JPH0216586B2 - - Google Patents
Info
- Publication number
- JPH0216586B2 JPH0216586B2 JP58194897A JP19489783A JPH0216586B2 JP H0216586 B2 JPH0216586 B2 JP H0216586B2 JP 58194897 A JP58194897 A JP 58194897A JP 19489783 A JP19489783 A JP 19489783A JP H0216586 B2 JPH0216586 B2 JP H0216586B2
- Authority
- JP
- Japan
- Prior art keywords
- ceramic insulating
- nickel
- metal
- insulating pipe
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W72/30—
-
- H10W72/073—
-
- H10W72/07337—
-
- H10W72/5363—
-
- H10W90/756—
Landscapes
- Ceramic Products (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58194897A JPS6086838A (ja) | 1983-10-18 | 1983-10-18 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58194897A JPS6086838A (ja) | 1983-10-18 | 1983-10-18 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6086838A JPS6086838A (ja) | 1985-05-16 |
| JPH0216586B2 true JPH0216586B2 (cg-RX-API-DMAC10.html) | 1990-04-17 |
Family
ID=16332143
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58194897A Granted JPS6086838A (ja) | 1983-10-18 | 1983-10-18 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6086838A (cg-RX-API-DMAC10.html) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0451779U (cg-RX-API-DMAC10.html) * | 1990-09-07 | 1992-04-30 | ||
| JPH04163873A (ja) * | 1990-10-29 | 1992-06-09 | Tokyo Densen Kogyo Kk | 平形電線の端子接続構造 |
-
1983
- 1983-10-18 JP JP58194897A patent/JPS6086838A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0451779U (cg-RX-API-DMAC10.html) * | 1990-09-07 | 1992-04-30 | ||
| JPH04163873A (ja) * | 1990-10-29 | 1992-06-09 | Tokyo Densen Kogyo Kk | 平形電線の端子接続構造 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6086838A (ja) | 1985-05-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3670008B2 (ja) | 気密ろう接合部の作成方法 | |
| JP4765538B2 (ja) | 真空バルブ、真空バルブの製造方法 | |
| US4446502A (en) | Metallurgical contacts in hermetically sealed glass encapsulated ceramic capacitors | |
| US3980917A (en) | Photo-electrode structure | |
| JPH0216586B2 (cg-RX-API-DMAC10.html) | ||
| JP2970723B2 (ja) | 半導体パッケージおよびその製造方法 | |
| KR950012947B1 (ko) | 발진기 | |
| JP3176250B2 (ja) | 半導体素子収納用パッケージ | |
| JP2746809B2 (ja) | 光半導体素子収納用パッケージ | |
| JP4511214B2 (ja) | 電子部品収納用パッケージおよび電子装置 | |
| JPH06151642A (ja) | Icパッケージ | |
| JP2577315B2 (ja) | 口金付管球 | |
| KR100659534B1 (ko) | 반도체 장치를 밀폐형으로 밀봉하는 밀봉 링과 그것을사용한 반도체 장치의 제조 방법 | |
| US3147361A (en) | Vacuum tight joint and method of making such joint | |
| JP3445761B2 (ja) | 電子デバイス用セラミックパッケージ | |
| JPS61209966A (ja) | 無機絶縁物と銅材との真空ろう付け方法 | |
| JPH01274459A (ja) | 半導体装置用ステムの製造方法 | |
| JPS63240051A (ja) | セラミツクキヤツプ | |
| JP2000022012A (ja) | 電子部品装置 | |
| JPS6076150A (ja) | 半導体装置の金属パツケ−ジ | |
| JP3393784B2 (ja) | 電子部品収納用パッケージ | |
| JPS6032774Y2 (ja) | 半導体装置用ステム | |
| JP2540461B2 (ja) | 電子部品用パッケ−ジのリ−ド取り付け構造 | |
| JPS5842764A (ja) | メツキ方法 | |
| WO1995008842A1 (en) | Integrated circuit package having a lid that is specially adapted for attachment by a laser |