JPH0220144B2 - - Google Patents
Info
- Publication number
- JPH0220144B2 JPH0220144B2 JP57197595A JP19759582A JPH0220144B2 JP H0220144 B2 JPH0220144 B2 JP H0220144B2 JP 57197595 A JP57197595 A JP 57197595A JP 19759582 A JP19759582 A JP 19759582A JP H0220144 B2 JPH0220144 B2 JP H0220144B2
- Authority
- JP
- Japan
- Prior art keywords
- leads
- recognition
- lead
- field
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H10W99/00—
-
- H10W72/0711—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57197595A JPS5988839A (ja) | 1982-11-12 | 1982-11-12 | 半導体装置用リードの位置認識方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57197595A JPS5988839A (ja) | 1982-11-12 | 1982-11-12 | 半導体装置用リードの位置認識方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5988839A JPS5988839A (ja) | 1984-05-22 |
| JPH0220144B2 true JPH0220144B2 (enExample) | 1990-05-08 |
Family
ID=16377094
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57197595A Granted JPS5988839A (ja) | 1982-11-12 | 1982-11-12 | 半導体装置用リードの位置認識方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5988839A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05312693A (ja) * | 1991-10-09 | 1993-11-22 | Avl Medical Instr Ag | 分析装置 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10921365B2 (en) * | 2019-04-11 | 2021-02-16 | Arista Networks, Inc. | High-potential testing of conductive lands of a printed circuit board |
-
1982
- 1982-11-12 JP JP57197595A patent/JPS5988839A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05312693A (ja) * | 1991-10-09 | 1993-11-22 | Avl Medical Instr Ag | 分析装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5988839A (ja) | 1984-05-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0041870B1 (en) | Pattern position recognition apparatus | |
| JP3522280B2 (ja) | ボールボンド検査システム用の方法および装置 | |
| EP0478116A1 (en) | Method of centering bond positions | |
| JP2851151B2 (ja) | ワイヤボンディング検査装置 | |
| US7424143B2 (en) | Method for recognizing working position of a device transfer apparatus in semiconductor test handler | |
| KR960043055A (ko) | 반도체 디바이스의 픽업 장치 및 픽업 방법 | |
| JPH0220144B2 (enExample) | ||
| US7032299B2 (en) | Apparatus for mounting electronic parts | |
| US6774931B1 (en) | Inspection method and device by movement of the field of view of the camera | |
| JPH05332739A (ja) | 外観検査装置 | |
| JPS61148828A (ja) | ワイヤボンデイングの検査方法 | |
| JPS59144140A (ja) | ワイヤボンデイング部の検査方法 | |
| JPS58125837A (ja) | 自動ダイボンダのペレツト位置決め装置 | |
| JPH04315905A (ja) | 物体検査装置 | |
| JPS5867033A (ja) | ワイヤボンデイング方法 | |
| JPS58200548A (ja) | リ−ド認識装置 | |
| JPH0134345Y2 (enExample) | ||
| JPH1064944A (ja) | 自動位置合わせ装置、自動位置合わせ機能を有する電子部品加工装置及び半導体チップ | |
| JP3169046B2 (ja) | チップの認識方法及びその認識装置 | |
| JPH0810711B2 (ja) | 微小ワ−ク片の認識方法 | |
| JPS59139638A (ja) | 半導体装置の検査方法及び装置 | |
| JP2535648B2 (ja) | ワイヤボンディング装置 | |
| JPS61193053A (ja) | 画像処理による検査の方法 | |
| JPH0732188B2 (ja) | 半導体装置の検査装置 | |
| JPH01284703A (ja) | 形状検査装置 |