JPH09246782A - Feeding method and device for electronic part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To package an electronic part leaving intact directly on a circuit substrate by a method wherein an electronic part protruded downward from a supporting frame is held with the packaged surface thereof tuning downward to release the held electronic part from a flexible film to be transferred to the next step. SOLUTION: The opposite surface to the packaged surface of a chip part 5 is bonded onto a main surface coated with an adhesive so as to arrange a flexible film 12 with its peripheral part held by a supporting frame 18 with the main surface turning downward. Next, a pin body 14 is depressed to push down the chip part 5 together with the flexible film 12 to be held by a suction pallet 15 for lifting the pin body 14 and the flexible film 12 from the flexible film 12. Finally, the chip part 5 released from the flexible film 12 is packaged on a specific position on a circuit substrate 10 using a bonding tool 17.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for supplying electronic parts and a device for supplying electronic parts, and more specifically,
The present invention relates to an electronic component supply method for supplying an electronic component to the next step with a mounting surface of the electronic component as a lower surface, and an electronic component supply device.

[0002]

2. Description of the Related Art Conventionally, electronic parts (hereinafter, referred to as "bump electrodes") provided with protruding external electrodes (hereinafter referred to as "bump electrodes") on a mounting surface, such as a surface acoustic wave filter for a communication device and a semiconductor device
In order to mount the chip parts) on the circuit board, the methods shown in FIGS. 4, 5 and 6 have been used.

A description will be given below with reference to the drawings.

First, as shown in FIG. 4 (a), the peripheral edge portion is supported by the support frame 1, and an adhesive (not shown) is provided on the upper surface.
A flexible film 2 provided with is prepared. On the upper surface of the flexible film 2, a plurality of chip components 5 having bump electrodes 3 formed on a substrate 4 are adhered in advance and placed.

Next, as shown in FIG. 4B, the pin body 6 is pushed up from the lower side of the flexible film 2 and the chip component 5 is pushed up together with the flexible film 2. At this time, since the flexible film 2 is stretched, the adhesive force of the flexible film 2 to the chip component 5 pushed up is reduced.

Next, as shown in FIG. 4C, the pin body 6
The chip component 5 pushed up by is sucked and held by the suction collet 7, and the suction collet 7 is pulled up to separate the chip component 5 from the flexible film 2 as shown in FIG. Then, the pin body 6 is pulled down, and the flexible film 2 is lowered accordingly.

Next, the suction collet 2 is used to make the chip component 5
Is transferred to the reversing mechanism, and as shown in FIG. 5A, the chip component 5 is suction-held on the suction pallet 8a of the reversing mechanism.

Next, as shown in FIG. 5B, the suction pallet 8a holding the chip component 5 by suction is inverted, and the chip pallet 5b is suctioned and held by a separately prepared suction pallet 8b. As a result, as shown in FIG. 5C, the chip component 5 is suction-held on the suction pallet 8b with the mounting surface 5a of the chip component 5 on which the bump electrodes 3 are formed as the lower surface.

Next, as shown in FIG. 6A, the chip component 5 suction-held on the suction pallet 8b of the reversing mechanism is
The circuit board 10 is held by suction with the bonding tool 9.
It is transferred to the upper side and mounted on a predetermined position on the circuit board 10 as shown in FIG. Chip component 5 on circuit board 10
After mounting, as shown in FIG. 6C, the bonding tool 9 that has stopped sucking the chip component 5 is pulled up.

By repeating the above steps, the plurality of chip components 5 adhered to the upper surface of the flexible film 2 are all mounted on the circuit board 10.

Further, as shown in FIG. 6, in addition to the method of directly mounting the chip component 5 inverted by the inversion mechanism on the circuit board 10 by the bonding tool 9, it is inverted by the inversion mechanism as shown in FIG. The chip components 5 are once aligned by the suction collet 7 in the storage portion 11a provided in the tray 11, and then the circuit board 10 is bonded by the bonding tool 9.
There is also a way to implement it above.

In this case, the chip components 5 are aligned in the storage portion 11a of the tray 11 with the mounting surface 5a on which the bump electrodes 3 are formed as the lower surface, as shown in FIG.

[0013]

As described above, in any of the conventional methods, a step of reversing the front and back of individual chip parts is required after peeling the chip parts from the flexible film. Therefore, the process is complicated and the chip component cannot be efficiently mounted on the circuit board.

Further, since a reversing mechanism for reversing the front and back of individual chip parts separated from the flexible film is required, the apparatus becomes complicated and the price becomes high.

Therefore, it is an object of the present invention to provide a method of supplying electronic parts, which can simplify the steps and efficiently supply the electronic parts to the next step.

Another object of the present invention is to provide an inexpensive electronic component supply apparatus having a simple structure.

[0017]

According to the method of supplying an electronic component of the present invention, a main surface provided with an adhesive is adhered to a facing surface which faces a mounting surface of the electronic component, and a peripheral portion is supported by a support frame. Using the step of arranging the flexible film so that the main surface to which the adhesive is applied is the lower surface and the pin body located above the flexible film, the electronic component is removed from the support frame together with the flexible film. A step of projecting downward, and a step of holding the electronic component projecting downward from the support frame so that the mounting surface of the electronic component is a lower surface by a holding unit provided below the flexible film. And a step of peeling the electronic component held by the holding means from the flexible film, and a step of transferring the electronic component held by the holding means and peeled from the flexible film to the next step. It is an.

Further, in the electronic component supplying apparatus of the present invention, the peripheral portion is supported by the support frame, and the flexible film is provided with the adhesive on the lower surface so that the electronic component can be adhered,
A pin body that is disposed above the flexible film and that causes the electronic component to project downward from the support frame together with the flexible film; and a pin body that is disposed below the flexible film and extends downward from the support frame. The present invention is characterized by including holding means for holding the protruding electronic component and transfer means for transferring the electronic component held by the holding means to the next step.

According to the method for supplying an electronic component and the apparatus for supplying an electronic component of the present invention, since the electronic component is peeled off from the flexible film with the mounting surface being the lower surface, the electronic component is made flexible. After peeling from the film, it is not necessary to reverse the front and back of each electronic component, and the electronic component can be directly mounted on the circuit board as it is.

Further, since it is not necessary to reverse the front and back of each electronic component peeled from the flexible film, it is not necessary to transfer the electronic component to the reversing mechanism after peeling the electronic component from the flexible film. At the same time as peeling from the flexible film, it becomes ready for mounting.

[0021]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of an electronic component supply method and an electronic component supply apparatus according to the present invention will be described below.
This will be described with reference to the accompanying drawings. It should be noted that the same parts as those of the related art are designated by the same reference numerals and the description thereof is omitted.

First, an embodiment of the electronic component supply apparatus according to the present invention will be described.

FIG. 1 is a schematic explanatory view showing an electronic component supply apparatus according to an embodiment of the present invention.

This electronic component supply device includes a flexible film 12, an image processing camera 13 for confirming the position of the electronic component adhered to the flexible film 12,
The pin body 14, a suction pallet 15 that is a holding unit that holds the electronic component, a conveyor 16 that conveys the suction pallet 15, and a bonding tool 17 that is a transfer unit that transports the electronic component to the next step.

The flexible film 12 is a resin film having flexibility such as polyethylene, and is transparent and circular. The peripheral edge of the flexible film 12 is supported by a ring-shaped support frame 18. Further, an adhesive is applied to the lower surface side of the flexible film 12, and a protruding external electrode (hereinafter referred to as the bump electrode 3) such as a surface wave filter for a communication device or a semiconductor device is applied thereto.
It is possible to adhere an electronic component (hereinafter referred to as a chip component 5) provided on the mounting surface.

The image processing camera 13 is arranged above the flexible film 12 and can detect the position of the chip component 5 adhered to the lower surface thereof through the transparent flexible film 12.

The pin body 14 is located above the flexible film 12 and is arranged so as to be movable up and down. Based on the detection result of the camera 13 for image processing, the pin body 14 is The chip component 5 can be pushed down together with the flexible film 12. Also, the pin body 1
After pushing down the chip component 5, the chip 4 can move up and return to its original position. Further, the pin body 14 is also movable in the horizontal direction, and based on the detection result by the camera 13 for image processing, the plurality of chip components 5 adhered to the lower surface of the flexible film 12 are sequentially arranged one by one. It is possible to push down.

The suction pallet 15 is made of flexible film 12.
The suction means 15a is provided below the base plate so that the chip component 5 pushed down by the pin body 14 can be sucked and held. The suction force of the suction means 15a is applied to the chip from the flexible film 12 when the chip component 5 adhered to the flexible film 12 is pushed down by the pin body 14 and the adhesion force of the flexible film 12 is reduced. It is set so that the component 5 can be peeled off. The adsorption pallet 15 is placed on the conveyor 16.

The conveyor 16 is for conveying the suction pallet 15 which holds the chip components 5 by suction to below the bonding tool 17, and the starting end side 16a of the conveyor 16 is arranged below the flexible film 12, The terminal side 16 b of 16 is arranged below the bonding tool 17.

The bonding tool 17 adsorbs the chip component 5 adsorbed on the adsorption pallet 15 to the circuit board 10.
A conveyor 16 for mounting the chip component 5 and carrying the suction pallet 15 for mounting at a predetermined position on the upper side.
Circuit board 1 on which the terminal side 16b of the chip and the chip component 5 are mounted
It can move horizontally between 0 and 0.

Further, since the bonding tool 17 sucks the chip component 5 sucked by the suction pallet 15 and pulls it up, it can move up and down on the terminal side 16b of the conveyor 16 and mount the chip component 5 on the circuit board 10. In order to do so, it can move up and down on the circuit board 10.

Next, one embodiment of the method for supplying electronic parts according to the present invention will be described.

First, as shown in FIG. 2 (a), the main surface to which the adhesive is applied is adhered to the opposite surface facing the mounting surface of the chip component 5, and the peripheral portion is supported by the support frame 18 to make it flexible. The elastic film 12 is arranged so that the main surface to which the adhesive is applied is the lower surface.

The chip component 5 is composed of the substrate 4 and the bump electrodes 3 formed on the mounting surface side of the substrate 4, and the mounting surface side is the lower surface.

In FIG. 2 (a), the number of chip parts 5 is five in a row for the sake of simplicity.
Usually, the number of chip components adhered to the flexible film 12 is larger than this, and for example, it is formed in a matrix of 20 columns vertically and 20 columns horizontally.

Further, such a flexible film 12 is
For example, it can be obtained as follows.

First, a circular mother substrate (not shown) having a plurality of bump electrodes 3 formed on one main surface is prepared.
This mother substrate is placed on silicon rubber (not shown) with one main surface on which the plurality of bump electrodes 3 are formed as the lower surface.

Next, a ring-shaped support frame 18 having an inner diameter larger than the diameter of the mother substrate is placed on the silicon rubber so as to surround the mother substrate.
At this time, the mother substrate and the support frame 18 have different thicknesses, but since the silicon rubber has a gap between the portion on which the mother substrate is placed and the portion on which the support frame 18 is placed, The upper surface of the mother substrate on which the bump electrodes 3 are not formed and the upper surface of the support frame 18 have substantially the same height.

Next, a circular flexible film 12 having a diameter larger than the inner diameter of the support frame 18 and smaller than the outer diameter of the support frame 18 is prepared, and the surface provided with the adhesive is used as the lower surface. The surface provided with is adhered to the upper surface of the mother substrate and the upper surface of the support frame 18.

Next, the flexible film 12 is turned upside down and placed on a stage (not shown) with the surface of the mother substrate on which the bump electrodes 3 are formed as the upper surface, and the mother blade is mounted using a resin blade or a diamond blade. The substrate is diced into a predetermined shape. As a result, a plurality of chip components 5 arranged in a matrix are obtained on the flexible film 12, and the mother substrate is inverted after dicing, so that FIG.
The flexible film 12 shown in is obtained.

Next, as shown in FIG. 2B, the pin body 14 is pushed down from the upper side of the flexible film 12 based on the detection result from the image processing camera (not shown), and the flexible film 12 is pushed down. The chip component 5 is pushed down together with 12. At this time, since the flexible film 12 is stretched, the adhesive force of the flexible film 12 to the pressed down chip component 5 is reduced.

Next, as shown in FIG. 2C, the pin body 1
Adsorption pallet 1 for chip parts 5 pushed down by 4
2 is suctioned and held, and as shown in FIG. 2D, the pin body 14 is pulled up, the flexible film 12 is raised, and the chip component 5 is peeled from the flexible film 12. At this time, the suction force of the suction pallet 15 is set to be larger than the adhesive force of the flexible film 12 which is reduced by being pushed down by the pin body 14.

Next, the suction pallet 15 is conveyed by the conveyor 16 shown in FIG. 1, and the bonding tool 17 is moved onto the suction pallet 15 as shown in FIG.

Next, as shown in FIG. 3B, the chip component 5 suction-held on the suction pallet 15 of the reversing mechanism is suction-held by the bonding tool 17, and the circuit board 1
Transfer to 0. At this time, the suction force of the bonding tool 17 is set to be larger than the suction force of the suction pallet 15.

Next, as shown in FIG. 3C, the chip component 5 is mounted on the circuit board 10 at a predetermined position by the bonding tool 17. Chip component 2 on circuit board 10
After mounting 0, as shown in FIG. 3D, the bonding tool 17 having stopped sucking the chip component 5 is pulled up.

By repeating the above steps, the plurality of chip components 5 adhered to the upper surface of the flexible film 12 are all mounted on the circuit board 10.

As described above, the electronic component supply method and the electronic component supply apparatus of the present invention have been described based on one embodiment, but the present invention is not limited to the above embodiment, and the present invention is not limited thereto. Various modifications are possible within the scope of the gist.

For example, in the above embodiment, the chip component separated from the flexible film is held on the suction pallet, and then the chip component is directly mounted on the circuit board with the bonding tool. However, the present invention is not limited to this, and it may be arranged once in the storage portion 11a of the tray 11 shown in FIG. 7 using a suction collet and then mounted on a circuit board with a bonding tool. At this time, in the chip component 5, as shown in FIG.
It will be stored in.

In the above embodiment, the suction pallet is used as the holding means, and the chip component is peeled from the flexible film by the suction force of the suction pallet.
The present invention is not limited to this. For example, instead of the suction pallet, a mechanical holding means for holding the chip component with a plurality of claws may be used, or a holding means by suction force and a mechanical holding means may be used. You may use together with a suitable holding means.

Further, in the above embodiment, the bonding tool or the suction collet, which is the transfer means, sucks the chip component from the suction pallet by the suction force, but the present invention is not limited to this. A mechanical transfer means such as holding a chip component by a plurality of claws may be used, or a transfer means by suction force and a mechanical transfer means may be used together.

Further, in the above embodiment, in order to sequentially peel the plurality of chip components adhered to the lower surface of the flexible film one by one from the flexible film, the pin body is formed into the flexible film. However, the present invention is not limited to this, but the flexible film may be moved in the horizontal direction with respect to the pin body.

Further, in the above embodiment, when the chip component is projected downward from the support frame,
Although the flexible film is fixed and the pin body is pushed down, the present invention is not limited to this, and for example, the pin body may be fixed and the flexible film may be pushed up.
Alternatively, the pin body may be pushed down and the flexible film may be pushed up.

In the above embodiment, when the chip component is peeled from the flexible film, the suction pallet holding the chip component is fixed and the flexible film is raised. However, the suction pallet holding the chip component may be pulled down. Alternatively, the suction pallet holding the chip components may be pulled down and the flexible film may be pulled up.

Further, in the above-mentioned embodiment, as the pin body, a pin-shaped body having a fine diameter is used as a whole, but the present invention is not limited to this.
The portion contacting the flexible film may have a pin shape so that the chip component can be separated from the flexible film.

In addition, it goes without saying that the method of adhering the support frame and the substrate to the flexible film, the method of dicing the substrate, and the shape and material of the flexible film and the holding means can be changed.

[0056]

As described above, according to the electronic component supply method and the electronic component supply apparatus of the present invention, the electronic component is peeled off from the flexible film with the mounting surface facing down. After peeling the electronic component from the flexible film, it is not necessary to reverse the front and back of the electronic component, and the electronic component can be directly mounted on the circuit board as it is.

Since it is not necessary to reverse the front and back of the electronic component, it is not necessary to transfer the electronic component to the reversing mechanism after peeling the electronic component from the flexible film. It is ready for mounting.

Therefore, the process can be simplified, the electronic component can be efficiently supplied to the next process, and an inexpensive electronic component supply device having a simple structure can be obtained.

[Brief description of drawings]

FIG. 1 is a schematic side view showing an electronic component supply device according to an embodiment of the present invention.

FIG. 2 is a process explanatory view showing a method of supplying an electronic component which is an embodiment of the present invention.

FIG. 3 is a process explanatory view showing a method of supplying an electronic component which is an embodiment of the present invention.

FIG. 4 is a process explanatory view showing a conventional electronic component supply method.

FIG. 5 is a process explanatory view showing a conventional electronic component supply method.

FIG. 6 is a process explanatory view showing a conventional electronic component supply method.

FIG. 7 is a perspective view showing a tray used when supplying an electronic component to the next step.

FIG. 8 is a cross-sectional view showing a state in which electronic components are stored in a tray used when the electronic components are supplied to the next step.

[Explanation of symbols]

 5 Chip Parts (Electronic Parts) 12 Flexible Film 14 Pin Body 15 Adsorption Pallet (Holding Means) 17 Bonding Tool (Transfer Means) 18 Support Frame

Claims (2)

[Claims] 1. A flexible film having a main surface to which an adhesive is applied is adhered to an opposing surface facing a mounting surface of an electronic component, and a peripheral portion of the flexible film is supported by a support frame. The step of arranging so as to be the lower surface, the step of projecting the electronic parts together with the flexible film downward from the support frame by using the pin body located above the flexible film, and the step of projecting downward from the support frame The step of holding the electronic component projecting toward it by the holding means provided below the flexible film so that the mounting surface of the electronic component is the lower surface, and the electronic component held by the holding means is flexible. A method of supplying an electronic component, comprising: a step of peeling from the film; and a step of transferring the electronic component held by a holding means and peeled from the flexible film to the next step. 2. A flexible film having a peripheral portion supported by a support frame and having an adhesive on its lower surface so that electronic components can be adhered, and a flexible film disposed above the flexible film. A pin body for projecting the electronic component downward from the support frame together with the film, a holding unit arranged below the flexible film for holding the electronic component projecting downward from the support frame, and a holding unit. An electronic component supply device, comprising: a transfer unit that transfers the held electronic component to the next step.