JPH02164090A - Hybrid integrated circuit - Google Patents
Hybrid integrated circuitInfo
- Publication number
- JPH02164090A JPH02164090A JP31862488A JP31862488A JPH02164090A JP H02164090 A JPH02164090 A JP H02164090A JP 31862488 A JP31862488 A JP 31862488A JP 31862488 A JP31862488 A JP 31862488A JP H02164090 A JPH02164090 A JP H02164090A
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- board
- flexible printed
- sip
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005452 bending Methods 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 abstract description 4
- 239000000758 substrate Substances 0.000 abstract 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は混成集積回路に関し、特に一枚のフレキシブル
プリント板と複数のＳＩＰ集積回路基板（シングルイン
ラインパッケージ集積回路基板）とを同一平面上に接続
した混成集積回路に関する。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a hybrid integrated circuit, and in particular to a hybrid integrated circuit in which one flexible printed board and a plurality of SIP integrated circuit boards (single in-line package integrated circuit boards) are mounted on the same plane. Concerning connected hybrid integrated circuits.
従来の混成集積回路は、第４図に示すように、部品２１
．２２を実装した複数のｓｉｐ集積回路基板２３を下端
部の端子２４を介してプリント基板２５に並行に接続し
、これらのＳＩＰ集積回路基板２３間を複数のフレキシ
ブルプリント板２６で各々接続した構造となっていた。A conventional hybrid integrated circuit has components 21 as shown in FIG.
．． A plurality of SIP integrated circuit boards 23 mounted with 22 are connected in parallel to a printed circuit board 25 via terminals 24 at the lower end, and these SIP integrated circuit boards 23 are each connected by a plurality of flexible printed boards 26. It had become.
上述した従来の混成集積回路は、複数のＳＩＰ集積回路
基板２３間にフレキシブルプリント板２６を張り合わせ
ることによりＳＩＰ集積回路基板２３間を電気的に接続
する構造となっていたため、複数のフレキシブルプリン
ト板２６を必要とし、この結果混成集積回路の製造工程
とｓｒｐ集積回路基板２３間の接続が複雑なものになる
欠点があった。また、ＳＩＰ集積回路基板２３が互いに
対向して位置するため、部品２１．２２を実装する際、
実装作業に手間を要する欠点がある。The conventional hybrid integrated circuit described above has a structure in which the SIP integrated circuit boards 23 are electrically connected by pasting the flexible printed boards 26 between the plurality of SIP integrated circuit boards 23. As a result, the manufacturing process of the hybrid integrated circuit and the connection between the SRP integrated circuit board 23 become complicated. Furthermore, since the SIP integrated circuit boards 23 are located opposite to each other, when mounting the components 21 and 22,
The drawback is that it requires time and effort to implement.
本発明の目的は、上記課題を解決し、製造が容易でかつ
フレキシブルプリント板とＳＩＰ集積回路基板との接続
工程を簡素化できる混成集積回路を提供することにある
。SUMMARY OF THE INVENTION An object of the present invention is to provide a hybrid integrated circuit that solves the above problems, is easy to manufacture, and can simplify the process of connecting a flexible printed board and an SIP integrated circuit board.
本発明は、可撓性のフレキシブルプリント板によって電
気的に接続された複数のシングルインラインパッケージ
型集積回路基板を所定のプリント基板に接続してなる混
成集積回路であって、前記？ｉ数のシングルインライン
パッケージ型集積回路基板は、一枚のフレキシブルプリ
ント仮に部品実装面を介して面一に接続されかつフレキ
シブルプリント板の撓みを利用してプリント基板に配置
接続されているものであることを特徴とする。The present invention is a hybrid integrated circuit formed by connecting a plurality of single in-line package type integrated circuit boards electrically connected by flexible printed boards to a predetermined printed board, the above-mentioned hybrid integrated circuit comprising: The i number of single in-line package integrated circuit boards are made of a single flexible printed circuit board that is connected flush through the component mounting surface and arranged and connected to the printed circuit board using the bending of the flexible printed board. It is characterized by
本発明の実施例について図面を参照して説明する。 Embodiments of the present invention will be described with reference to the drawings.
第１図は本発明の一実施例に係る混成集積回路を示す平
面図である。FIG. 1 is a plan view showing a hybrid integrated circuit according to an embodiment of the present invention.
混成集積回路は、長尺状の１枚のフレキシブルプリント
板１上に複数のＳＩＰ集積回路基板２（１）〜２（ｎ）
を一定間隔で張り合わせた構造となっている。The hybrid integrated circuit includes a plurality of SIP integrated circuit boards 2(1) to 2(n) on one long flexible printed board 1.
It has a structure in which they are pasted together at regular intervals.
フレキシブルプリント板１は、接続されるＳＩＰ集積回
路基板２（１）〜２（ｎ）の個数に対応した長さに設定
され、かつその配線パターン（図示せず）はＳＩＰ集積
回路基板２（１）〜２（ｎ）相互間及びＳＩＰ集積回路
基板２ （１） （〜２ （ｎ） ）と部品３．４との
間の所要の電気的接続がなされるように設定しである。The flexible printed board 1 is set to have a length corresponding to the number of SIP integrated circuit boards 2(1) to 2(n) to be connected, and its wiring pattern (not shown) is set to correspond to the number of SIP integrated circuit boards 2(1) to 2(n) to be connected. ) to 2(n) each other and between the SIP integrated circuit board 2 (1) ( to 2 (n) ) and the component 3.4.
ＳＩＰ集積回路基板２（ｌ）〜２（ロ）は、部品３゜４
の実装面をフレキシブルプリント板１に当接させかつ端
子５を一方側に位置させた状態でフレキシブルプリント
板１に張り合わされている。SIP integrated circuit boards 2(l) to 2(b) are parts 3゜4
is attached to the flexible printed board 1 with its mounting surface in contact with the flexible printed board 1 and the terminal 5 positioned on one side.
部品３．４は、各ＳＩＰ集積回路基板２（１１（〜２（
ｎ））にフレキシブルプリント板１を介して電気的に接
続されている。Component 3.4 includes each SIP integrated circuit board 2 (11(~2(
n))) through a flexible printed board 1.
第１図に示した混成集積回路の製造は、ＳＩＰ集積回路
基板２（１）〜２（ｎ）を横方向に一定間隔で一列に並
べ、その部品実装面の上に横長にフレキシブルプリント
板１を張り、フレキシブルプリント板１の上から例えば
半田スクリーン印刷によるリフロ半田付けで部品３，４
を取り付けることにより行う。The manufacturing of the hybrid integrated circuit shown in FIG. , and parts 3 and 4 are soldered onto the flexible printed board 1 by reflow soldering using solder screen printing, for example.
This is done by attaching.
次に、第１図に示した混成集積回路の実装例について説
明する。Next, an example of mounting the hybrid integrated circuit shown in FIG. 1 will be described.
混成集積回路の実装されるプリント基板には、基盤自体
にスルーホールが設けられており、このスルーホールに
ＳＩＰ集積回路基板２ （１１〜２ （ｎ）の端子５を
接続することにより混成集積回路の実装が行われる。The printed circuit board on which the hybrid integrated circuit is mounted has a through hole in the board itself, and by connecting the terminals 5 of the SIP integrated circuit board 2 (11 to 2 (n)) to this through hole, the hybrid integrated circuit can be mounted. will be implemented.
具体的には、第２図に示すように、左端のＳＩＰ集積回
路基板２（ｌ）の端子５をプリント板６の１列目のスル
ーホール７に挿入した後、フレキシブルプリント板１を
利用してＳＩＰ集積回路基板２（２）をその部品実装面
がＳＩＰ集積回路基板２（１）の部品実装面と対向する
ように位置させ５ＩＰｉ積回路基板２（２）の端子５を
プリント基板６の２列目のスルーホール７に挿入し、次
にＳｒＰ集積回路基板２（３）の裏面がＳＩＰ集積回路
基板２（２）の裏面と対向するように位置させてＳＩＰ
集積回路基板２（３）の端子５をプリント基板６の３列
目のスルーホール７に挿入していくことにより行う。Specifically, as shown in FIG. 2, after inserting the terminal 5 of the leftmost SIP integrated circuit board 2(l) into the through hole 7 in the first row of the printed board 6, use the flexible printed board 1. position the SIP integrated circuit board 2 (2) so that its component mounting surface faces the component mounting surface of the SIP integrated circuit board 2 (1), and connect the terminals 5 of the 5IPi integrated circuit board 2 (2) to the printed circuit board 6. The SrP integrated circuit board 2 (3) is inserted into the through hole 7 in the second row, and then positioned so that the back surface of the SrP integrated circuit board 2 (3) faces the back surface of the SIP integrated circuit board 2 (2).
This is done by inserting the terminals 5 of the integrated circuit board 2 (3) into the through holes 7 in the third row of the printed circuit board 6.
即ち、第３図に示すように、フレキシブルプリント基板
１を蛇行状に曲げていくことによって、ＳＩＰ集積回路
基板２（１）〜２（ｎ）の端子５を順にプリント基板６
のスルーホール７列に接続していく。That is, as shown in FIG. 3, by bending the flexible printed circuit board 1 in a meandering manner, the terminals 5 of the SIP integrated circuit boards 2(1) to 2(n) are sequentially connected to the printed circuit board 6.
Connect to the 7 rows of through holes.
この結果混成集積回路のプリント基板６への接続は画一
的にかつ容易に行われる。As a result, the hybrid integrated circuit can be uniformly and easily connected to the printed circuit board 6.
以上説明したように本発明の混成集積回路は、ＳＩＰ集
積回路基板を一枚のフレキシブルプリント板に部品実装
面を介して面一に接続しかつフレキシブルプリント板の
撓みを利用してプリント基板に配置接続する構造である
ため、以下の効果がある。As explained above, the hybrid integrated circuit of the present invention connects the SIP integrated circuit board to a single flexible printed board flush with the component mounting surface, and arranges it on the printed board by utilizing the bending of the flexible printed board. Since it is a connected structure, it has the following effects.
（イ）フレキシブルプリント板とＳＩＰ集積回路基板と
の接続を行うための工程を簡素化することができる。(a) The process for connecting the flexible printed board and the SIP integrated circuit board can be simplified.
（ロ）ＳＩＰ集積回路基板の部品実装面上に一枚のフレ
キシブルプリント板を張り合わせたため、部品の実装を
半田スクリーン印刷によるりフロ半田付けで行うことが
でき、この結果製造工数の低減を図ることができる。(b) Since a single flexible printed board is pasted onto the component mounting surface of the SIP integrated circuit board, components can be mounted by flow soldering rather than by solder screen printing, resulting in a reduction in manufacturing man-hours. Can be done.
第１図は本発明の一実施例に係る混成集積回路を示す平
面図、
第２図と第３図は第１図の混成集積回路の実装状態を示
す図、
第４図は従来の混成集積回路を示す図である。
１・・・・・フレキシブルプリント板
２（１）〜２（ｎ）・・・ＳＩＰ集積回路基板３．４・
・・部品
６・・・・・プリント基板FIG. 1 is a plan view showing a hybrid integrated circuit according to an embodiment of the present invention, FIGS. 2 and 3 are diagrams showing the mounting state of the hybrid integrated circuit of FIG. 1, and FIG. 4 is a conventional hybrid integrated circuit. It is a diagram showing a circuit. 1...Flexible printed board 2(1) to 2(n)...SIP integrated circuit board 3.4.
・・Part 6・・・・Printed circuit board
Claims (1)
に接続された複数のシングルインラインパッケージ型集
積回路基板を所定のプリント基板に接続してなる混成集
積回路であって、 前記複数のシングルインラインパッケージ型集積回路基
板は、一枚のフレキシブルプリント板に部品実装面を介
して面一に接続されかつフレキシブルプリント板の撓み
を利用してプリント基板に配置接続されているものであ
ることを特徴とする混成集積回路。(1) A hybrid integrated circuit formed by connecting a plurality of single in-line package type integrated circuit boards electrically connected by flexible printed boards to a predetermined printed board, the plurality of single in-line package type integrated circuit boards The integrated circuit board is a hybrid circuit board characterized in that it is connected flush to a single flexible printed board via the component mounting surface, and is arranged and connected to the printed board using the bending of the flexible printed board. integrated circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31862488A JPH02164090A (en) | 1988-12-19 | 1988-12-19 | Hybrid integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31862488A JPH02164090A (en) | 1988-12-19 | 1988-12-19 | Hybrid integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02164090A true JPH02164090A (en) | 1990-06-25 |
Family
ID=18101215
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31862488A Pending JPH02164090A (en) | 1988-12-19 | 1988-12-19 | Hybrid integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02164090A (en) |
-
1988
- 1988-12-19 JP JP31862488A patent/JPH02164090A/en active Pending
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