by the calculation unit 320 in step S108a.

In step S108a, the calculation unit 320 may calculate the second correction amount when the number of processed sheets of the mounting device 100 reaches the specified number of sheets. In this case, for example, when the number of processed devices 100 has reached the specified number, steps S108a and S109a may not be executed.

Further, the specified number of sheets may be the same or different between the first mode and the second mode.

Next, the control unit 340 determines whether or not to change the mode (step S110a). For example, the control unit 340 determines whether or not the acquisition unit 310 has acquired the product type information indicating the product type of the first substrate after the step S111 or after selecting the second mode in the step S103.

When the control unit 340 determines that the mode is not changed (No in step S110a), the control unit 340 returns the process to step S105a. For example, if the control unit 340 determines after step S111 or after selecting the second mode in step S103 that the acquisition unit 310 has not acquired the product type information indicating the product type of the first substrate, step S105a. Return the process to.

When the process is returned to step S105a, for example, when the second correction amount is updated in step S109a, the mounting device 100 is made to correct the mounting position by using the updated second correction amount.

On the other hand, when the control unit 340 determines that the mode is to be changed (Yes in step S110a), the control unit 340 stores the last updated second correction amount in the storage unit 370 (step S111a). Specifically, the control unit 340 updates the second correction amount according to the type of the second substrate stored in the storage unit 370 with the second correction amount finally calculated by the calculation unit 320 in step S108a. do. For example, if the control unit 340 determines that the acquisition unit 310 has acquired the product type information indicating the product type of the first substrate after the step S111 or after selecting the second mode in the step S103, the control unit 340 processes the product in step S104. To migrate.

[Effects, etc.]
As described above, the component mounting system 1 according to the embodiment corrects the mounting device 100 for mounting the component 440 on the board 400 and the mounting position where the mounting device 100 mounts the component 440 on the board 400 to the mounting device 100. The storage unit 370 that stores the correction amount for storing the correction amount for each type of the plurality of boards 400 on which the component 440 is mounted by the mounting device 100, and the type information indicating the type of the board 400 on which the component 440 is mounted by the mounting device 100. The correction amount associated with the acquisition unit 310 and the product type of the substrate 400 indicated by the product type information acquired by the acquisition unit 310 are read from the storage unit 370, and the mounting position is set on the mounting device 100 based on the read correction amount. A control unit 340 for correction is provided. In the present embodiment, the control unit 340 causes the mounting device 100 to correct the mounting position by causing the temporary crimping portion 30 to correct the mounting position of the component in the temporary crimping portion 30.

According to this, the control unit 340 can cause the mounting device 100 to correct the mounting position with a correction amount according to the type of the substrate 400 on which the component 440 is mounted by the mounting device 100. Therefore, it is possible to prevent the mounting accuracy (the rate at which the component 440 is mounted at an appropriate position) from being lowered every time the type of the substrate 400 on which the component 440 is mounted is switched in the mounting device 100. As a result, according to the component mounting system 1, the mounting accuracy can be stabilized.

Further, for example, the component mounting system 1 further causes the mounting device 100 to correct the mounting position based on the deviation amount L from the predetermined position 450 of the component 440 mounted on the board 400 by the mounting device 100. A calculation unit 320 for calculating a correction amount is provided. In this case, for example, the control unit 340 associates the correction amount calculated by the calculation unit 320 with the product type of the substrate 400 indicated by the product type information acquired by the acquisition unit 310, and stores it in the storage unit 370.

According to this, the correction amount is updated as the mounting device 100 mounts the component 440 on the board 400. Therefore, the mounting accuracy can be improved as the mounting device 100 mounts the component 440 on the substrate 400.

Further, for example, the control unit 340 corrects the mounting position based on the first correction amount, and controls the mounting device 100 so that the first component is mounted on the first board, and the second correction amount. A second mode in which the mounting device 100 is controlled so that the second component is mounted on a second board having a different type from that of the first board by correcting the mounting position based on the above, and one of the processes is selectively selected. To run. In this case, for example, when changing the process from the first mode to the second mode, the control unit 340 stores the product of the first substrate and the first correction amount in the storage unit 370 in association with each other. Further, for example, when the control unit 340 changes the process from the second mode to the first mode, the first correction amount is read from the storage unit 370, and the mounting position is mounted on the mounting device 100 based on the read first correction amount. To correct.

According to this, for example, the control unit 340 stores the first correction amount at the end of the processing of the first mode in the storage unit 370, and when the processing of the first mode is executed again, the first execution is executed. The mounting position can be corrected by the mounting device 100 by immediately using the first correction amount at the end of the processing of one mode. Therefore, according to the component mounting system 1, the mounting accuracy can be stabilized even if the type of the substrate 400 on which the component 440 is mounted is switched in the mounting device 100.

Further, in the component mounting method according to the embodiment, a plurality of parts 440 are mounted by the mounting device 100 with a correction amount for causing the mounting device 100 to correct the mounting position where the mounting device 100 mounts the component 440 on the substrate 400. The product type of the substrate 400 is stored in the storage unit 370 (step S101), and the product type information indicating the product type of the board 400 on which the component 440 is mounted is acquired by the mounting device 100 (step S102), and the acquired product type information indicates. The correction amount associated with the product of the board 400 is read from the storage unit 370 (for example, step S104), the mounting position is corrected by the mounting device 100 based on the read correction amount (step S105), and the board is corrected by the mounting device 100. The component 440 is mounted on the 400 (step S106).

According to this, the same effect as that of the component mounting system 1 is obtained.

(Other embodiments)
Although the component mounting system and the like according to the present embodiment have been described above based on the above-described embodiment, the present invention is not limited to the above-described embodiment.

For example, the substrate 400 is translucent and has a mark 420 on its top surface. As a result, the mark 420 can be imaged even if the image pickup unit 210 takes an image from below the substrate 400. Of course, the substrate 400 may have the mark 420 on the lower surface. In this case, the substrate 400 may or may not have translucency.

Further, for example, in the above embodiment, all or a part of the components of the control device 300 may be configured by dedicated hardware, or may be realized by executing a software program suitable for each component. May be done. Each component may be realized by a program execution unit such as a CPU (Central Processing Unit) or a processor reading and executing a software program recorded on a recording medium such as an HDD (Hard Disk Drive) or a semiconductor memory. good.

Further, the component of the control device 300 may be composed of one or a plurality of electronic circuits. The one or more electronic circuits may be general-purpose circuits or dedicated circuits, respectively.

The one or more electronic circuits may include, for example, a semiconductor device, an IC (Integrated Circuit), an LSI (Large Scale Integration), or the like. The IC or LSI may be integrated on one chip or may be integrated on a plurality of chips. Here, it is called IC or LSI, but the name changes depending on the degree of integration, and it may be called system LSI, VLSI (Very Large Scale Integration), or ULSI (Ultra Large Scale Integration). Further, FPGA (Field Programmable Gate Array) programmed after manufacturing the LSI can also be used for the same purpose.

In addition, it can be realized by arbitrarily combining the components and functions in each embodiment within the range obtained by applying various modifications to each embodiment and the purpose of the present invention. Forms are also included in the present invention.

The present invention can be used in a component mounting system for producing a display panel or the like by mounting a component on a substrate.

1 Parts mounting system 1a, 1b, 1c Base 10 Board carry-in part 11, 21, 31, 41, 51 Stage 20 Sticking part 22, 32, 42 Stage moving part 23 Sticking mechanism 30 Temporary crimping part 33 Parts supply part 34 Temporary crimping tool 35 Mounting head 36 Mounting head moving mechanism 37, 210 Imaging unit 40 Crimping part 43 Crimping tool 50 Board carrying part 60 Transporting unit 61 Moving base 62A, 62B, 62C, 62D Board transport mechanism 63 Base 64 Arm unit 100 Mounting device 200 Inspection device 220 Measurement unit 300 Control device 310 Acquisition unit 320 Calculation unit 330 Input unit 340 Control unit 350 Output unit 360 Display unit 370 Storage unit 371 Type correction information 400 Board 410 Electrode unit 420, 421 Mark 430 ACF
440 Parts 450 Predetermined position L Displacement amount

Claims (4)

A mounting device that mounts components on the board, and
A storage unit that stores a correction amount for causing the mounting device to correct the mounting position on which the component is mounted on the board for each type of a plurality of boards on which the component is mounted by the mounting device.
An acquisition unit that acquires product type information indicating the type of board on which components are mounted by the mounting device, and
A control unit that reads the correction amount associated with the type of the substrate indicated by the product type information acquired by the acquisition unit from the storage unit and causes the mounting device to correct the mounting position based on the read correction amount. Prepare, prepare
Component mounting system. Further, it is provided with a calculation unit for calculating a correction amount for causing the mounting device to correct the mounting position based on the deviation amount of the position of the component mounted on the board by the mounting device from a predetermined position.
The control unit associates the correction amount calculated by the calculation unit with the type of the substrate indicated by the product type information acquired by the acquisition unit and stores it in the storage unit.
The component mounting system according to claim 1. The control unit
A first mode in which the mounting position is corrected based on the first correction amount and the mounting device is controlled so that the first component is mounted on the first board.
A second mode in which the mounting position is corrected based on the second correction amount and the mounting device is controlled so that the second component is mounted on a second board having a different type from that of the first board. Selectively execute one of the processes,
When the process is changed from the first mode to the second mode, the product of the first substrate and the first correction amount are associated with each other and stored in the storage unit.
When the process is changed from the second mode to the first mode, the first correction amount is read from the storage unit, and the mounting device is made to correct the mounting position based on the read first correction amount.
The component mounting system according to claim 1 or 2. The correction amount for causing the mounting device to correct the mounting position where the mounting device mounts the component on the board is stored in the storage unit for each type of a plurality of boards on which the component is mounted by the mounting device.
The product type information indicating the product type of the board on which the component is mounted by the mounting device is acquired, and the product type information is acquired.
The correction amount associated with the board type indicated by the acquired product type information is read from the storage unit, and the mounting device is made to correct the mounting position based on the read correction amount.
Parts are mounted on the board by the mounting device.
Component mounting method.

Images