JPH02172729A - Production of thermosetting resin copper-clad laminated sheet - Google Patents

Abstract

PURPOSE:To improve the surface unevenness of a substrate and to enhance drill processability by laminating surface layers composed of a specific prepreg and intermediate layers composed of other specific prepreg in a predetermined number and superposing a copper foil on the surface layers to perform press molding under pressure. CONSTITUTION:Glass cloth is impregnated with thermosetting resin varnish such as epoxy resin varnish and dried to obtain an intermediate layer prepreg while alumina paper having a thickness of 160-400mum and a wt. of 50-150g/m<2> is impregnated with the aforementioned thermosetting resin varnish and dried to obtain a surface layer prepreg. Subsequently, a predetermined number of the surface layer prepregs and the intermediate layer prepregs are laminated and a copper foil is superposed thereon to be pressed under heating to obtain a thermosetting resin laminated sheet. When the alumina paper is used in the surface layers, the distribution of the alumina paper and the resin becomes extremely uniform and smoothness is enhanced and the obtained laminate becomes well in the close adhesiveness with an etching resist.

Description

Detailed Description of the Invention (Field of Industrial Application) The present invention relates to a new thermosetting resin copper-clad laminate for industrial equipment and electronic equipment. Improved processability, among other things.

(Prior Art) Epoxy resin copper-clad laminates using glass substrates have heretofore been used for manufacturing electronic devices and industrial equipment.

In recent years, as the density of wiring has increased, the number of small-diameter through holes has increased, so hole position accuracy and large bends have become problems when drilling printed wiring boards.

Furthermore, as the tip rate (number of holes drilled per minute) has increased to improve productivity, drilling conditions have become stricter, resulting in problems such as rough hole walls, drill wear, and copper foil burrs.

Furthermore, as wires become thinner, the smoothness of the substrate surface is becoming an issue in order to improve adhesion to the entimbre cyst.

In addition, with higher density packaging, more heat is generated from components, and circuit boards with good heat dissipation are increasingly needed.

[Problems to be Solved by the Invention] The present invention uses ordinary glass cloth as an intermediate layer, and coats the surface with a heavy ff15 layer with a thickness of 160 pm to 450 pm.
By using alumina paper of 0 g/rrf to 150 g/rrl, the unevenness of the substrate surface can be improved.
The purpose of this is to provide a laminate with good drill workability and excellent thermal conductivity.

[Means to solve the problem]

In the present invention, a glass cloth is impregnated with a thermosetting resin varnish such as an epoxy resin, and a dried prepreg is used as an intermediate layer.
Alumina paper of 0g/rrf impregnated with the thermosetting resin varnish and dried prepreg is used as a surface layer, a predetermined number of these surface layers and an intermediate layer are laminated, copper foil is overlapped, and heat and pressure are applied. This is a temporary manufacturing method for thermosetting resin FAN.

The characteristics of the present invention are that the thickness is 160 μm to 400 μm and the weight is 150 μm.
Using alumina paper with g/rd to 150 g/rrf as the surface layer 0 If alumina paper is used in the surface layer, the distribution of alumina paper and resin in the surface layer will be very uniform compared to glass cloth, and the surface roughness will be reduced. Every time(
smoothness) is improved.

Therefore, the laminates produced by combining ordinary glass cloth for laminates with alumina paper have good adhesion to the etching resist, and also reduce slippage of the drill during drilling. Become.

The main fiber component of alumina paper is Al2O.
, and usually has a corundum crystal structure, so it has excellent thermal conductivity. The thermal conductivity of alumina paper is, for example, about 0.85 W/n+-, which is much better than 0.30 W/[k] of glass cloth.

The thermosetting resin used in the present invention may be an epoxy resin, a polyester resin, a polyimide resin, a phenol resin, etc., and is not particularly limited.

〔Example〕

The present invention will be explained below with reference to Examples.

Example 1 Glass cloth (manufactured by Nitto Boseki 1IIE-
tS) to epoxy resin (EP-504 manufactured by Shell Chemical Co., Ltd.)
5) Impregnated with an epoxy resin varnish consisting of 100 parts by weight (hereinafter referred to as "parts"), 4.7 parts of curing agent dicyandiamide, curing accelerator 2-ethyl-4-methylimidazole and solvent, and dried to a resin content of 39~ A 42% prepreg was obtained.

Next, for the surface layer, alumina paper (manufactured by Kaibe Maikani, Max Paper A-80) weighing 3180 g/rd was impregnated with the same varnish as above and dried to form a prepreg with a resin content of 61 to 65%. I got it.

Next, six pieces of the glass cloth prepreg were placed as an intermediate layer, and the alumina paper prepreg was placed on the top and bottom surface layers, and then a copper foil (18 μm) was layered on top of that, heated and pressure-molded to a thickness of 1.6 m. An epoxy resin copper-clad laminate was obtained.

Example 2 For the intermediate layer, a glass cloth prepreg was obtained in the same manner as in Example 1.

Subsequently, as a surface layer, the same alumina paper as in Example 1 was impregnated with the same varnish as described above and dried to obtain a resin content of 4.
A 5-50% prepreg was obtained.

Next, six sheets of the glass cloth prepreg were placed as an intermediate layer, and the alumina paper prepreg was placed on the top and bottom surface layers, and copper foil (18 μm) was layered on top of that, heated, pressed, and molded to a thickness of 1.6 μm. A copper-clad laminate made of epoxy resin and having a thickness of 1 mm was obtained.

Comparative Example 1 Only glass cloth was impregnated with the same resin as in Example 1 and dried to obtain a prepreg with a resin content of 39 to 42%. Eight sheets of this prepreg were laminated, and 1i! Foil (18 μm
) were stacked, heated and pressure molded to obtain a 1.6 m epoxy resin copper-clad N plate.

The drill workability, surface roughness, and thermal conductivity of the laminates obtained in each example and comparative example were measured, and the results are shown in Table 1.

As is clear from Table 1, the performance of the laminate obtained by the present invention is superior to that of the conventional laminate using only glass cloth.

As shown in Table 1, excellent thermosetting resin copper cladding values 1 to 1 can be obtained. Furthermore, surface irregularities, which are conventional defects, are reduced and smoothness is improved.

As a result of the above-mentioned improvements, the adhesion of the resist is improved, making it possible to form fine patterns and obtain higher-density circuit patterns.

Note (Measurement method) ■ Drill diameter 0.4φ, rotation speed 5700Or, p, m
, feed rate 2.0m/min, average value up to 5,000 shots of 3 sheets stacked.

■ Drill diameter 1.1φ, rotation speed 65000r, p, m
, feed rate: 5.0m/11in, wear rate after 10,000 shots of 3 sheets stacked.

■ Maximum roughness of the laminate surface.

■ Schroeder method measurement value.

〔Effect of the invention〕

Claims (1)

[Claims] (1) Glass cloth is impregnated with thermosetting resin varnish such as epoxy resin, dried prepreg is used as an intermediate layer, thickness is 160 μm to 450 μm, and weight is 50 g/m^2 to 15
0g/m^2 alumina paper impregnated with the thermosetting resin varnish and dried prepreg as a surface layer, a predetermined number of these surface layers and intermediate layers are laminated, copper foil is layered, and heat and pressure molding is performed. A method for producing a characteristic thermosetting resin copper-clad laminate.