JPH02153952A - Semiconductive resin composition - Google Patents
Semiconductive resin compositionInfo
- Publication number
- JPH02153952A JPH02153952A JP30757488A JP30757488A JPH02153952A JP H02153952 A JPH02153952 A JP H02153952A JP 30757488 A JP30757488 A JP 30757488A JP 30757488 A JP30757488 A JP 30757488A JP H02153952 A JPH02153952 A JP H02153952A
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- semiconductive
- weight
- layer
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 title claims description 22
- 229920005672 polyolefin resin Polymers 0.000 claims abstract description 19
- 239000004215 Carbon black (E152) Substances 0.000 claims abstract description 11
- 229930195733 hydrocarbon Natural products 0.000 claims abstract description 11
- 150000002430 hydrocarbons Chemical class 0.000 claims abstract description 11
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims abstract description 9
- 150000001336 alkenes Chemical class 0.000 claims abstract description 3
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 claims abstract 2
- 239000000203 mixture Substances 0.000 abstract description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract description 6
- 239000006230 acetylene black Substances 0.000 abstract description 3
- 239000006232 furnace black Substances 0.000 abstract description 2
- 229920001748 polybutylene Polymers 0.000 abstract 1
- 238000004132 cross linking Methods 0.000 description 8
- 229920003020 cross-linked polyethylene Polymers 0.000 description 8
- 239000004703 cross-linked polyethylene Substances 0.000 description 8
- 239000003431 cross linking reagent Substances 0.000 description 7
- 238000007765 extrusion coating Methods 0.000 description 6
- 239000004020 conductor Substances 0.000 description 4
- -1 polyethylene, ethylene-vinyl acetate copolymers Polymers 0.000 description 4
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 3
- 229920000181 Ethylene propylene rubber Polymers 0.000 description 3
- 229920005601 base polymer Polymers 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 239000004711 α-olefin Substances 0.000 description 3
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 230000003712 anti-aging effect Effects 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 235000019241 carbon black Nutrition 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920006244 ethylene-ethyl acrylate Polymers 0.000 description 2
- 229920006112 polar polymer Polymers 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- IPJGAEWUPXWFPL-UHFFFAOYSA-N 1-[3-(2,5-dioxopyrrol-1-yl)phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC(N2C(C=CC2=O)=O)=C1 IPJGAEWUPXWFPL-UHFFFAOYSA-N 0.000 description 1
- BJELTSYBAHKXRW-UHFFFAOYSA-N 2,4,6-triallyloxy-1,3,5-triazine Chemical compound C=CCOC1=NC(OCC=C)=NC(OCC=C)=N1 BJELTSYBAHKXRW-UHFFFAOYSA-N 0.000 description 1
- BHIIOLWIZLICII-UHFFFAOYSA-N 2-butyl-5-methylphenol Chemical compound CCCCC1=CC=C(C)C=C1O BHIIOLWIZLICII-UHFFFAOYSA-N 0.000 description 1
- BXAAQNFGSQKPDZ-UHFFFAOYSA-N 3-[1,2,2-tris(prop-2-enoxy)ethoxy]prop-1-ene Chemical compound C=CCOC(OCC=C)C(OCC=C)OCC=C BXAAQNFGSQKPDZ-UHFFFAOYSA-N 0.000 description 1
- 239000004709 Chlorinated polyethylene Substances 0.000 description 1
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、架橋ポリエチレン絶縁ケーブルなどの電カ
ケープルの半導電層などに用いられる半導電性樹脂組成
物に関し、その半導電層の剥離性を良好にしたものであ
る。Detailed Description of the Invention [Field of Industrial Application] The present invention relates to a semiconductive resin composition used for a semiconductive layer of an electrical cable such as a crosslinked polyethylene insulated cable, and to improve the releasability of the semiconductive layer. It was made in good condition.
架橋ポリエチレン絶縁ケーブル（Ｃ■ケーブル）などの
電カケープルにあっては、ケーブル間の接続時などに行
われる端末処理作業を容易にするために、架橋ポリエチ
レンや架橋エチレンプロピレンゴムなどからなる絶縁層
から半導電層を剥ぎ取り易くする必要がある。また、同
時に電カケープルに曲げ外力が加った際に、絶縁層と半
導電層とが界面剥離を起さないことも必要である。よっ
て、半導電層は絶縁層に対して適度の剥離性と適度の密
着性を併せ持つことが必要となる。For power cables such as cross-linked polyethylene insulated cables (C cables), insulating layers made of cross-linked polyethylene or cross-linked ethylene propylene rubber, etc. are It is necessary to make the semiconductive layer easy to peel off. At the same time, it is also necessary that interfacial separation between the insulating layer and the semiconducting layer does not occur when an external bending force is applied to the power cable. Therefore, the semiconducting layer needs to have both appropriate releasability and appropriate adhesion to the insulating layer.
このため、従来はポリ塩化ビニル、塩素化ポリエチレン
、エチレン−酢酸ビニル共重合体などの極性ポリマーや
フッ素樹脂、シリフーン樹脂などにポリエチレンなどの
ポリオレフィン樹脂を適量配合してベースポリマーとし
、これに導電性カーボンブラックを配合した樹脂組成物
から半導電層を摺成し、架橋ポリエチレンや架橋エチレ
ンプロピレンゴムなどのポリオレフィン系樹脂からなる
絶縁層に対して適度の剥離性および密着性が得られるよ
うにしている。For this reason, conventionally, polar polymers such as polyvinyl chloride, chlorinated polyethylene, ethylene-vinyl acetate copolymers, fluororesins, silicone resins, etc. are blended with an appropriate amount of polyolefin resins such as polyethylene to form a base polymer, and this is made into a base polymer. A semiconductive layer is formed from a resin composition containing carbon black, and is made to have appropriate peelability and adhesion to an insulating layer made of a polyolefin resin such as crosslinked polyethylene or crosslinked ethylene propylene rubber. .
しかしながら、上記樹脂組成物からなる半導電層にあっ
ては、この樹脂組成物がポリオレフィン樹脂と本来この
ポリオレフィン樹脂に対して相溶性の乏しい極性ポリマ
ーとのブレンド物であることから、混線時に均一に分散
されにくく、したがってこの樹脂組成物から得られる半
導電層を絶縁層から剥離する際には、方向性が発現し、
任意の方向に剥離することができず、電カケープルの端
末処理作業を容易に行うことができない問題があった。However, in the case of a semiconducting layer made of the above-mentioned resin composition, since this resin composition is a blend of a polyolefin resin and a polar polymer that is inherently poor in compatibility with this polyolefin resin, it is difficult to uniformly conduct wires when cross-wired. It is difficult to disperse, and therefore, when the semiconducting layer obtained from this resin composition is peeled from the insulating layer, directionality is exhibited,
There was a problem in that the cable could not be peeled off in any direction, and the end treatment of the electrical cable could not be easily performed.
この発明では、半導電層をなす半導電性樹脂組成物とし
て、ポリオレフィン系樹脂１００重量部に導電性カーボ
ンブラック３０〜８０重量部と深化水素系合成油０．１
〜２０Ｍ量部を配合したものを使用することによって上
記問題点を解決するようにした。In this invention, as a semiconductive resin composition forming a semiconductive layer, 100 parts by weight of polyolefin resin, 30 to 80 parts by weight of conductive carbon black, and 0.1 part by weight of deep hydrogenated synthetic oil are used.
The above problem was solved by using a compound containing ~20 M parts.
以下、この発明の詳細な説明する。The present invention will be described in detail below.
第１図は、この発明の半導電性樹脂組成物からなる半導
電層を有する電カケープルの一例を示すもので、図中符
号１は導体である。この導体１の外周には内部半導電層
２が被覆されている。この内部半導電層２は、ポリオレ
フィン系樹脂１００重量部に導電性カーボンブラック３
０〜８０重量部、炭化水素系合成油０．１〜２０重量部
を配合した半導電性樹脂組成物を導体１上に押出被覆し
て形成されたものである。FIG. 1 shows an example of an electrical cable having a semiconductive layer made of the semiconductive resin composition of the present invention, and reference numeral 1 in the figure indicates a conductor. The outer periphery of this conductor 1 is coated with an internal semiconducting layer 2 . This internal semiconductive layer 2 is made of 100 parts by weight of polyolefin resin and 3 parts by weight of conductive carbon black.
It is formed by extrusion coating the conductor 1 with a semiconductive resin composition containing 0 to 80 parts by weight and 0.1 to 20 parts by weight of hydrocarbon synthetic oil.
ここで用いられるポリオレフィン系樹脂としては、ポリ
エチレン、ポリブテン−１１ポリプロピレン、ポリ４−
メチルペンテン−１などのα−オレフィン単独ｆｆｉ
合体やエチレン−プロピ１２１合体、エチレン−ブテン
−１共重合体、エチレン−エチルアクリレート共重合体
、エチレン−酢酸ビニル共重合体などのα−オレフィン
共重合体ならびにこれらの２種以上のブレンドポリマー
が挙げられるが、なかでもエチレン−酢酸ビニル共重合
体、エチレン−エチルアクリレート共重合体が特に好適
である。Polyolefin resins used here include polyethylene, polybutene-11 polypropylene, poly4-
α-olefin alone ffi such as methylpentene-1
α-olefin copolymers such as ethylene-propylene 121 polymers, ethylene-butene-1 copolymers, ethylene-ethyl acrylate copolymers, ethylene-vinyl acetate copolymers, and blend polymers of two or more of these Among them, ethylene-vinyl acetate copolymer and ethylene-ethyl acrylate copolymer are particularly suitable.
また、ここでの導電性カーボンブランクとしては、アセ
チレンブラック、ファーネスブラック等の周知のカーボ
ンブラックが使用できる。導電性カーボンブラックのポ
リオレフィン系樹脂に対する混合量は、内部半導電層２
に要求される導電性を考慮して定められ、ポリオレフィ
ン系樹脂１００重量部に対して通常３０〜８０重量部の
範囲で決められる。Further, as the conductive carbon blank here, well-known carbon blacks such as acetylene black and furnace black can be used. The amount of conductive carbon black to be mixed with the polyolefin resin is as follows:
It is determined in consideration of the electrical conductivity required for, and is usually determined in the range of 30 to 80 parts by weight per 100 parts by weight of the polyolefin resin.
さらに、炭化水素系合成油としては、オレフィン類の低
重合体（オリゴマー）が用いられ、なかでも極性基を合
しないものが好ましい。具体的には、エチレンとα−オ
レフィンとのコオリゴマー（商品名ルーカント、三井石
油化学工業（株）製）などが好適である。この炭化水素
系合成油の添加量はポリオレフィン系樹脂１００重量部
に対して０．１〜２０市量部、好ましくは、１〜１０重
量部とされる。炭化水素系合成油の添加量が０．１重量
部未満では絶縁層からの剥離が困難となり、逆に２０重
量部を越えると機械的特性が低下して不都合を来す。Further, as the hydrocarbon-based synthetic oil, a low polymer (oligomer) of olefins is used, and among them, one in which polar groups are not combined is preferable. Specifically, a cooligomer of ethylene and α-olefin (trade name: Lucant, manufactured by Mitsui Petrochemical Industries, Ltd.) is suitable. The amount of the hydrocarbon synthetic oil added is 0.1 to 20 parts by weight, preferably 1 to 10 parts by weight, per 100 parts by weight of the polyolefin resin. If the amount of hydrocarbon-based synthetic oil added is less than 0.1 part by weight, it will be difficult to separate it from the insulating layer, and if it exceeds 20 parts by weight, mechanical properties will deteriorate, causing problems.
また、上記ポリオレフィン系樹脂と導電性カーボンブラ
ックと炭化水素系合成油上からなる樹脂組成物には、必
要に応じて架橋剤、架橋助剤、老化防止剤等を加えるこ
とができる。架橋剤としては、ジクミルパーオキサイド
（ＤＣＰ） 、２．５ジメチル−２，５−ジ（（−ブチ
ルパーオキシ）ヘキシン−３等の通常の過酸化物架橋剤
が好適に使用できる。架橋剤の配合項はポリオレフィン
系樹脂１００重量部に対して０．２〜３重量部程度とさ
れる。また、架橋助剤としては、トリアリルイソシアヌ
レート、トリアリルシアヌレート、テトラアリルオキシ
エタン、ｍ−フェニレンビスマレイミド等が使用でき、
ポリオレフィン系樹脂１００重量部に対し０．５〜３重
量部程度配合できる。これらの架橋剤および架橋助剤は
両者を併用するか、またいずれかが単独で使用される。Further, a crosslinking agent, a crosslinking aid, an anti-aging agent, etc. can be added to the resin composition consisting of the polyolefin resin, conductive carbon black, and hydrocarbon synthetic oil, if necessary. As the crosslinking agent, common peroxide crosslinking agents such as dicumyl peroxide (DCP) and 2.5 dimethyl-2,5-di((-butylperoxy)hexyne-3) can be suitably used.Crosslinking agent The blending amount is approximately 0.2 to 3 parts by weight per 100 parts by weight of the polyolefin resin.The crosslinking aids include triallyl isocyanurate, triallyl cyanurate, tetraallyloxyethane, m- Phenylene bismaleimide etc. can be used,
It can be blended in an amount of about 0.5 to 3 parts by weight per 100 parts by weight of the polyolefin resin. These crosslinking agents and crosslinking aids may be used in combination, or either one may be used alone.
架橋助剤を単独で使用する場合には、絶縁体中の架橋剤
が一部半導電層に架橋時移行してこの移行架橋剤と反応
して架橋する。また、老化防止剤としては、４，４°
−チオビス（６−１−ブチル−３メチルフエノール）等
が使用でき、その他必要に応じてステアリン酸亜鉛、酸
化亜鉛、マグネシアなどを添加することもできる。When a crosslinking aid is used alone, a portion of the crosslinking agent in the insulator migrates to the semiconductive layer during crosslinking and reacts with the migrated crosslinking agent to cause crosslinking. In addition, as an anti-aging agent, 4,4°
-Thiobis(6-1-butyl-3methylphenol), etc. can be used, and zinc stearate, zinc oxide, magnesia, etc. can also be added as necessary.
そして、このような組成物を用いた内部半導電層２を形
成するには、従来方法と同様に押出被覆法を適用して行
うことができる。この押出被覆時の混和物の押出温度は
、１２０〜１４０℃程度の範囲一される。In order to form the internal semiconductive layer 2 using such a composition, an extrusion coating method can be applied in the same manner as the conventional method. The extrusion temperature of the mixture during extrusion coating is in the range of about 120 to 140°C.
このような半導電性樹脂組成物からなる内部半導電層２
上には絶縁層３が被覆されている。この絶縁層３は、架
橋ポリエチレン、架橋エチレンプロピレンゴムなどのポ
リオレフィン樹脂を押出被覆したのち加熱して架橋させ
た樹脂組成物から構成されている。Internal semiconductive layer 2 made of such a semiconductive resin composition
An insulating layer 3 is coated on top. The insulating layer 3 is made of a resin composition obtained by extrusion coating a polyolefin resin such as crosslinked polyethylene or crosslinked ethylene propylene rubber, and then crosslinking it by heating.
さらに、この絶縁層３上には外部半導電層４、遮蔽層５
およびシース６が順次被覆されて電カケープルとされる
。外部半導電層４は、内部半導電層２を構成する樹脂組
成物を同様に押出被覆して形成されたものであり、要求
され導電度によって導電性カーボンブラックの添加量を
適宜変化させたものである。Further, on this insulating layer 3, an external semiconducting layer 4 and a shielding layer 5 are provided.
Then, the sheath 6 is sequentially covered to form a power cable. The outer semiconductive layer 4 is formed by similarly extrusion coating the resin composition constituting the inner semiconductive layer 2, and the amount of conductive carbon black added is changed as appropriate depending on the required conductivity. It is.
このような電カケープルにあっては、内部半導電層２お
よび外部半導電層４が、ポリオレフィン系樹脂と炭化水
素系合成油を主体とする半導電性樹脂組成物から構成さ
れているため、架橋ポリエチレンや架橋エチレンブロビ
レフゴ、ムなどからなる絶縁層３に対して、適度の密着
性と適度の剥離性とを備えるとともに、ベースポリマー
自体が均−系となり、半導電層剥離の際に、特定の方向
に剥離しやすいなどの不都合が生じず、任意の方向に必
要なだけ容易に剥離することができる。In such an electric cable, since the inner semiconductive layer 2 and the outer semiconductive layer 4 are composed of a semiconductive resin composition mainly composed of polyolefin resin and hydrocarbon synthetic oil, crosslinking is not possible. The base polymer itself has a homogeneous system, and when the semiconducting layer is peeled off, There is no inconvenience such as easy peeling in a specific direction, and it can be easily peeled off in any direction as needed.
以下、実施例を示してこの発明の作用効果を明確にする
。Hereinafter, the effects of this invention will be clarified by showing examples.
第１表に示す配合の樹脂組成物を内部半導電層および外
部半導電層として用意した。導体（５０Ｑｎ＋ｍつ上に
、内部半導電層（厚さｌｌｌ１ｆｆｉ）、絶縁層（架橋
ポリエチレン、厚さ１１ｆｆｉｌＩｌ）、外部半導電層
（厚さ０ 、５ ｏｈｍ）を３層間時押出被覆によって
被覆し、ついで遮蔽層、シースを順次施して電カケープ
ルを製造した。Resin compositions having the formulations shown in Table 1 were prepared as an inner semiconductive layer and an outer semiconductive layer. On the conductor (50Qn+m), an inner semiconducting layer (thickness lll1ffi), an insulating layer (crosslinked polyethylene, thickness 11ffilIl), and an outer semiconducting layer (thickness 0, 5 ohm) are coated by extrusion coating between three layers, Next, a shielding layer and a sheath were sequentially applied to produce an electric cable.
得られた電カケープルについて、内部半導電層および内
部半導電層の剥離の際の方向性の有無および両生導電層
の機械的特性について検討した。Regarding the obtained electrical capule, the internal semiconducting layer, the presence or absence of directionality during peeling of the internal semiconducting layer, and the mechanical properties of the amphibodiconductive layer were investigated.
また、別にこの樹脂組成物と架橋ポリエチレンからなる
二層構造のシート片を押出成形し、これの剥離力を求め
た。Separately, a sheet piece with a two-layer structure made of this resin composition and crosslinked polyethylene was extruded and its peel force was determined.
結果を第１表に併せて示した。The results are also shown in Table 1.
第１表
以 下 余 白
エバフレックス２６０ＶＡ：２８ｗｔ％（三井石浦化学
）アセチレンブラック（電気化学工業）
ツクラック３００（入内新興化学）
ジクミルパーオキサイド（日本油脂）
トリアリルイソシアヌレート（日本化成）ルーカント
ＨＣ−１００（三片石油化学）ルーカント ＨＣ−１５
０（三片石油化学）第１表から明らかなように、この発
明の半導電性樹脂組成物にあっては、これから構成され
た半導電層の剥離時において方向性がな（、任意の方向
に剥離できることがわかり、かつ絶縁層に対する剥離力
と密着力とがバランスしていることがわかる。Table 1 and below Margin Evaflex 260VA: 28wt% (Mitsui Ishiura Chemical) Acetylene Black (Denki Kagaku Kogyo) Tsukurak 300 (Iriuchi Shinko Chemical) Dicumyl peroxide (NOF) Triallylisocyanurate (Nippon Kasei) Lucant
HC-100 (Mikata Petrochemical) Lucant HC-15
0 (Mikata Petrochemical) As is clear from Table 1, the semiconductive resin composition of the present invention has no directionality when peeling the semiconductive layer formed from it. It can be seen that the film can be peeled off quickly, and that the peeling force and adhesion force to the insulating layer are well balanced.
以上説明したように、この発明の半導電性樹脂組成物は
、ポリオレフィン系樹脂１００重量部に対し、導電性カ
ーボンブラック３０〜８０重量部、炭化水素系合成油０
．１〜２０重量部を配合したものであるので、この半導
電性樹脂組成物からなる電カケープル等の半導電層にあ
っては、端末処理作業等において絶縁層から半導電層を
剥離する際に任意の方向に必要なだけ剥離することがで
き、したがって端末処理作業を容易に行うことができる
。また、この半導電層は架橋ポリエチレンなどからなる
絶縁層に対して、適度の密着性と適度の剥離性を有する
ものとなる。As explained above, the semiconductive resin composition of the present invention contains 30 to 80 parts by weight of conductive carbon black and 0 parts by weight of hydrocarbon synthetic oil per 100 parts by weight of polyolefin resin.
．． Since it contains 1 to 20 parts by weight, when peeling the semiconductive layer from the insulating layer during terminal processing etc. in the case of semiconductive layers such as electrical cables made of this semiconductive resin composition, It is possible to peel off as much as necessary in any direction, and therefore the terminal processing work can be easily performed. Further, this semiconductive layer has appropriate adhesiveness and appropriate releasability to an insulating layer made of crosslinked polyethylene or the like.
第１図は、この発明の半導電性樹脂組成物からなる半導
電層を有する電カケープルを示す概略断面図である。
２・・・・・・内部半導電層、４・・・・・・外部半導
電層。FIG. 1 is a schematic cross-sectional view showing an electrical cable having a semiconductive layer made of the semiconductive resin composition of the present invention. 2...Inner semiconducting layer, 4...Outer semiconducting layer.
Claims (2)
性カーボンブラック３０〜８０重量部、炭化水素系合成
油０．１〜２０重量部を配合したことを特徴とする半導
電性樹脂組成物。(1) A semiconductive resin composition characterized in that 30 to 80 parts by weight of conductive carbon black and 0.1 to 20 parts by weight of hydrocarbon synthetic oil are blended with 100 parts by weight of polyolefin resin.
る請求項１記載の半導電性樹脂組成物。(2) The semiconductive resin composition according to claim 1, wherein the hydrocarbon synthetic oil is an olefin oligomer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30757488A JPH02153952A (en) | 1988-12-05 | 1988-12-05 | Semiconductive resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30757488A JPH02153952A (en) | 1988-12-05 | 1988-12-05 | Semiconductive resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02153952A true JPH02153952A (en) | 1990-06-13 |
Family
ID=17970717
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30757488A Pending JPH02153952A (en) | 1988-12-05 | 1988-12-05 | Semiconductive resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02153952A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999029769A1 (en) * | 1997-12-10 | 1999-06-17 | Henkel Kommanditgesellschaft Auf Aktien | Swollen shaped part made of polyolefin plastics |
| WO2003078528A1 (en) * | 2002-03-18 | 2003-09-25 | Ntn Corporation | Conductive resin molding |
| EP2128194A1 (en) * | 2008-05-27 | 2009-12-02 | Borealis AG | Strippable semiconductive composition comprising low melt temperature polyolefin |
| CN102336947A (en) * | 2011-07-19 | 2012-02-01 | 哈尔滨理工大学 | Preparation method of ultra-smooth semiconductive shielding material for high-voltage crosslinked polyethylene insulated cable |
-
1988
- 1988-12-05 JP JP30757488A patent/JPH02153952A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999029769A1 (en) * | 1997-12-10 | 1999-06-17 | Henkel Kommanditgesellschaft Auf Aktien | Swollen shaped part made of polyolefin plastics |
| WO2003078528A1 (en) * | 2002-03-18 | 2003-09-25 | Ntn Corporation | Conductive resin molding |
| US7728066B2 (en) | 2002-03-18 | 2010-06-01 | Ntn Corporation | Conductive resin molding |
| EP2128194A1 (en) * | 2008-05-27 | 2009-12-02 | Borealis AG | Strippable semiconductive composition comprising low melt temperature polyolefin |
| WO2009143952A1 (en) * | 2008-05-27 | 2009-12-03 | Borealis Ag | Strippable semiconductive composition comprising low melt temperature polyolefin |
| US8513525B2 (en) | 2008-05-27 | 2013-08-20 | Borealis Ag | Strippable semiconductive composition comprising low melt temperature polyolefin |
| CN102336947A (en) * | 2011-07-19 | 2012-02-01 | 哈尔滨理工大学 | Preparation method of ultra-smooth semiconductive shielding material for high-voltage crosslinked polyethylene insulated cable |
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