JPH0219967Y2 - - Google Patents
Info
- Publication number
- JPH0219967Y2 JPH0219967Y2 JP1985173762U JP17376285U JPH0219967Y2 JP H0219967 Y2 JPH0219967 Y2 JP H0219967Y2 JP 1985173762 U JP1985173762 U JP 1985173762U JP 17376285 U JP17376285 U JP 17376285U JP H0219967 Y2 JPH0219967 Y2 JP H0219967Y2
- Authority
- JP
- Japan
- Prior art keywords
- wire
- ball
- radius
- diameter
- tool
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000003780 insertion Methods 0.000 claims description 4
- 230000037431 insertion Effects 0.000 claims description 4
- 238000002788 crimping Methods 0.000 description 4
- 238000003491 array Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
- H01L2224/78302—Shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985173762U JPH0219967Y2 (US20110009641A1-20110113-C00116.png) | 1985-11-12 | 1985-11-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985173762U JPH0219967Y2 (US20110009641A1-20110113-C00116.png) | 1985-11-12 | 1985-11-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6282735U JPS6282735U (US20110009641A1-20110113-C00116.png) | 1987-05-27 |
| JPH0219967Y2 true JPH0219967Y2 (US20110009641A1-20110113-C00116.png) | 1990-05-31 |
Family
ID=31111525
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985173762U Expired JPH0219967Y2 (US20110009641A1-20110113-C00116.png) | 1985-11-12 | 1985-11-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0219967Y2 (US20110009641A1-20110113-C00116.png) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5313343U (US20110009641A1-20110113-C00116.png) * | 1976-07-16 | 1978-02-03 | ||
| JPS54160168A (en) * | 1978-06-09 | 1979-12-18 | Citizen Watch Co Ltd | Pressure bonding capillary chip |
-
1985
- 1985-11-12 JP JP1985173762U patent/JPH0219967Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5313343U (US20110009641A1-20110113-C00116.png) * | 1976-07-16 | 1978-02-03 | ||
| JPS54160168A (en) * | 1978-06-09 | 1979-12-18 | Citizen Watch Co Ltd | Pressure bonding capillary chip |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6282735U (US20110009641A1-20110113-C00116.png) | 1987-05-27 |
