JPH02188937A - Tape carrier for tab of inner-lead connection system, and manufacture of semiconductor integrated circuit using same - Google Patents

Abstract

PURPOSE:To obtain a tape carrier in which a deformation of inner leads and an irregu larity in their height are small, whose reliability of an element bonding operation is high and whose pitch is fine by a method wherein all tip parts of the inner leads are formed collectively in such a way that they are connected to a connection plate made of a metal foil via narrow parts which can be broken by an external force. CONSTITUTION:In a tape carrier 1 for TAB use, the following are formed: an organic insulating material tape 4 having a device and hole 3 used to assemble a semiconductor integrated circuit element; inner leads 2, made of a metal foil, which are extended on the surface of the tape 4 toward the device hole 3. All tip parts of said inner leads 2 are formed collectively in such a way that they are connected to a connection plate 11 made of a metal foil via narrow parts 2a which can be broken by an external force. The semiconductor integrated circuit element is mounted on the inner leads 2 of the tape carrier 1 for TAB use; after that, said connection plate 11 is stripped off mechanically at said narrow parts 2a; the individual inner leads 2 are insulated electrically; and a semiconductor integrated circuit is manufactured.

Description

DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to an inner lead-connected TAB tape carrier and a method of manufacturing a semiconductor integrated circuit using the same.

<Conventional Technology> Automation is being attempted in semiconductor element mounting technology to mass-produce products with performance above a certain level at high speed.

One of the semiconductor element mounting techniques developed for the purpose of this automation is to incorporate semiconductor elements into a long tape carrier by wireless bonding.
(Tape Automated Bondin, g)
There is a method.

In this TAB, a bump is provided on each electrode terminal of a semiconductor element, and after the bump and the inner lead of the corresponding tape carrier are bonded by thermocompression using a bonding tool, the bump is sealed with an insulating fluid resin, and then a surface protection coat is applied. This operation is performed continuously.

Recently, the application of IC packages using TAB tape carriers has been expanding from conventional consumer devices such as watches to personal computers, high-quality LCD televisions, etc., and their practical use is rapidly progressing from so-called high-end consumer devices to commercial use. .

Such a conventional TAB tape carrier has a structure shown in FIG. 5, for example.

Although FIG. 5 shows an 18-pin TAB tape carrier 1, in reality, TAB tape carriers with 100 to 300 pins are the mainstream.

In the conventional structure, as shown in FIG. 5, the tips of the inner leads 2 are completely independent and protrude 0.5 to 1.0 mm toward the inside of the device hole 3.

Inner lead 2 has a thickness of 18 to 35 μm and a width of 60 to 1
It has a fine finger shape of 00 μm, and its biggest drawback is that it is more easily deformed as the number of pins increases.

Note that 4 is a film, 5 is a pilot hole, 6 is an outer lead, and 7 is an end face of a device hole.

A conventional TAB tape carrier having a lead pattern shown in FIG. 5 has a standard 35 m
First, a device hole 3 for mounting a semiconductor integrated circuit element 8 (hereinafter referred to as an RC element) is opened in an m-wide polyimide film 4 or an organic insulating material tape such as glass epoxy, and a copper foil with a thickness of 18 to 35 μm is completely covered on the surface. The structure was such that patterns of inner leads 2 and actor leads 6 were formed by pasting and photoetching.

As shown in FIG. 6, in this TAB tape carrier, the IC element 8 is attached to the device hole 3, the inner lead 2 and the IC element electrode 9 are bonded to each other, and the area indicated by the dotted line is covered with a sealing resin 10. It was designed to be sealed with

<Problems to be Solved by the Invention> By the way, the conventional TAB tape carrier has the following problems.

(1) The inner lead 2 is easily deformed and cannot be aligned with the IC element electrode 9.

(2) The inner lead 2 fluctuates in the height direction, and when the inner lead 2 and the IC element 8 are bonded, the position detection camera is out of focus, which tends to cause bonding errors.

(3) It is impossible to manufacture a fine pitch TAB tape carrier. That is, a tape carrier for fine pitch TAB with narrow inner leads 2 (inner lead width 50 μm or less, distance between inner leads 2 W850 μm)
(hereinafter referred to as a pitch of 100 μm or less), when the tips of the inner leads 2 are separated, thinning occurs due to the turbulent flow of the etching liquid, and the protrusion dimension d in the direction of the device hole 3 shown in FIG. 5 becomes uneven. If the inner lead is bonded to the IC element electrode 9 in this state, the shortened inner lead will cause a bonding failure.

The present invention solves the problems of the above-mentioned prior art, has high element bonding reliability, and provides a fine-pitch inner lead connection type TA.
The present invention aims to provide a B tape carrier and a method for manufacturing a semiconductor integrated circuit using the same.

Means for Solving the Problems> In order to achieve the above object, the present invention provides an organic insulating material tape having a device hole for incorporating a semiconductor integrated circuit element, and an organic insulating material tape having a surface of the tape extending toward the device hole. TAB formed with metal foil inner lead
In the tape carrier for inner lead connecting type TAB, wherein all the tips of the inner leads are integrally formed by connecting to a metal foil connecting plate via a narrow part that can be broken by external force. A tape carrier) is provided.

It is preferable that the metal foil is a copper foil or a copper alloy foil.

Further, according to the present invention, when manufacturing a semiconductor integrated circuit using the TAB tape carrier, the TAB tape carrier is prepared, and a semiconductor integrated circuit element is mounted on the inner lead of the TAB tape carrier. There is provided a method for manufacturing a semiconductor integrated circuit, characterized in that the connecting plate is then mechanically peeled off at the narrow portion to electrically insulate each inner lead. Explain in detail.

The organic insulating material tape used in the present invention is a film-like long tape with a predetermined width, and has good processability, heat resistance, radiation resistance, moisture resistance, etc. Any tape may be used as long as it is made of a polymeric material, and typical examples of the organic insulating material include polyimide, glass epoxy, epoxy resin, epoxy polyimide, polyimide silicone, and photosensitive polyimide. The thickness of this tape is not particularly limited as long as it has the thickness of a tape used for a TAB tape carrier, but it may be, for example, usually about 75 to 125 μm.

Further, as the metal foil used in the present invention, any metal foil may be used as long as it is made of a metal with good conductivity and can form a lead pattern or a wiring pattern by a photoetching method. For example, copper is typically used. Examples include foil and copper alloy foil.

Moreover, the thickness of this metal foil is not particularly limited, and TAB
The thickness required for the tape carrier may be appropriately selected depending on the wiring pattern of the metal foil, rigidity, etc.
The thickness may be approximately 8 to 35 μm.

Further, the surfaces of these metal foils may be treated with solder plating, tin plating, etc.

In addition, in the present invention, the wiring pattern formed on the metal foil layer is the lead pattern for IC element (first
Of course, the present invention is not limited to the above (the same applies to the figures), and a necessary wiring pattern may be formed by photo-etching or the like depending on the components, circuits, devices, elements, etc. to be mounted.

The adhesive for the metal foil used in the present invention may be any adhesive as long as it can suitably attach the metal foil to the organic insulating material tape, and has insulating properties, heat resistance, and moisture resistance. is preferable, and representative examples thereof include epoxy adhesives, urethane adhesives, silicone resin adhesives, and the like.

The most characteristic feature of the present invention is that, as shown in FIG. 2, all the tips of the inner leads 2 are connected to the metal foil connecting plate 11 via the narrow portion 2a that can be broken by external force, and are integrated into one body. It lies in the fact that it was formed. This connecting plate 11 can be easily mechanically peeled off and removed after the inner leads 2 and the IC element electrodes 9 are connected, and each inner lead 2 can be electrically insulated. This separation does not require chemical means, but is performed by physical or mechanical means, so it is necessary to make the width of the narrow part 2a at the tip of the inner lead 2 narrower than the width of the inner lead 2. It is.

The shape of the connecting plate 11 is not limited to the plate-like one shown in FIG. 1, but may be a connecting plate 11a having a shape in which a part of the inner side is hollowed out to an appropriate size as shown in FIG. 3, for example. This is preferable because the peeling operation can be easily performed. In this case, if the dimension a shown in FIG. 3 is made too small, there is a risk that the connecting plate 11a will break. Further, the width of the narrow portion 2a needs to be smaller than the dimension a and the width of the inner lead 2.

Next, a method for manufacturing a semiconductor integrated circuit using the TAB tape carrier of the present invention will be explained.

First, prepare the TAB tape carrier of the present invention,
As shown in FIG. 4, after the inner lead 2 of this TAB tape carrier and the IC element electrode 9 are bonded at once, the connecting plate 11 is mechanically peeled off using a screw set or the like. 11 can be easily separated at the narrow portion 2a at the tip of each inner lead 2, and each inner lead 2 can be electrically insulated.

Subsequently, as shown in FIG. 6, the region indicated by the dotted line is sealed with a sealing resin 10 by a conventional method, and a semiconductor integrated circuit is completed.

<Example> Hereinafter, the inner lead-connected TAB tape carrier according to the present invention will be described in more detail based on a preferred example shown in the accompanying drawings, but the present invention is not limited thereto.

FIG. 1 is a plan view of an inner lead-connected TAB tape carrier of the present invention. In this embodiment, a tape-shaped polyimide film is used as the organic insulating material tape, and copper foil is used as the metal foil.

As shown in the figure, the tape carrier 1 for inner-lead connected type TAB is made by pasting a copper foil layer on the surface of a polyimide film 4 using an adhesive, and the surface copper foil layer is made of an IC element formed in the polyimide film 4. 8 Device hole 3 for mounting
A lead pattern, ie, a wiring pattern for an IC element, is formed having inner leads 2 extending toward. All the tips of the inner leads 2 are integrally connected to the copper foil connecting plate 11 via the narrow portion 2a.

The TAB tape carrier 1 has an IC element electrode (
For example, after performing gigantic bonding on the Au bumps 9 and the inner leads 2 at once, the connecting plate 11 is peeled off, and the area shown by the dotted line in FIG. 6 is sealed with a sealing resin 10.

The surface of such an inner lead connected type TAB tape carrier 1 may be similar to the surface of a conventional TAB tape carrier, and has a surface configuration as shown in FIG. 1, for example. A long polyimide film 4 has a device hole 3 for an actual device C element in its center, and pilot holes 5 are continuously provided on both sides at predetermined intervals. Around the device hole 3, copper foil leads are formed in a predetermined lead pattern, consisting of an inner lead 2 extending to the device hole 3 and an actor lead 6 stuck to a polyimide film.

These leads are integrated with the connecting plate 11 via the narrow portion 2a to form a surface copper foil layer.

(Example 1) An inner lead 1 as a tape carrier for an inner lead connected type TAB of the present invention having a planar shape shown in FIG.
A version for 00 pins was manufactured. In this method of manufacturing a TAB tape carrier, first, a polyimide film 4 is punched to form device holes 3. next,
A copper foil layer was attached to the entire surface of a 35 mm wide polyimide film 4 except for the pilot hole 5 using an epoxy adhesive, and inner leads 2 and outer leads 6 were formed in a predetermined lead pattern using a photoresist method.

At this time, the device hole 3 portion was integrally connected to the connecting plate 11 via the narrow portion 2a at the tip of each inner lead 2, as shown in an enlarged view in FIG. The thickness of the copper foil layer was 35 μm, the width of one pattern was 50 μm, and the width of the tip of each inner lead 2 was 30 μm.

To join this TAB tape carrier to the IC element electrode 9, a conventional GB tool can be used as is.As shown in FIG. (350 to 450°C) for 2 seconds at a load of about 60 g per electrode to complete bonding.

Thereafter, by tearing off the connecting plate 11, the leads could be made completely independent. This tearing off was easy with tweezers with protruding tips made specifically for semiconductors.

The cross-sectional shape of the bonded portion after tearing is as shown in FIG. 4, and the inner leads 2 have little deformation, little variation in height, etc., and have a fine pitch with high reliability for device bonding.

(Example 2) The inner lead connecting type TAB of the present invention was prepared in the same manner as in Example 1, except that the connecting plate 11a had a shape in which a part of the inside was hollowed out to an appropriate size as shown in FIG. A tape carrier was manufactured.

This method has the advantage that the connecting plate 11a can be easily torn off, and it is extremely easy to pick up the connecting plate 11a with tweezers.

Note that if the dimension a shown in FIG. 3 is made too small, there is a risk that the connecting plate 11a will break, and the number of times the bow will be torn off will increase, so the value of a needs to be sufficiently larger than the width of the inner lead.

<Effects of the Invention> Since the present invention is configured as described above, the position of the tip of the inner lead is supported by the connecting plate through the narrow part, and deformation of the inner lead, variation in height, etc. is minimized. We were able to obtain a fine-pitch, multi-pin, inner lead-connected TAB tape carrier with high reliability in device bonding.

Furthermore, according to the method of manufacturing a semiconductor integrated circuit using the inner lead-connected TAB tape carrier of the present invention, the connecting plate can be easily mechanically peeled off, increasing the speed of gigantic bonding and improving the IC element mounting yield. has improved.

[Brief explanation of the drawing]

FIG. 1 is a plan view of an embodiment of the inner lead-connected TAB tape carrier according to the present invention. FIG. 2 is a partially enlarged view of the vicinity of the tip of the inner lead. FIG. 3 is a partially enlarged view showing another example of the vicinity of the tip of the inner lead. FIG. 4 is a sectional view of the IC element connection portion. FIG. 5 is a plan view of a conventional TAB tape carrier. FIG. 6 is a sectional view of a conventional TAB tape carrier. Explanation of symbols 1... TAB tape carrier, 2... Inner lead, 2a... Narrow part, 3... Device hole, 4... Film (polyimide film), 5... Pilot hole, 6. ... Actor lead, 7... End face of device hole, 8... IC element, 9... XC element electrode, 10... Sealing resin, 11... Connection plate, 12 Axis 〇B tool

Claims (3)

[Claims] (1) In a TAB tape carrier comprising an organic insulating material tape having a device hole for incorporating a semiconductor integrated circuit element and a metal foil inner lead extending toward the device hole on the surface of the tape, all of the inner leads are formed. A tape carrier for an inner-lead connected type TAB, characterized in that the tip portion of the TAB is integrally formed by being connected to a metal foil connecting plate via a narrow portion that can be broken by external force. (2) The inner lead-connected TAB tape carrier according to claim 1, wherein the metal foil is a copper foil or a copper alloy foil. (3) When manufacturing a semiconductor integrated circuit using the TAB tape carrier according to claim 1 or 2, the TAB tape carrier according to claim 1 or 2 is prepared, and the inner leads of the TAB tape carrier are prepared. A method for manufacturing a semiconductor integrated circuit, comprising: mounting a semiconductor integrated circuit element on a semiconductor integrated circuit, and then mechanically peeling off the connecting plate at the narrow portion to electrically insulate each inner lead.