JPH0217651A - Chip packaging apparatus - Google Patents

Abstract

PURPOSE:To prevent a chip from cracking by peeling the expand tape around the chip with vacuum suction force. CONSTITUTION:When a suction stage 2 ascends and a suction port 6 sticks to an expand tape 46, the expand tape 46 except the part in contact with a supporter 7 is sucked in the direction of a suction path 5 and the expand tape 46a around a chip 41 is peeled off the chip 41. When a collet 1 descends, a suction port 3 sticks to the chip 41, and the collet 1 performs vacuum suction, the chip 41 is smoothly released from the tape and held by the collet 1 because the expand tape 46a around the chip 41 has already been peeled off to decrease the adhesion of the tape 46a. If an apparatus of this structure is used, the chip needs not be thrust up, therefore, receives no impact by thrusting up to prevent the chip from cracking. This improves the yield.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a chip mounting device that picks up chips such as semiconductor chips and chip capacitors from an expanded tape and transfers them to a predetermined material temperature, and in particular, The present invention relates to a chip mounting device that can effectively prevent chip cracking.

[Conventional technology]

In the manufacture of semiconductor chips, a chip mounting device is used that divides a semiconductor wafer adhered to an expanded tape into individual chips by dicing it with a diamond cutter or the like, and then picks up the chips from the expanded tape and mounts them on a package. Ru. FIG. 4 shows the operation of a conventional example of this chip mounting apparatus. This mounting device includes a collet 43 having a suction port 42 that matches the external dimensions of the chip 41, a holder 44 provided below the chip 41, and a push-up bin 45 that is supported by the collet 43 and pushes up the chip 41 from below. ing. The chip 41 is transferred between the collet 43 and the push-up pin 45 while being supported on the adhesive band tape 46, as shown in FIG. 4(a).

Prior to transfer, the semiconductor wafer is diced to form dicing grooves for separating the chips into individual chips. After this dicing, the peripheral portion of the expanded tape 46 is passed through a ring 47. When the expandable tape 46 is stretched, the semiconductor wafer is divided into chips along the dicing grooves, and the chips are separated from each other (FIG. 4(a)).

Next, the operation of the mounting apparatus according to this conventional example will be explained.

As shown in FIG. 4(a), the chip 41 is individually divided on an expandable tape 46, and a collet 43 and a push-up pin 4
Transferred between 5 and 5. The chip 41 is pushed up by raising the pushing up pin 45 with the chip 41 positioned directly above the pushing up pin 45. This push-up causes the expanded tape 46 around the chip 41 to be peeled off, and the collet 43 descends to the chip 41 in this state, and its suction port 42 comes into close contact with the chip 41 (FIG. 4(b)).

Since the collet 43 is connected to a vacuum pump or the like and is in a vacuum state, the chip 41 is attracted to the collet by the vacuum suction force and is picked up from the expanding tape 46.

Next, the collet 43 moves onto the package 48 while holding the chip 41 (FIG. 4(C)), and releases the suction force. As a result, the chip 41 is attached to a solder 49 of gold/silicon or gold/tin coated on the package 48.
This completes the mounting of the chip 41.

[Problem to be solved by the invention]

However, in the conventional mounting apparatus, the chip 41 is likely to crack due to the impact of the push-up by the push-up pin 45, and the yield is reduced due to this chip crack.

This chip cracking is particularly noticeable when the chip is large or is made of a compound semiconductor with folds, and is a major problem when mounting the chip.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a chip mounting apparatus that can prevent chip cracking during pickup and improve yield.

[Means to solve the problem]

In order to achieve the above object, the present invention uses suction to peel off the expanded tape around the chip. For this reason, the chip mounting apparatus according to the present invention includes a collet that picks up chips that have been individually divided on the expanding tape from the expanding tape by vacuum suction, a supporting portion that supports the chips from the bottom surface of the expanding tape, and a support portion that is tightly attached to the bottom surface of the expanding tape. The device is characterized in that it has a suction port to remove the expandable tape around the chip using vacuum suction force, and a suction stage that peels off the expanded tape around the chip.

[Effect]

Since the chip mounting apparatus according to the present invention is configured as described above, the expanding tape around the chip is peeled off by the vacuum suction force when the suction stage comes into contact with the chip mounting apparatus.

〔Example〕

Hereinafter, the present invention will be explained in detail with reference to the accompanying drawings. In addition, in the description of the drawings, the same elements are given the same reference numerals, and redundant description will be omitted.

FIG. 1 is a side view showing the operation of an embodiment of the present invention;
FIG. 2 is a perspective view of the suction stage. The chip mounting apparatus includes a collet 1 and a suction stage 2. The collet 1 has a suction port 3 formed at its lower end that matches the external dimensions of the chip 41, and a suction path 4 formed inside the collet 1, which is connected to a vacuum device such as a vacuum pump (not shown). It is connected to the. Therefore, the collet 1 operates in the same manner as in the conventional example, and uses its vacuum suction force to adsorb the chip 41 and pick up the chip.

The adsorption stage 2 has a hollow pipe shape,
The cavity forms a suction path 5 by being connected to a vacuum attachment (not shown). The suction stage 2 has an open upper end to form a suction port 6, and the suction port 6 is brought into close contact with the lower surface of the expandable tape 46 that supports the chip 41. To achieve this close contact, the suction stage 2 is driven to move up and down in the direction of the expanded tape 46.

As shown in FIG. 2, a cross-shaped support portion 7 is formed between the suction ports 6 of the suction stage 2 to partially support the tip 41 during suction.

In this case, the suction port 6 of the suction stage 2 is formed to have a diameter that is equal to or somewhat larger than the outer shape of the chip 41 to be picked up, and the expanded tape 46 around the chip 41 is sucked in with its vacuum suction force. act.

Next, the operation of the configuration according to the above embodiment will be explained.

The chips 41 are individually divided on an expandable tape 46 and transferred between the collet 1 and the suction stage 2 (FIG. 1(a)). First, the suction stage 2 rises and its suction port 6 comes into close contact with the expanded tape 46. The chip 41 is partially supported by the support part 7 due to the close contact of the suction port 6, and when vacuum suction is performed in this state,
Expand tape 46 other than the part where support part 7 abuts
is pulled in the direction of the suction path 5. As a result, the chip 41
The peripheral expanded tape 46a is peeled off from the chip 41. In this case, since the tip 41 is supported by the support portion 7, it will not be sucked into the suction path 5.

Next, the collet 1 descends, and this young suction port 3 connects to the tip 4.
Closely adheres to 1. When the collet 1 performs vacuum suction in this state, the expanded tape 46a on the periphery is peeled off and the adhesive force of the expanded tape is reduced.
The chip 41 is smoothly separated from the expanding tape 46 and held by the collet 1 (FIG. 4(b)).

In such a configuration, since there is no need to push up the chips, no push-up impact acts on the chips, making it possible to prevent chips from cracking, thereby improving yield.

FIG. 3 shows a suction stage according to another embodiment of the invention.

In this embodiment, the suction stage 2 has a holder 8 and a suction member 10.11.1 which is replaceably attached to the holder 8.
2. The holder 8 has a suction path 5 inside.
are formed, and suction members 10, 11.1 are formed on the upper part.
A placing portion 9 on which the item 2 is placed is formed. Suction member 1
0,11°12 while partially supporting the chip,
The expanded tape around the chip is peeled off, and a support portion 7 and a suction port 6 are formed respectively. The size of the suction ports 6 of these suction members 10, 11, 12 is formed to match the size of the chip to be picked up, and is replaced as appropriate when mounting the chip. In such a configuration, it is only necessary to select a suction member with a suction port that matches the chip and set it in the holder 8, and there is no need to replace the entire suction holder 2, which has the advantage of improving operability.

[Effects of the Invention] As explained above in detail, in the present invention, the expanded tape around the chip is peeled off by vacuum suction force, so there is no need to push up the chip, and no push-up impact acts on the chip. Therefore, chip cracking can be prevented.

[Brief explanation of the drawing]

FIG. 1 is a side view showing the configuration and operation of an embodiment of a chip mounting apparatus according to the present invention, FIG. 2 is a perspective view showing an example of a suction stage, and FIG. 3 is a side view showing another example of the suction stage. The perspective view shown in FIG. 4 is a side view showing the configuration and operation of the conventional device. DESCRIPTION OF SYMBOLS 1... Collet, 2... Suction stage, 6... Suction port, 7... Support part, 8... Holder, 10, 11.
12... Suction member, 41... Chip, 46... Expand tape. Patent Applicant: Sumitomo Electric Industries, Ltd. Applicant's Agent Yoshiki Hase Embodiment Configuration and Operation Oblique view of one stage of suction bow Figure 2 Example of suction stage

Claims (2)

[Claims] 1. a collet that picks up chips that are individually divided on the expanding tape from the expanding tape with vacuum suction force; a support portion that supports the chips from the bottom surface of the expanding tape; and a suction port that comes into close contact with the bottom surface of the expanding tape; A chip mounting apparatus comprising: a suction stage that peels off the expanded tape around the chip using vacuum suction force. 2. Claim 1: The suction stage comprises a suction member having a suction port of a different size depending on the chip, and a holder to which the suction member is attached replaceably.
The chip mounting device described.