JPH0215461B2 - - Google Patents

Info

Publication number
JPH0215461B2
JPH0215461B2 JP59228955A JP22895584A JPH0215461B2 JP H0215461 B2 JPH0215461 B2 JP H0215461B2 JP 59228955 A JP59228955 A JP 59228955A JP 22895584 A JP22895584 A JP 22895584A JP H0215461 B2 JPH0215461 B2 JP H0215461B2
Authority
JP
Japan
Prior art keywords
suction
held
substrate
flat
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59228955A
Other languages
Japanese (ja)
Other versions
JPS61111251A (en
Inventor
Masuo Shiaku
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KURESEN SANGYO KK
Original Assignee
KURESEN SANGYO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KURESEN SANGYO KK filed Critical KURESEN SANGYO KK
Priority to JP22895584A priority Critical patent/JPS61111251A/en
Publication of JPS61111251A publication Critical patent/JPS61111251A/en
Publication of JPH0215461B2 publication Critical patent/JPH0215461B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H3/00Separating articles from piles
    • B65H3/08Separating articles from piles using pneumatic force
    • B65H3/14Air blasts producing partial vacuum

Description

【発明の詳細な説明】 「産業上の利用分野」 本発明は表面が平滑面である平板状部材の保持
装置に係り、特にウエハ、レチクル、フオツトマ
スク等の半導体製造用各種基板の搬送に用いる保
持装置に関する。
DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a holding device for a flat plate-like member having a smooth surface, and particularly to a holding device used for transporting various substrates for semiconductor manufacturing such as wafers, reticles, and photomasks. Regarding equipment.

「従来の技術」 ウエハ、レチクル、フオツトマスク等の半導体
製造用各種基板においては、高密度回路形成面に
傷の発生を避ける為に、吸着面と被保持部材たる
基板間に生じた吸引力により高速流体膜を介して
前記基板が吸着面上に非接触の状態で保持される
ように構成するのがよい。
``Prior art'' In order to avoid scratches on the surfaces on which high-density circuits are formed on various substrates for semiconductor manufacturing such as wafers, reticles, and photomasks, suction forces generated between the suction surface and the substrate (the member to be held) are used at high speed. It is preferable that the substrate be held on the suction surface in a non-contact manner via a fluid film.

その一例を第1A及至1B図に基づいて説明す
るに、10は方形平板状の吸着板で、下面を平面
状に形成し、基板7を保持する吸着面10aを形
成すると共に、その中央部に上面まで貫通する送
気孔11を穿設する。送気孔11上面側には袋ナ
ツト12を介してエアーホース13が取り付けら
れており、前記吸着面10a側に圧縮空気が送気
されるよう構成する。又前記吸着板10は、吸着
面10a側角隅部に夫々鍵形形状の規制部材14
a…を固設し、基板7が前記吸着面と平行に滑落
するのを防止している。
An example of this will be explained based on FIGS. 1A and 1B. Reference numeral 10 denotes a rectangular flat suction plate, the bottom surface of which is flat, and a suction surface 10a for holding the substrate 7 formed therein. An air supply hole 11 penetrating to the upper surface is bored. An air hose 13 is attached to the upper surface side of the air supply hole 11 via a cap nut 12, so that compressed air is supplied to the suction surface 10a side. Further, the suction plate 10 has a key-shaped regulating member 14 at each corner on the side of the suction surface 10a.
a... are fixedly installed to prevent the substrate 7 from sliding down parallel to the suction surface.

かかる比較技術によれば、吸着板10の送気孔
11よりエアーを送気させたまま、規制部材14
a…により囲まれる吸着面下方に基板7が位置す
るように、基板7と吸着板10の対角線を45゜変
向させた状態で基板7を載置してある設置面16
上に吸着板10を載置させると、前記吸着面10
aが基板7上に近接してその隙間間隔dが0.2〜
0.8mmの微小間隔になり、且つ送気孔11より送
気されたエアーが前記間隔内を相当な高速空気速
度でもつて外方に向け排気される為、前記隙間間
隔d間に生じる負圧により浮力が生じ、この結果
基板7が設置面より浮き上がり、吸着面10aに
前記高速空気流膜を介して非接触の状態で近接保
持されることとなる。
According to this comparative technique, while air is being supplied from the air supply hole 11 of the suction plate 10, the regulating member 14 is
An installation surface 16 on which the substrate 7 is placed with the diagonal of the substrate 7 and the suction plate 10 turned by 45 degrees so that the substrate 7 is positioned below the suction surface surrounded by a...
When the suction plate 10 is placed on top, the suction surface 10
a is close to the substrate 7 and the gap distance d is 0.2~
The gap is as small as 0.8 mm, and the air sent from the air supply hole 11 is exhausted outward within the gap at a considerably high air speed, so the negative pressure generated between the gap d causes buoyancy. As a result, the substrate 7 rises from the installation surface and is held close to the suction surface 10a in a non-contact manner via the high-speed air flow membrane.

一方かかる状態では、基板7が吸着面10aに
非接触の状態で保持されていることとなる為に、
吸着板10の僅かな傾動により基板7が吸着面に
沿つて平行に滑落してしまう危険性がる為に、前
記滑動の規制を行う規制部材14a…により位置
保持を行つている。
On the other hand, in such a state, since the substrate 7 is held in a non-contact state on the suction surface 10a,
Since there is a risk that the substrate 7 will slide down parallel to the suction surface due to a slight tilting of the suction plate 10, its position is maintained by regulating members 14a that restrict the sliding.

「発明が解決しようとする問題点」 しかしながら、このような機械的規制手段で
は、吸着板10傾動の際に基板7側縁面が規制部
材14a…に衝接してパーテイクル等が発生し、
該パーテイクルが基板7表面の回路形成面に付着
し、製品不良の原因になり易い。
"Problems to be Solved by the Invention" However, in such a mechanical regulating means, when the suction plate 10 is tilted, the side edge surface of the substrate 7 collides with the regulating member 14a, and particles etc. are generated.
The particles adhere to the circuit forming surface of the substrate 7 and tend to cause product defects.

又例え回路形成に影響の少ない基板側縁面7a
を利用して保持部材5,6を接触保持するにして
も非接触ではない為に完全に塵等の付着を避ける
ことが出来ず、例えば前記接触部に付着した洗浄
液等が、搬送中に塵を伴なつて基板7表面中央部
の回路形成面まで流下してしまつたりする場合も
あり、基板7搬送に使用する保持装置1として不
完全なものであつた。
Also, for example, the board side edge surface 7a has little influence on circuit formation.
Even if the holding members 5 and 6 are held in contact with each other using the In some cases, the holding device 1 used for transporting the substrate 7 was incomplete, as it sometimes flowed down to the circuit forming surface at the center of the surface of the substrate 7.

本発明が解決しようとする技術的課題は半導体
製造用基板その他の平滑な表面を有する平板状部
材を完全に非接触の状態で所定位置に保持し得る
保持装置を提供することを目的とする。
The technical problem to be solved by the present invention is to provide a holding device that can hold a semiconductor manufacturing substrate or other flat plate-shaped member having a smooth surface in a predetermined position in a completely non-contact state.

「問題点を解決しようとする手段」 本発明はかかる技術的課題を達成する為に、第
2B図に示すように、前記平板状部材と対面する
底面を中心域と周縁域に二つに分割し、その境界
に設けたリング状スリツト開口23aより噴出さ
れる気流により前記周縁側を、高速流体膜を介し
て平板状部材を吸引可能な吸着面27として機能
させ、一方前記中心域側に凹所35を形成すると
ともに、該凹所35と連通する細路34を前記ス
リツト開口23a上流側の送気通路23に開口さ
せ、前記送気通路23を流れる気流の吸引作用を
利用して前記凹所35を負圧下に置き、前記吸着
面27に吸引させた平板状部材7の位置保持を行
う事を特徴とする平板状部材の保持装置を提案す
る。
"Means for Solving Problems" In order to achieve such technical problems, the present invention divides the bottom surface facing the flat member into two into a central region and a peripheral region, as shown in FIG. 2B. The airflow ejected from the ring-shaped slit opening 23a provided at the boundary causes the peripheral edge side to function as a suction surface 27 capable of suctioning the flat member through a high-speed fluid film, while a recess is formed on the central area side. At the same time, a narrow passage 34 communicating with the recess 35 is opened to the air supply passage 23 on the upstream side of the slit opening 23a, and the suction effect of the air flow flowing through the air supply passage 23 is used to close the recess. A holding device for a flat plate member is proposed, which is characterized in that the flat member 7 is held in position by placing the station 35 under negative pressure and sucked by the suction surface 27.

「作用」 かかる技術手段によれば、高速流体膜を介して
吸引保持されている平板状部材7の滑動規制が負
圧下においた凹所35の流体的作用により行わし
める為に、平滑な表面を有する平板部材7を完全
に非接触の状態で所定位置に保持する事が可能と
なる。
"Function" According to this technical means, in order to restrict the sliding of the flat member 7 that is suctioned and held via a high-speed fluid film by the fluid action of the recess 35 placed under negative pressure, the smooth surface is It becomes possible to hold the flat plate member 7 in a predetermined position in a completely non-contact state.

又前記中心域側と周縁域側に夫々独立した送気
通路や吸引通路を設けるのではなくリング状スリ
ツト開口23aより単に高速気流を噴出する事に
より、その周縁側で平板状部材を吸引可能な吸着
面27として機能させ、且つその中心域側を負圧
下に置く事による位置保持が可能である為に、圧
気管22が一本で足り、その分極作性が格段に向
上する。
Moreover, instead of providing independent air supply passages and suction passages on the central area side and the peripheral area side, the flat plate-shaped member can be sucked on the peripheral side by simply ejecting high-speed airflow from the ring-shaped slit opening 23a. Since it is possible to function as the adsorption surface 27 and to maintain its position by placing the central region side under negative pressure, only one pneumatic air pipe 22 is required, and its polarization performance is greatly improved.

「実施例」 以下、図面を参照して本発明の好適な実施例を
例示的に詳しく説明する。ただしこの実施例に記
載されている構成部品の寸法、材質、形状、その
相対配置などは特に特定的な記載がない限りは、
この発明の範囲をそれのみに限定する趣旨ではな
く、単なる説明例に過ぎない。
"Embodiments" Hereinafter, preferred embodiments of the present invention will be described in detail by way of example with reference to the drawings. However, the dimensions, materials, shapes, relative positions, etc. of the components described in this example are as follows, unless otherwise specified.
This is not intended to limit the scope of the invention, but is merely an illustrative example.

第2A,2B図は本発明の実施例に係る基板保
持装置である。
2A and 2B show a substrate holding device according to an embodiment of the present invention.

本実施例の構成を空気の流れ順に従つて説明す
るに、20は、或る種の搬送装置に取り付け可能
に上端に螺子部21を螺刻した本体で、その上側
中腹部に中心部材30の軸線上に穿設した主孔3
1まで達する圧縮空気導入口22を形成する。
The structure of this embodiment will be explained in accordance with the order of air flow. Reference numeral 20 denotes a main body having a threaded portion 21 on its upper end so that it can be attached to a certain type of conveyance device, and a central member 30 on its upper midsection. Main hole 3 drilled on the axis
A compressed air inlet 22 reaching up to 1 is formed.

中心部材30は、前記主孔31の下流側円周部
位に開口部31aを穿設すると共に、該開口部3
1aを囲設する如く環状オリフイス32を固設す
る。
The central member 30 is provided with an opening 31a at a downstream circumferential portion of the main hole 31, and the opening 31a
An annular orifice 32 is fixedly installed so as to surround 1a.

環状オリフイス32は中心部材30外周との間
で形成される縮径されたリング状オリフイス溝3
2aを有し、その出口側を本体20内周と中心部
材30外周間により形成されるリング状スリツト
溝23に連通させる。即ちオリフイス溝32aと
スリツト溝23は、いわゆる流体増幅部を形成し
ている。従つてオリフイス溝32a開口面積はス
リツト溝23開口面積より大幅に小に設定してあ
る。
The annular orifice 32 has a reduced diameter ring-shaped orifice groove 3 formed between the outer periphery of the center member 30
2a, and its outlet side communicates with a ring-shaped slit groove 23 formed between the inner periphery of the main body 20 and the outer periphery of the central member 30. That is, the orifice groove 32a and the slit groove 23 form a so-called fluid amplification section. Therefore, the opening area of the orifice groove 32a is set to be much smaller than the opening area of the slit groove 23.

リング状スリツト溝23はその上流側を、本体
20中腹部より穿設されフイルタ24を介して外
気と連通する副孔25と連通させ、一方下流側は
略放射線状に形成した中心部材30外周に沿つて
底面に開口23aさせている。
The upstream side of the ring-shaped slit groove 23 communicates with a sub-hole 25 that is bored from the midsection of the main body 20 and communicates with the outside air via the filter 24, while the downstream side communicates with the outer periphery of the central member 30 formed in a substantially radial shape. An opening 23a is formed along the bottom surface.

尚開口23aにより空気流の噴射角度は本体側
底面27に対し、僅かな傾斜角度、具体的には5
度以下になるよう設定している。このように形成
するこにより、高速流体が本体側底面27に沿つ
て略水平方向に噴射されることとなり、基板7表
面への近接が容易になると共に、本体側底面27
と基板7表面間の減圧(吸引)効果も好ましいも
のになる。
The opening 23a allows the airflow to be ejected at a slight angle of inclination, specifically 5.
It is set so that it is below 30 degrees. By forming in this way, the high-speed fluid is injected in a substantially horizontal direction along the bottom surface 27 of the main body side, making it easier to approach the surface of the substrate 7, and
The reduced pressure (suction) effect between the surface of the substrate 7 and the surface of the substrate 7 is also favorable.

底面は本体側底面27と中心部材側底面37が
ほぼ面一又は中心部材側底面37が僅かに凹にな
るよう形成し、スリツト溝23より送気されたエ
アーの流れる方向の底面、即ち本体側底面27を
基板7と対応させて平面状に形成し、基板吸着面
となす。
The bottom surface is formed so that the bottom surface 27 on the main body side and the bottom surface 37 on the center member side are substantially flush with each other, or the bottom surface 37 on the center member side is slightly concave, and the bottom surface in the direction in which the air blown from the slit groove 23 flows, that is, on the main body side. The bottom surface 27 is formed into a planar shape so as to correspond to the substrate 7, and serves as a substrate suction surface.

一方、中心部材側底面37軸線上には吸引孔3
3が穿設され、該吸引孔33はその上端において
矩形状に拡径された拡径部33aを有し、小孔3
4を介して拡径部33aとリング状スリツト溝2
3の流路中に連通させる。そして中心部材側底面
37の吸引孔33周囲にはドーナツ状凹所35を
形成し、基板7の位置規制部となす。
On the other hand, a suction hole 3 is provided on the axis of the bottom surface 37 on the side of the central member.
3 is bored, and the suction hole 33 has a rectangular enlarged diameter part 33a at its upper end, and the small hole 3
4 to the enlarged diameter portion 33a and the ring-shaped slit groove 2.
It communicates with the flow path of No.3. A donut-shaped recess 35 is formed around the suction hole 33 on the bottom surface 37 on the side of the central member, and serves as a position regulating portion for the substrate 7.

即ち小孔34とスリツト溝23は、いわゆる流
体吸引部を形成している。
That is, the small hole 34 and the slit groove 23 form a so-called fluid suction section.

次にかかる実施例の作用を説明する。 Next, the operation of this embodiment will be explained.

先ず圧縮空気導入口22より3〜4Kg/cm2の圧
縮空気を送気させると、主孔31を通つてその下
流側の開口部31aより環状オリフイス32内に
入り込み、そしそて縮径されたオリフイス溝32
aよりリング状スリツト溝23内に噴射される。
First, when compressed air of 3 to 4 kg/cm 2 is supplied from the compressed air inlet 22, it passes through the main hole 31 and enters the annular orifice 32 from the opening 31a on the downstream side, and then the diameter is reduced. Orifice groove 32
It is injected into the ring-shaped slit groove 23 from a.

リング状スリツト溝23では圧縮空気の流速に
より、その上流側に連通する副孔25よりフイル
タ24を介して清浄な外気を吸引し、流量を増し
た送気流が下流側に流れ、中心部材30外周に沿
つて出口側開口部23aより本体側底面27側外
方に送気される。
In the ring-shaped slit groove 23, due to the flow velocity of the compressed air, clean outside air is sucked through the filter 24 from the auxiliary hole 25 communicating with the upstream side, and the air flow with increased flow rate flows downstream, and the outer periphery of the central member 30 is drawn. Air is sent outward from the outlet side opening 23a to the bottom surface 27 side of the main body side.

一方、リング状スリツト溝23の流路途中で
は、小孔34を介して吸引孔33の拡径部33a
と連通している為に、該吸引孔33より中心部材
側底面37側の外気をも吸い込みながら本体側底
面27に送気させている。
On the other hand, in the middle of the flow path of the ring-shaped slit groove 23, the enlarged diameter portion 33a of the suction hole 33 is inserted through the small hole 34.
Since the air is in communication with the main body side bottom surface 27, the outside air on the side of the bottom surface 37 on the center member side is also sucked through the suction hole 33 and is supplied to the bottom surface 27 on the main body side.

かかる状態で、基板7表面と本体底面27との
平行状態を維持したまま、該測置を基板7表面に
近接させ、その隙間間隔dが略0.2〜0.8mmの間に
達すると、リング状スリツト溝23より本体側底
面27に送気されたエアーが前記間隔d内を相当
な高速空気速度をもつて外方に向け排出される
為、前記実施例と同様に隙間間隔d間に生じる負
圧により基板7に浮力が生じ、この結果基板7が
浮き上がり、本体側底面27に前記高速空気流膜
を介して非接触の状態で近接保持さることとな
る。
In this state, the measuring device is brought close to the surface of the substrate 7 while maintaining the parallel state between the surface of the substrate 7 and the bottom surface 27 of the main body, and when the gap distance d reaches approximately 0.2 to 0.8 mm, the ring-shaped slit is formed. Since the air sent from the groove 23 to the bottom surface 27 of the main body side is discharged outward within the gap d at a considerably high speed, negative pressure is generated between the gap d as in the previous embodiment. This creates a buoyant force on the substrate 7, and as a result, the substrate 7 floats up and is held close to the main body side bottom surface 27 through the high-speed air flow membrane in a non-contact state.

一方中心部材側底面37側においては吸引孔3
3より中心部材側底面37側の外気を吸引してい
る為に、該吸引孔33及びその周囲に配したドー
ナツ状凹所35の空気が減圧され、ほぼ真空状態
になる為に、基板7が位置規制され、滑動する事
なく確実な保持が可能となる。
On the other hand, on the center member side bottom surface 37 side, the suction hole 3
3 sucks outside air from the center member side bottom surface 37 side, the air in the suction hole 33 and the donut-shaped recess 35 arranged around it is reduced in pressure, and becomes almost in a vacuum state, so that the substrate 7 The position is regulated and it can be held securely without slipping.

かかる実施例によれば流体的作用により基板7
を位置規制する為に、完全に非接触の状態で保持
が可能となり、極めて好ましい保持装置の提供が
可能となる。
According to this embodiment, the substrate 7 is
In order to restrict the position of the holder, it is possible to hold the holder in a completely non-contact state, making it possible to provide an extremely preferable holding device.

「発明の効果」 以上記載した如く本発明によれば、高速流体膜
を介して平板状部材が吸着面上に非接触の状態で
保持されると共に、吸着面の水平位置からの傾動
により生ずる滑落を防止する手段が圧力的作用に
より形成されている為に、前記吸着面を任意の方
向に傾動させても非保持部材が完全に非接触の状
態で確実に所定位置に保持させることが出来る。
"Effects of the Invention" As described above, according to the present invention, the flat member is held on the suction surface in a non-contact state via the high-speed fluid film, and the flat member is prevented from falling due to tilting of the suction surface from the horizontal position. Since the means for preventing this is formed by pressure action, even if the suction surface is tilted in any direction, the non-retaining member can be reliably held in a predetermined position in a completely non-contact state.

而も本発明においては、吸着面の内周側に位置
する中心域側に凹所を形成するとともに、該凹所
と連通する細路を前記スリツト開口上流側の送気
通路に開口させ、前記送気通路を流れる気流の吸
引作用を利用して前記凹所を負圧下に置き、前記
吸着面に吸引させた平板状部材の位置保持を行う
よう構成した為に、前記中心域側と周縁域側に
夫々独立した送気通路や吸引通路を設ける必要が
なく、リング状スリツト開口より単に高速気流を
噴出する事により、自動的に中心域側を負圧下に
置く事が出来、圧気管が一本で足り、その分操作
性が格段に向上する。
In addition, in the present invention, a recess is formed on the center region side located on the inner peripheral side of the suction surface, and a narrow passage communicating with the recess is opened to the air supply passage on the upstream side of the slit opening. Since the recess is placed under negative pressure by utilizing the suction action of the airflow flowing through the air supply passage, and the flat member sucked by the suction surface is held in position, the central area side and the peripheral area side are There is no need to provide separate air supply passages and suction passages on each side, and by simply ejecting high-speed airflow from the ring-shaped slit opening, the central area side can be automatically placed under negative pressure, and the pressure air pipes are A book is sufficient, and operability is greatly improved.

、等の種々の著効を有す。It has various effects such as , etc.

【図面の簡単な説明】[Brief explanation of drawings]

第1A乃至1B図は本発明の比較例に係り、第
1A図は斜視図、第1B図は正面断面図である。
第2A乃至2B図は本発明の実施例に係り、第2
A図は正面断面図、第2B図は底面図である。
1A and 1B relate to a comparative example of the present invention, with FIG. 1A being a perspective view and FIG. 1B being a front sectional view.
2A and 2B relate to an embodiment of the present invention;
Figure A is a front sectional view, and Figure 2B is a bottom view.

Claims (1)

【特許請求の範囲】[Claims] 1 平板状の被保持部材表面に一定の隙間をもた
せて近接可能な吸着面より被保持部材表面に向け
気流を噴射させ、高速流体の負圧により生じる吸
引力によつて被保持部材に浮力を生じせしめ、前
記吸着面と被保持部材間を高速流体膜を介して互
いに吸引可能に構成した平板状部材の保持装置に
おいて、前記平板状部材と対面する底面を中心域
と周縁域に二つに分割し、その境界に設けたリン
グ状スリツト開口より噴出される気流により前記
周縁側を、高速流体膜を介して平板状部材を吸引
可能な吸着面として機能させ、一方前記中心域側
に凹所を形成するとともに、該凹所と連通する細
路を前記スリツト開口上流側の送気通路に開口さ
せ、前記送気通路を流れる気流の吸引作用を利用
して前記凹所を負圧下に置き、前記吸着面に吸引
させた平板状部材の位置保持を行う事を特徴とす
る平板状部材の保持装置。
1 Airflow is jetted toward the surface of the held member from a suction surface that can be approached with a certain gap on the flat plate-shaped held member surface, and buoyancy is applied to the held member by the suction force generated by the negative pressure of the high-speed fluid. In the device for holding a flat plate member, the suction surface and the held member are configured to be able to attract each other via a high-speed fluid film, wherein the bottom face facing the flat member is divided into a central area and a peripheral area. The peripheral edge side functions as a suction surface capable of suctioning the flat member through a high-speed fluid film, while the central area side has a recess. and opening a narrow passage communicating with the recess into an air supply passage upstream of the slit opening, and placing the recess under negative pressure by utilizing the suction effect of the air flow flowing through the air supply passage; A holding device for a flat member, characterized in that the flat member held by the suction surface is held in position.
JP22895584A 1984-11-01 1984-11-01 Holding device for flat laminar member Granted JPS61111251A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22895584A JPS61111251A (en) 1984-11-01 1984-11-01 Holding device for flat laminar member

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22895584A JPS61111251A (en) 1984-11-01 1984-11-01 Holding device for flat laminar member

Publications (2)

Publication Number Publication Date
JPS61111251A JPS61111251A (en) 1986-05-29
JPH0215461B2 true JPH0215461B2 (en) 1990-04-12

Family

ID=16884476

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22895584A Granted JPS61111251A (en) 1984-11-01 1984-11-01 Holding device for flat laminar member

Country Status (1)

Country Link
JP (1) JPS61111251A (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS631647A (en) * 1986-06-23 1988-01-06 Taiyo Tekko Kk Noncontact adsorbing device
JP5370664B2 (en) * 2009-09-07 2013-12-18 村田機械株式会社 Substrate transfer apparatus and method
JP5888891B2 (en) * 2010-09-27 2016-03-22 東レエンジニアリング株式会社 Substrate transfer device
CN114104658A (en) * 2021-12-14 2022-03-01 常州先进制造技术研究所 Self-adaptive control method for plate feeding

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5140343A (en) * 1974-09-25 1976-04-05 Ota Toshuki Aruminiumuno hyomenshoriho
JPS5338291U (en) * 1976-09-08 1978-04-04
JPS58143989A (en) * 1982-02-15 1983-08-26 株式会社日立製作所 Conveyor

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5140343A (en) * 1974-09-25 1976-04-05 Ota Toshuki Aruminiumuno hyomenshoriho
JPS5338291U (en) * 1976-09-08 1978-04-04
JPS58143989A (en) * 1982-02-15 1983-08-26 株式会社日立製作所 Conveyor

Also Published As

Publication number Publication date
JPS61111251A (en) 1986-05-29

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