JPH0416559B2 - - Google Patents

Info

Publication number
JPH0416559B2
JPH0416559B2 JP21319689A JP21319689A JPH0416559B2 JP H0416559 B2 JPH0416559 B2 JP H0416559B2 JP 21319689 A JP21319689 A JP 21319689A JP 21319689 A JP21319689 A JP 21319689A JP H0416559 B2 JPH0416559 B2 JP H0416559B2
Authority
JP
Japan
Prior art keywords
hanger
plating
elastic
plating hanger
transfer mechanism
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP21319689A
Other languages
English (en)
Japanese (ja)
Other versions
JPH02149700A (ja
Inventor
Masahiko Inui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chuo Seisakusho KK
Original Assignee
Chuo Seisakusho KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chuo Seisakusho KK filed Critical Chuo Seisakusho KK
Priority to JP21319689A priority Critical patent/JPH02149700A/ja
Publication of JPH02149700A publication Critical patent/JPH02149700A/ja
Publication of JPH0416559B2 publication Critical patent/JPH0416559B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/24Reinforcing the conductive pattern
    • H05K3/241Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06Suspending or supporting devices for articles to be coated
    • C25D17/08Supporting racks, i.e. not for suspending

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP21319689A 1989-08-18 1989-08-18 めっき用ハンガー検査装置 Granted JPH02149700A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21319689A JPH02149700A (ja) 1989-08-18 1989-08-18 めっき用ハンガー検査装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21319689A JPH02149700A (ja) 1989-08-18 1989-08-18 めっき用ハンガー検査装置

Publications (2)

Publication Number Publication Date
JPH02149700A JPH02149700A (ja) 1990-06-08
JPH0416559B2 true JPH0416559B2 (enrdf_load_stackoverflow) 1992-03-24

Family

ID=16635127

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21319689A Granted JPH02149700A (ja) 1989-08-18 1989-08-18 めっき用ハンガー検査装置

Country Status (1)

Country Link
JP (1) JPH02149700A (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4884289B2 (ja) * 2007-05-02 2012-02-29 株式会社中央製作所 垂直搬送式連続めっき装置における給電グリップの検査装置
KR101005852B1 (ko) * 2010-08-18 2011-01-05 경원대학교 산학협력단 자동차 휠너트 도금용 자동랙킹장치
KR101237833B1 (ko) * 2011-10-10 2013-02-27 (주)포인텍 연속도금장치의 인쇄회로기판용 통전지그
CN103132127B (zh) * 2011-12-05 2015-05-13 华通电脑股份有限公司 电镀挂架夹点电流监控装置及其方法
CN114689795B (zh) * 2022-03-02 2025-02-14 无锡朋桥信息技术有限公司 一种电镀品质检测自动化装置

Also Published As

Publication number Publication date
JPH02149700A (ja) 1990-06-08

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