JPH0217651A - Chip packaging apparatus - Google Patents
Chip packaging apparatusInfo
- Publication number
- JPH0217651A JPH0217651A JP63168071A JP16807188A JPH0217651A JP H0217651 A JPH0217651 A JP H0217651A JP 63168071 A JP63168071 A JP 63168071A JP 16807188 A JP16807188 A JP 16807188A JP H0217651 A JPH0217651 A JP H0217651A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- suction
- tape
- collet
- chips
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004806 packaging method and process Methods 0.000 title 1
- 238000005336 cracking Methods 0.000 abstract description 7
- 239000004065 semiconductor Substances 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
- H01L2221/68322—Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
Landscapes
- Supply And Installment Of Electrical Components (AREA)
- Die Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野〕
本発明は半導体チップ、チップコン゛デンサなどのチッ
プをエキスパンドテープからピックアップして所定の材
温に移し替えるチップ実装装置に係り、特にピックアッ
プ時のチップの割れを効果的に防止することが可能なチ
ップ実装装置に関する。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a chip mounting device that picks up chips such as semiconductor chips and chip capacitors from an expanded tape and transfers them to a predetermined material temperature, and in particular, The present invention relates to a chip mounting device that can effectively prevent chip cracking.
半導体チップの製造においては、エキスパンドテープに
粘着された半導体ウェー八をダイヤモンドカッタなどで
ダイシングして個々のチップに分割した後、チップをエ
キスパンドテープからピックアップしてパッケージに実
装するチップ実装装置が使用される。第4図はこのチッ
プ実装装置の従来例の作動を示す。この実装装置はチッ
プ41の外形寸法に合わせた吸着口42を有するコレッ
ト43と、チップ41の下方に設けられるホルダ44と
、これに支持されてチップ41を下から突き上げる突上
げビン45とを備えている。チップ41は同図(a)の
ように粘着剤が塗布された工キスバンドテープ46上に
支持された状態で、コレット43と突上げピン45との
間に移送される。In the manufacture of semiconductor chips, a chip mounting device is used that divides a semiconductor wafer adhered to an expanded tape into individual chips by dicing it with a diamond cutter or the like, and then picks up the chips from the expanded tape and mounts them on a package. Ru. FIG. 4 shows the operation of a conventional example of this chip mounting apparatus. This mounting device includes a collet 43 having a suction port 42 that matches the external dimensions of the chip 41, a holder 44 provided below the chip 41, and a push-up bin 45 that is supported by the collet 43 and pushes up the chip 41 from below. ing. The chip 41 is transferred between the collet 43 and the push-up pin 45 while being supported on the adhesive band tape 46, as shown in FIG. 4(a).
移送に先立って、半導体ウェーハのダイシングが行なわ
れてチップを個々に分離するためのダイシング溝が形成
される。そして、このダイシングの後のエキスパンドテ
ープ46の周辺部がリング47に掛は渡され.エキスパ
ンドテープ46を伸張させると、半導体ウェーハはダイ
シング溝に沿ってチップ毎に分割され且つチップが相互
に分離した状態となる(第4図(a))。Prior to transfer, the semiconductor wafer is diced to form dicing grooves for separating the chips into individual chips. After this dicing, the peripheral portion of the expanded tape 46 is passed through a ring 47. When the expandable tape 46 is stretched, the semiconductor wafer is divided into chips along the dicing grooves, and the chips are separated from each other (FIG. 4(a)).
次に、この従来例に係る実装装置の作動を説明する。Next, the operation of the mounting apparatus according to this conventional example will be explained.
第4図(a)のようにチップ41はエキスパンドテープ
46上で個々に分割され、コレット43と突上げピン4
5の間に移送される。チップ41が突上げピン45の真
上に位置した状態で突上げピン45が上昇することによ
ってチップ41の突上げが行なわれる。この突上げによ
りチップ41周辺のエキスパンドテープ46が剥離した
状態となり、この状態のチップ41にコレット43が下
降して、その吸着口42が密着する(第4図(b))。As shown in FIG. 4(a), the chip 41 is individually divided on an expandable tape 46, and a collet 43 and a push-up pin 4
Transferred between 5 and 5. The chip 41 is pushed up by raising the pushing up pin 45 with the chip 41 positioned directly above the pushing up pin 45. This push-up causes the expanded tape 46 around the chip 41 to be peeled off, and the collet 43 descends to the chip 41 in this state, and its suction port 42 comes into close contact with the chip 41 (FIG. 4(b)).
コレット43は真空ポンプなどに接続されて内部が真空
状態となっているため、チップ41は真空吸引力によっ
てコレットに吸引されてエキスパンドテープ46からピ
ックアップされる。Since the collet 43 is connected to a vacuum pump or the like and is in a vacuum state, the chip 41 is attracted to the collet by the vacuum suction force and is picked up from the expanding tape 46.
次に、コレット43はチップ41を保持した状態でパッ
ケージ48上に移動しく同図(C)) 、吸引力を解除
する。これにより、チップ41はパッケージ48上に塗
布された金/シリコンあるいは金/錫などのソルダ49
によって接着されてチップ41の実装が終了する。Next, the collet 43 moves onto the package 48 while holding the chip 41 (FIG. 4(C)), and releases the suction force. As a result, the chip 41 is attached to a solder 49 of gold/silicon or gold/tin coated on the package 48.
This completes the mounting of the chip 41.
しかし従来の実装装置では、突上げピン45による突上
げの衝撃でチップ41に割れを生じ易く、このチップ割
れによって歩留りが低下している。However, in the conventional mounting apparatus, the chip 41 is likely to crack due to the impact of the push-up by the push-up pin 45, and the yield is reduced due to this chip crack.
このチップ割れは特に、チップが大型の場合や襞間性を
有する化合物半導体の場合に顕著であり、チップ実装時
の大きな問題点となっている。This chip cracking is particularly noticeable when the chip is large or is made of a compound semiconductor with folds, and is a major problem when mounting the chip.
そこで本発明は、ピックアップ時のチップ割れを防止し
て歩留りを向上させることが可能なチップ実装装置を提
供することを目的とする。SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a chip mounting apparatus that can prevent chip cracking during pickup and improve yield.
上記目的を達成するため本発明は、チップ周辺のエキス
パンドテープの剥離を吸引力で行なうようにしたもので
ある。このため本発明に係るチップ実装装置は、エキス
パンドテープ上で個々に分割されたチップを真空吸引力
でエキスパンドテープからピックアップするコレットと
、エキスパンドテープ下面からチップを支持する支持部
およびエキスパンドテープ下面に密着する吸引口を有し
、真空吸引力でチップ周辺のエキスパンドテープを剥離
する吸引ステージとを備えていることを特徴とする。In order to achieve the above object, the present invention uses suction to peel off the expanded tape around the chip. For this reason, the chip mounting apparatus according to the present invention includes a collet that picks up chips that have been individually divided on the expanding tape from the expanding tape by vacuum suction, a supporting portion that supports the chips from the bottom surface of the expanding tape, and a support portion that is tightly attached to the bottom surface of the expanding tape. The device is characterized in that it has a suction port to remove the expandable tape around the chip using vacuum suction force, and a suction stage that peels off the expanded tape around the chip.
本発明に係るチップ実装装置は、以上の通りに構成され
るので、吸引ステージの当接によりチップ周辺のエキス
パンドテープが真空吸引力で剥離されるようになってい
る。Since the chip mounting apparatus according to the present invention is configured as described above, the expanding tape around the chip is peeled off by the vacuum suction force when the suction stage comes into contact with the chip mounting apparatus.
以下、本発明を添付図面により具体的に説明する。なお
、図面の説明において同一要素には同一符号を付し、重
複する説明を省略する。Hereinafter, the present invention will be explained in detail with reference to the accompanying drawings. In addition, in the description of the drawings, the same elements are given the same reference numerals, and redundant description will be omitted.
第1図は本発明の一実施例の作動を示す側面図であり、
第2図はその吸引ステージの斜視図である。チップ実装
装置はコレット1と、吸引ステージ2とを備える。コレ
ット1はチップ41の外形寸法に合わせた吸着口3が下
端部に形成されていると共に、内部には吸引路4が形成
され、この吸引路4が真空ポンプなどの真空装置(図示
せず)に接続されている。従って、コレット1は従来例
と同様な作動により、その真空吸引力でチップ41を吸
着してチップのピックアップを行なう。FIG. 1 is a side view showing the operation of an embodiment of the present invention;
FIG. 2 is a perspective view of the suction stage. The chip mounting apparatus includes a collet 1 and a suction stage 2. The collet 1 has a suction port 3 formed at its lower end that matches the external dimensions of the chip 41, and a suction path 4 formed inside the collet 1, which is connected to a vacuum device such as a vacuum pump (not shown). It is connected to the. Therefore, the collet 1 operates in the same manner as in the conventional example, and uses its vacuum suction force to adsorb the chip 41 and pick up the chip.
吸着ステージ2は内部が空洞となったパイプ状をなし、
真空装着(図示せず)に接続されることにより空洞部が
吸引路5となっている。この吸引ステージ2は上端部が
開放されて吸引口6が形成され、この吸引口6がチップ
41を支持するエキスパンドテープ46の下面に密着す
る。この密着を行なうため、吸引ステージ2はエキスパ
ンドテープ46の方向に上下動するように駆動される。The adsorption stage 2 has a hollow pipe shape,
The cavity forms a suction path 5 by being connected to a vacuum attachment (not shown). The suction stage 2 has an open upper end to form a suction port 6, and the suction port 6 is brought into close contact with the lower surface of the expandable tape 46 that supports the chip 41. To achieve this close contact, the suction stage 2 is driven to move up and down in the direction of the expanded tape 46.
かかる吸引ステージ2の吸引口6の間には、第2図に示
すように十字状の支持部7が形成され、吸引時における
チップ41の部分的な支持を行なうようになっている。As shown in FIG. 2, a cross-shaped support portion 7 is formed between the suction ports 6 of the suction stage 2 to partially support the tip 41 during suction.
この場合、吸引ステージ2の吸引口6はピックアップさ
れるチップ41の外形と同等か、あるいは幾分大きい径
となるように形成され、その真空吸引力でチップ41周
辺のエキスパンドテープ46を吸い込むように作用する
。In this case, the suction port 6 of the suction stage 2 is formed to have a diameter that is equal to or somewhat larger than the outer shape of the chip 41 to be picked up, and the expanded tape 46 around the chip 41 is sucked in with its vacuum suction force. act.
次に、上記の実施例に係る構成の作動を説明する。Next, the operation of the configuration according to the above embodiment will be explained.
チップ41はエキスパンドテープ46上で個々に分割さ
れた状態で、コレット1と吸引ステージ2の間に移送さ
れる(第1図(a))。まず、吸引ステージ2が上昇し
て、その吸引口6がエキスパンドテープ46に密着する
。吸引口6の密着でチップ41は支持部7によって部分
的に支持されており、この状態で真空吸引を行なうと、
支持部7が当接した部分以外のエキスパンドテープ46
が吸引路5の方向に引かれる。これにより、チップ41
周辺のエキスパンドテープ46aがチップ41から剥離
される。この場合、チップ41は支持部7によって支承
されているので、吸引路5に吸引されることがない。The chips 41 are individually divided on an expandable tape 46 and transferred between the collet 1 and the suction stage 2 (FIG. 1(a)). First, the suction stage 2 rises and its suction port 6 comes into close contact with the expanded tape 46. The chip 41 is partially supported by the support part 7 due to the close contact of the suction port 6, and when vacuum suction is performed in this state,
Expand tape 46 other than the part where support part 7 abuts
is pulled in the direction of the suction path 5. As a result, the chip 41
The peripheral expanded tape 46a is peeled off from the chip 41. In this case, since the tip 41 is supported by the support portion 7, it will not be sucked into the suction path 5.
次に、コレット1が下降して、この吸若口3がチップ4
1に密着する。この状態でコレット1が真空吸引を行な
うと、周辺部のエキスパンドテープ46aが剥離されて
エキスパンドテープの粘着力が小さくなっているため、
チップ41は円滑にエキスパンドテープ46から離れて
コレット1に保持される(同図(b))。Next, the collet 1 descends, and this young suction port 3 connects to the tip 4.
Closely adheres to 1. When the collet 1 performs vacuum suction in this state, the expanded tape 46a on the periphery is peeled off and the adhesive force of the expanded tape is reduced.
The chip 41 is smoothly separated from the expanding tape 46 and held by the collet 1 (FIG. 4(b)).
このような構成ではチップを突き上げる必要がないため
、突上げ衝撃が何らチップに作用せず、チップの割れを
防止することができ、これにより歩留りが向上する。In such a configuration, since there is no need to push up the chips, no push-up impact acts on the chips, making it possible to prevent chips from cracking, thereby improving yield.
第3図は本発明の別の実施例に係る吸引ステージを示す
。FIG. 3 shows a suction stage according to another embodiment of the invention.
この実施例では、吸引ステージ2がホルダ8と、ホルダ
8に交換可能に取り突けられる吸引部材10.11.1
2とにより構成されている。ホルダ8は内部に吸引路5
が形成されると共に、上部には吸引部材10,11.1
2が載置される載置部9が形成されている。吸引部材1
0,11゜12はチップの部分的支持を行ないながら、
チップ周辺のエキスパンドテープを剥離するものであり
、それぞれ支持部7および吸引口6が形成される。これ
ら吸引部材10,11.12の吸引口6の大きさはピッ
クアップされるチップの大きさに合わせて形成されてお
り、チップ実装時には適宜交換が行なわれる。このよう
な構成では、チップに合わせた吸引口の吸引部材を選択
してホルダ8にセットすれば良く、吸引ホルダ2全体の
交換が不要となり、操作性が向上するメリットがある。In this embodiment, the suction stage 2 has a holder 8 and a suction member 10.11.1 which is replaceably attached to the holder 8.
2. The holder 8 has a suction path 5 inside.
are formed, and suction members 10, 11.1 are formed on the upper part.
A placing portion 9 on which the item 2 is placed is formed. Suction member 1
0,11°12 while partially supporting the chip,
The expanded tape around the chip is peeled off, and a support portion 7 and a suction port 6 are formed respectively. The size of the suction ports 6 of these suction members 10, 11, 12 is formed to match the size of the chip to be picked up, and is replaced as appropriate when mounting the chip. In such a configuration, it is only necessary to select a suction member with a suction port that matches the chip and set it in the holder 8, and there is no need to replace the entire suction holder 2, which has the advantage of improving operability.
〔発明の効果〕
以上、詳細に説明したように本発明では、チップ周辺の
エキスパンドテープの剥離を真空吸引力が行なうように
したので、チップの突上げが不要となり、突上げ衝撃が
チップに作用せず、従ってチップ割れを防止することが
できる。[Effects of the Invention] As explained above in detail, in the present invention, the expanded tape around the chip is peeled off by vacuum suction force, so there is no need to push up the chip, and no push-up impact acts on the chip. Therefore, chip cracking can be prevented.
第1図は、本発明に係るチップ実装装置の一実施例の構
成および作動を示す側面図、第2図は、吸引ステージの
一例を示す斜視図、第3図は、吸引ステージの別例を示
す斜視図、第4図は、従来装置の構成および作動を示す
側面図である。
1・・・コレット、2・・・吸引ステージ、6・・・吸
引口、7・・・支持部、8・・・ホルダ、10,11.
12・・・吸引部材、41・・・チップ、46・・・エ
キスパンドテープ。
特許出願人 住友電気工業株式会社
出願人代理人 長谷用 芳 樹
実施例の構成および作動
吸弓1ステージの斜ネ見図
第2図
吸引ステージの例FIG. 1 is a side view showing the configuration and operation of an embodiment of a chip mounting apparatus according to the present invention, FIG. 2 is a perspective view showing an example of a suction stage, and FIG. 3 is a side view showing another example of the suction stage. The perspective view shown in FIG. 4 is a side view showing the configuration and operation of the conventional device. DESCRIPTION OF SYMBOLS 1... Collet, 2... Suction stage, 6... Suction port, 7... Support part, 8... Holder, 10, 11.
12... Suction member, 41... Chip, 46... Expand tape. Patent Applicant: Sumitomo Electric Industries, Ltd. Applicant's Agent Yoshiki Hase Embodiment Configuration and Operation Oblique view of one stage of suction bow Figure 2 Example of suction stage
Claims (2)
真空吸引力で当該エキスパンドテープからピックアップ
するコレットと、 前記エキスパンドテープ下面から前記チップを支持する
支持部および前記エキスパンドテープ下面に密着する吸
引口を有し、真空吸引力で前記チップ周辺の前記エキス
パンドテープを剥離する吸引ステージと を備えていることを特徴とするチップ実装装置。1. a collet that picks up chips that are individually divided on the expanding tape from the expanding tape with vacuum suction force; a support portion that supports the chips from the bottom surface of the expanding tape; and a suction port that comes into close contact with the bottom surface of the expanding tape; A chip mounting apparatus comprising: a suction stage that peels off the expanded tape around the chip using vacuum suction force.
大きさの吸引口を有する吸引部材と、この吸引部材が交
換可能に取り付けられるホルダとを備えている請求項1
記載のチップ実装装置。2. Claim 1: The suction stage comprises a suction member having a suction port of a different size depending on the chip, and a holder to which the suction member is attached replaceably.
The chip mounting device described.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63168071A JPH0217651A (en) | 1988-07-06 | 1988-07-06 | Chip packaging apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63168071A JPH0217651A (en) | 1988-07-06 | 1988-07-06 | Chip packaging apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0217651A true JPH0217651A (en) | 1990-01-22 |
Family
ID=15861301
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP63168071A Pending JPH0217651A (en) | 1988-07-06 | 1988-07-06 | Chip packaging apparatus |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0217651A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19752582A1 (en) * | 1997-11-27 | 1999-06-10 | Inst Mikrotechnik Mainz Gmbh | Separation arrangement e.g. for micro components such as separating microchips from adhesive carrier |
WO2008041273A1 (en) * | 2006-09-29 | 2008-04-10 | Canon Machinery Inc. | Method of pickup and pickup apparatus |
-
1988
- 1988-07-06 JP JP63168071A patent/JPH0217651A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19752582A1 (en) * | 1997-11-27 | 1999-06-10 | Inst Mikrotechnik Mainz Gmbh | Separation arrangement e.g. for micro components such as separating microchips from adhesive carrier |
WO2008041273A1 (en) * | 2006-09-29 | 2008-04-10 | Canon Machinery Inc. | Method of pickup and pickup apparatus |
JP4850916B2 (en) * | 2006-09-29 | 2012-01-11 | キヤノンマシナリー株式会社 | Pickup method and pickup device |
KR101133963B1 (en) * | 2006-09-29 | 2012-04-05 | 캐논 머시너리 가부시키가이샤 | Method of pickup and pickup apparatus |
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