JPH0416559B2 - - Google Patents
Info
- Publication number
- JPH0416559B2 JPH0416559B2 JP21319689A JP21319689A JPH0416559B2 JP H0416559 B2 JPH0416559 B2 JP H0416559B2 JP 21319689 A JP21319689 A JP 21319689A JP 21319689 A JP21319689 A JP 21319689A JP H0416559 B2 JPH0416559 B2 JP H0416559B2
- Authority
- JP
- Japan
- Prior art keywords
- hanger
- plating
- elastic
- plating hanger
- transfer mechanism
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 210000000078 claw Anatomy 0.000 claims description 47
- 230000007246 mechanism Effects 0.000 claims description 42
- 238000007747 plating Methods 0.000 claims description 40
- 238000001514 detection method Methods 0.000 claims description 20
- 238000007689 inspection Methods 0.000 claims description 10
- 230000032258 transport Effects 0.000 claims 1
- 208000019300 CLIPPERS Diseases 0.000 description 7
- 208000021930 chronic lymphocytic inflammation with pontine perivascular enhancement responsive to steroids Diseases 0.000 description 7
- 230000005856 abnormality Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
- C25D17/08—Supporting racks, i.e. not for suspending
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21319689A JPH02149700A (ja) | 1989-08-18 | 1989-08-18 | めっき用ハンガー検査装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21319689A JPH02149700A (ja) | 1989-08-18 | 1989-08-18 | めっき用ハンガー検査装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02149700A JPH02149700A (ja) | 1990-06-08 |
| JPH0416559B2 true JPH0416559B2 (enrdf_load_stackoverflow) | 1992-03-24 |
Family
ID=16635127
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21319689A Granted JPH02149700A (ja) | 1989-08-18 | 1989-08-18 | めっき用ハンガー検査装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02149700A (enrdf_load_stackoverflow) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4884289B2 (ja) * | 2007-05-02 | 2012-02-29 | 株式会社中央製作所 | 垂直搬送式連続めっき装置における給電グリップの検査装置 |
| KR101005852B1 (ko) * | 2010-08-18 | 2011-01-05 | 경원대학교 산학협력단 | 자동차 휠너트 도금용 자동랙킹장치 |
| KR101237833B1 (ko) * | 2011-10-10 | 2013-02-27 | (주)포인텍 | 연속도금장치의 인쇄회로기판용 통전지그 |
| CN103132127B (zh) * | 2011-12-05 | 2015-05-13 | 华通电脑股份有限公司 | 电镀挂架夹点电流监控装置及其方法 |
| CN114689795B (zh) * | 2022-03-02 | 2025-02-14 | 无锡朋桥信息技术有限公司 | 一种电镀品质检测自动化装置 |
-
1989
- 1989-08-18 JP JP21319689A patent/JPH02149700A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02149700A (ja) | 1990-06-08 |
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