JPH02149700A - めっき用ハンガー検査装置 - Google Patents

めっき用ハンガー検査装置

Info

Publication number
JPH02149700A
JPH02149700A JP21319689A JP21319689A JPH02149700A JP H02149700 A JPH02149700 A JP H02149700A JP 21319689 A JP21319689 A JP 21319689A JP 21319689 A JP21319689 A JP 21319689A JP H02149700 A JPH02149700 A JP H02149700A
Authority
JP
Japan
Prior art keywords
hanger
plating hanger
plating
elastic
plated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP21319689A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0416559B2 (enrdf_load_stackoverflow
Inventor
Masahiko Inui
乾　政彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chuo Seisakusho KK
Original Assignee
Chuo Seisakusho KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chuo Seisakusho KK filed Critical Chuo Seisakusho KK
Priority to JP21319689A priority Critical patent/JPH02149700A/ja
Publication of JPH02149700A publication Critical patent/JPH02149700A/ja
Publication of JPH0416559B2 publication Critical patent/JPH0416559B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C25D17/08—Supporting racks, i.e. not for suspending

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
JP21319689A 1989-08-18 1989-08-18 めっき用ハンガー検査装置 Granted JPH02149700A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21319689A JPH02149700A (ja) 1989-08-18 1989-08-18 めっき用ハンガー検査装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21319689A JPH02149700A (ja) 1989-08-18 1989-08-18 めっき用ハンガー検査装置

Publications (2)

Publication Number Publication Date
JPH02149700A true JPH02149700A (ja) 1990-06-08
JPH0416559B2 JPH0416559B2 (enrdf_load_stackoverflow) 1992-03-24

Family

ID=16635127

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21319689A Granted JPH02149700A (ja) 1989-08-18 1989-08-18 めっき用ハンガー検査装置

Country Status (1)

Country Link
JP (1) JPH02149700A (enrdf_load_stackoverflow)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008274370A (ja) * 2007-05-02 2008-11-13 Chuo Seisakusho Ltd 垂直搬送式連続めっき装置における給電グリップの検査装置
KR101005852B1 (ko) * 2010-08-18 2011-01-05 경원대학교 산학협력단 자동차 휠너트 도금용 자동랙킹장치
KR101237833B1 (ko) * 2011-10-10 2013-02-27 (주)포인텍 연속도금장치의 인쇄회로기판용 통전지그
CN103132127A (zh) * 2011-12-05 2013-06-05 华通电脑股份有限公司 电镀挂架夹点电流监控装置及其方法
CN114689795A (zh) * 2022-03-02 2022-07-01 无锡朋桥信息技术有限公司 一种电镀品质检测自动化装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008274370A (ja) * 2007-05-02 2008-11-13 Chuo Seisakusho Ltd 垂直搬送式連続めっき装置における給電グリップの検査装置
KR101005852B1 (ko) * 2010-08-18 2011-01-05 경원대학교 산학협력단 자동차 휠너트 도금용 자동랙킹장치
KR101237833B1 (ko) * 2011-10-10 2013-02-27 (주)포인텍 연속도금장치의 인쇄회로기판용 통전지그
CN103132127A (zh) * 2011-12-05 2013-06-05 华通电脑股份有限公司 电镀挂架夹点电流监控装置及其方法
CN114689795A (zh) * 2022-03-02 2022-07-01 无锡朋桥信息技术有限公司 一种电镀品质检测自动化装置

Also Published As

Publication number Publication date
JPH0416559B2 (enrdf_load_stackoverflow) 1992-03-24

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