JPH0221134B2 - - Google Patents

Info

Publication number
JPH0221134B2
JPH0221134B2 JP26006784A JP26006784A JPH0221134B2 JP H0221134 B2 JPH0221134 B2 JP H0221134B2 JP 26006784 A JP26006784 A JP 26006784A JP 26006784 A JP26006784 A JP 26006784A JP H0221134 B2 JPH0221134 B2 JP H0221134B2
Authority
JP
Japan
Prior art keywords
lead frame
storage tower
center line
arrangement position
mounting table
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP26006784A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61139035A (ja
Inventor
Akira Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Seiki Machine Works Ltd
Original Assignee
Fuji Seiki Machine Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Seiki Machine Works Ltd filed Critical Fuji Seiki Machine Works Ltd
Priority to JP26006784A priority Critical patent/JPS61139035A/ja
Publication of JPS61139035A publication Critical patent/JPS61139035A/ja
Publication of JPH0221134B2 publication Critical patent/JPH0221134B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Specific Conveyance Elements (AREA)
JP26006784A 1984-12-11 1984-12-11 一側寄りにパツケ−ジを有するリ−ドフレ−ムの送り出し装置 Granted JPS61139035A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP26006784A JPS61139035A (ja) 1984-12-11 1984-12-11 一側寄りにパツケ−ジを有するリ−ドフレ−ムの送り出し装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26006784A JPS61139035A (ja) 1984-12-11 1984-12-11 一側寄りにパツケ−ジを有するリ−ドフレ−ムの送り出し装置

Publications (2)

Publication Number Publication Date
JPS61139035A JPS61139035A (ja) 1986-06-26
JPH0221134B2 true JPH0221134B2 (en, 2012) 1990-05-11

Family

ID=17342846

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26006784A Granted JPS61139035A (ja) 1984-12-11 1984-12-11 一側寄りにパツケ−ジを有するリ−ドフレ−ムの送り出し装置

Country Status (1)

Country Link
JP (1) JPS61139035A (en, 2012)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0413423U (en, 2012) * 1990-05-24 1992-02-03

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0413423U (en, 2012) * 1990-05-24 1992-02-03

Also Published As

Publication number Publication date
JPS61139035A (ja) 1986-06-26

Similar Documents

Publication Publication Date Title
CN207451079U (zh) 一种餐盘的自动上料下料设备
CN105792539B (zh) 一种高速贴片机
CN107293803A (zh) 物料堆叠生产线
CN113955501A (zh) 一种pcb板隔纸收板机
CN207530050U (zh) 电芯堆叠生产线
CN213566867U (zh) 撕膜装置
CN106184878B (zh) 瓷砖自动包装设备
CN105692229A (zh) 双吸料机铝基板堆叠线
CN109733676A (zh) 一种堆叠机
CN206481557U (zh) 贴片机送料装置
EP0416555A1 (en) Device for supplying electrical components having two carriers for feeding three or more component supply tables
US6276891B1 (en) Soft touch vacuum bar
CN116408635A (zh) 无线耳机充电盒铁片和磁铁组装设备及其操作方法
JPH0221134B2 (en, 2012)
CN216548551U (zh) 一种pcb板隔纸收板机
CN208516374U (zh) 全自动上下板机
CN207943228U (zh) 一种装填流水线设备
CN213905471U (zh) 一种顶盖和孔板的组装设备
CN210579528U (zh) 一种pcb板包边机
CN205587732U (zh) 一种设有治具回流升降台的pcb分板机
CN107244549A (zh) 一种具有自动夹持式抓取机器手臂的搬运机构
CN210911701U (zh) 一种名片自动打印装置
CN207890589U (zh) 一种vcm马达弹片折耳摆盘设备
JP3901305B2 (ja) ワーク集積装置における無傷集積方法
CN213864332U (zh) 一种收放柔板自动化上下料的设备

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees