JPH02149696A - Method for controlling plating amount at plate edge in electroplating - Google Patents

Method for controlling plating amount at plate edge in electroplating

Info

Publication number
JPH02149696A
JPH02149696A JP30261688A JP30261688A JPH02149696A JP H02149696 A JPH02149696 A JP H02149696A JP 30261688 A JP30261688 A JP 30261688A JP 30261688 A JP30261688 A JP 30261688A JP H02149696 A JPH02149696 A JP H02149696A
Authority
JP
Japan
Prior art keywords
plating
strip
current
edge
magnetic field
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP30261688A
Other languages
Japanese (ja)
Inventor
Masahiko Uragami
浦上 雅彦
Shuji Iwamoto
岩本 周治
Katsuhiko Doi
土井 克彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JFE Steel Corp
Original Assignee
Kawasaki Steel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kawasaki Steel Corp filed Critical Kawasaki Steel Corp
Priority to JP30261688A priority Critical patent/JPH02149696A/en
Publication of JPH02149696A publication Critical patent/JPH02149696A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To control the plating amt. at the plate edge and to prevent overplating by generating a controllable magnetic field with a plating current at the end of a metallic strip in its cross direction, and exerting force on the outside of the end. CONSTITUTION:A metallic strip 3 is brought into contact with the periphery of a conductor roll 1 with almost the lower half dipped in a plating soln. in a plating tank 2, and synchronously traveled. A plating current is applied through the roll 1 between the strip 3 and the plural anodes 4 arranged away from the strip 3 with a conduction gap in between, and one surface of the strip 3 is plated. In this radial cell-type plating tank 2, an electromagnet 5 is provided to impress a magnetic field vertically to the plating current and in the opposite direction to the plating current. The intensity of the magnetic field is controlled through a coil 6. As a result, an electromagnetic force is exerted on the edge of the strip 3 in its cross direction to prevent the concentration of the current on the edge, and the overplating of the edge is prevented.

Description

【発明の詳細な説明】 〈産業上の利用分野〉 本発明は、電気めっきにおける板エツジ部でのめっき付
着量の制御方法に関する。
DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a method for controlling the amount of plating deposited at the edge of a plate in electroplating.

〈従来の技術〉 従来、金属ストリップ(以下単にストリップという)の
電気めっきにおける板エツジ部のオーバーめっき防止対
策は、エツジマスクと呼ばれる絶縁板により板エツジ部
を覆うことにより、板エツジ部へ集中する電流を制限す
る方法が主である。
<Prior art> Conventionally, the countermeasure for preventing over-plating on the edge of a metal strip (hereinafter simply referred to as a strip) during electroplating is to cover the edge of the plate with an insulating plate called an edge mask, which prevents the current from concentrating on the edge of the plate. The main method is to limit

例えば、ラジアルセル型めっき槽では、特に大電流によ
る高速めつきの際にストリップの両縁部において金属の
まわり込みによる異常付着が発生し易く、このエツジオ
ーバーコートの防止装置として、例えば特公昭60−5
5598号公報に開示されている。
For example, in a radial cell type plating bath, abnormal adhesion is likely to occur due to metal wrapping around both edges of the strip, especially during high-speed plating using a large current. 5
It is disclosed in Japanese Patent No. 5598.

すなわち、一般にラジアルセル型めっき装置は、大径の
通電用回転ドラムをめっき液中に1/2程度浸漬し、ス
トリップを前記回転ドラムの外周に接触させその回転と
同期して走行せる間に、前記ストリップに対して半径方
向の通電ギャップを隔てて設置した陽極との間で前記め
っき液を介して通電を行う電気めっき装置で、片面のみ
をめっきするのに好適であり、また通電ギャップ、すな
わち通板ストリップと陽極面との極間距離を小さくでき
るのでめっき電力の無駄な消費が少くて済み、大電流に
よる高速めっきが可能であるが、特にこのような場合に
エツジオーバーコートの発生を防止するために、前記通
電用回転ドラムの母線方向に平行に進退移動可能なエツ
ジマスクを設け、ストリップの両縁部におけるめっき電
流の集中を回避するようにした。
That is, in general, in a radial cell type plating apparatus, a large-diameter rotating drum for conducting electricity is immersed in about 1/2 of a plating solution, and while the strip is brought into contact with the outer periphery of the rotating drum and runs in synchronization with the rotation of the drum, An electroplating apparatus that conducts current through the plating solution between the strip and an anode installed across a radial current-carrying gap, and is suitable for plating only one side. Since the distance between the threading strip and the anode surface can be reduced, wasteful consumption of plating power is reduced, and high-speed plating with large current is possible, but especially in such cases, the occurrence of edge overcoat can be prevented. In order to do this, an edge mask is provided that can move forward and backward in parallel to the generatrix direction of the current-carrying rotating drum to avoid concentration of plating current at both edges of the strip.

〈発明が解決しようとする課題〉 ところで、上記オーバーめっき防止方式においては、そ
のエツジ部の電流制御は、エツジマスクを板端からどれ
くらいの量かぶせるかによってきまり、その動きは油圧
サーボやサーボモータにより制御されているが、めっき
液中という悪環境下での機成的動作を伴うため、その信
頼性、寿命等に問題があった。
<Problems to be Solved by the Invention> By the way, in the above-mentioned over-plating prevention method, the current control of the edge portion is determined by how much the edge mask is covered from the edge of the plate, and its movement is controlled by a hydraulic servo or a servo motor. However, because it involves mechanical operation in the harsh environment of plating solution, there are problems with its reliability, lifespan, etc.

本発明は、上記の問題を解決して、電磁力によってオー
バーめっきを防止する電気めっきにおける板エツジ部で
のめつき付着量の制御方法を提供することを目的として
いる。
SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems and provide a method for controlling the amount of plating deposited at the edge of a plate in electroplating, which prevents over-plating using electromagnetic force.

く課題を解決するための手段〉 上記目的を達成するために本発明によれば、ラジアルセ
ル型めっき槽において、金属ストリップの幅方向端部に
めっき電流に対して、前記幅方向端部の外方に作用する
力を発生させるよう磁界を発生させ、かつ磁界の強さを
制御して電気めっきすることを特徴とする電気めっきに
おける板エツジ部でのめつき付着量の制御方法が提供さ
れる。
Means for Solving the Problems> In order to achieve the above object, according to the present invention, in a radial cell type plating tank, the plating current is applied to the widthwise end of the metal strip, and the outside of the widthwise end is Provided is a method for controlling the amount of plating deposited on a plate edge portion in electroplating, the method comprising generating a magnetic field to generate a force acting in the direction of the plate, and controlling the strength of the magnetic field to perform electroplating. .

以下に本発明をさらに詳細に説明する。The present invention will be explained in more detail below.

第1図は、本発明の一実施例を示す要部説明図である。FIG. 1 is an explanatory diagram of main parts showing an embodiment of the present invention.

 第1図において通電用ロール1をめっき槽2内のめつ
き液中に1/2程度浸漬し、ストリップ3を前記ロール
1の外周に接触させその回転と同期して走行させる間に
、前記ストリップ3に対して半径方向の通電ギャップを
隔てて板幅の変動に備えて両板端に対応して複数の陽極
4が設置されている。 両板端について同時に説明する
と混乱を招くため、一方の板端すなわち第1図において
手前の板端について説明する。
In FIG. 1, the current-carrying roll 1 is immersed in about 1/2 of the plating solution in the plating bath 2, and while the strip 3 is brought into contact with the outer periphery of the roll 1 and is run in synchronization with its rotation, the strip 3, a plurality of anodes 4 are installed at both ends of the plate, with a radial conduction gap in between, in preparation for variations in the plate width. Since it would be confusing to explain both ends of the board at the same time, only one end of the board, that is, the end nearer in FIG. 1 will be described.

このようなラジアルセル型めっき装置において、ストリ
ップ3のエツジ部に対して、エツジ部の電流にエツジ部
から遠ざかる方向に力を与えれば、エツジ部において不
要の電流のまわりこみによる電流集中がエツジ部には生
じなくなる。 このようにするためには通板方向とは反
対方向の磁界を発生させるように、陽極4の反ストリツ
プ側に電磁石5を設ける。 すなわち、めっき電流の方
向に対して磁界がめつき液の流れる方向とは逆の垂直方
向になるようにすれば、フレミングの左手の法則により
めっき液の流れに対し板幅のエツジ方向すなわち第1図
で見て手前の方向に電磁力が作用し、エツジ側における
めっき電流のルートを手前側に変化させる。 したがっ
て、手前のエツジ部への電流集中が生じなくなって、オ
ーバーコートが防止される。
In such a radial cell type plating apparatus, if a force is applied to the edge part of the strip 3 in the direction away from the edge part, current concentration due to unnecessary current flowing around the edge part can be prevented. will no longer occur. In order to do this, an electromagnet 5 is provided on the side opposite to the strip of the anode 4 so as to generate a magnetic field in the direction opposite to the direction of the strip. In other words, if the magnetic field is set perpendicular to the direction of the plating current, which is opposite to the flow direction of the plating solution, Fleming's left-hand rule will cause the plating solution to flow in the direction of the edge of the plate width, i.e., as shown in Figure 1. An electromagnetic force acts in the direction toward the front when viewed from , changing the route of the plating current on the edge side toward the front. Therefore, current concentration on the front edge portion does not occur, and overcoating is prevented.

そこで、この電磁力は磁界の強さに比例するから、例え
ば電磁石によって静磁場を発生させる場合は、電磁石に
流す電流を変化させることで容易に電磁力を制御するこ
とが可能となる。
Since this electromagnetic force is proportional to the strength of the magnetic field, for example, when a static magnetic field is generated by an electromagnet, the electromagnetic force can be easily controlled by changing the current flowing through the electromagnet.

つぎに、上記本発明の原理に基づく板エツジ部でのめフ
ぎ付着量の制御方法を説明する。
Next, a method for controlling the amount of glue deposited on the edge portion of the plate based on the principle of the present invention will be explained.

第2図はストリップの一方の板端のエツジオーバーコー
トを防止する本発明の一実施例を示す制御ブロック図で
ある。 通板するストリップ3の板幅の変化に対応する
ためロール1の胴長方向の前記一方の板端に複数個の電
磁石5をストリップの板幅の変化に対応できるよう配置
しておく。 6は各電磁石5のコイルを示す。
FIG. 2 is a control block diagram illustrating one embodiment of the present invention for preventing edge overcoat on one end of a strip. In order to cope with the change in the width of the strip 3 to be passed, a plurality of electromagnets 5 are arranged at the one end of the roll 1 in the longitudinal direction of the roll 1 so as to be able to cope with the change in the width of the strip. 6 indicates a coil of each electromagnet 5.

予め、めっき付着量の基準値をコイル電流演算装置7に
設定しておき、ここでめりき付着量計8で測定された上
記一方の板エツジ部のめっき付着量が前記基準値に一致
するようコイル電流を演算し、直流電源装置9に対して
電流指令を与える。 直流電源装置9は、コイル電流演
算装置7からの電流指令に従った直流電流をコイル切替
装置10に出力する。 コイル切替装置10は、板端位
置検出装置11からの信号に基づき最も板端に近いコイ
ル6に電流を流すようコイル切替制御装置12により電
流を流すコイル6を選定して前記直流電流を流す。
A reference value for the amount of plating deposited is set in the coil current calculation device 7 in advance, and the amount of plating deposited on one of the plate edges measured by the plating amount meter 8 is set to match the reference value. The coil current is calculated and a current command is given to the DC power supply device 9. The DC power supply device 9 outputs a DC current according to the current command from the coil current calculation device 7 to the coil switching device 10 . The coil switching device 10 selects the coil 6 through which the current is to be applied by the coil switching control device 12 so that the current is applied to the coil 6 closest to the sheet end based on the signal from the sheet end position detection device 11, and causes the DC current to flow therethrough.

このようにして、ストリップ3の板幅の変化およびエツ
ジ部のめっき付着量に応じて適正なめっき付着量による
よう制御される。
In this way, the amount of plating deposited is controlled to be appropriate depending on the change in the width of the strip 3 and the amount of plating deposited on the edge portion.

なお、磁界内、D構造材、ロール1、ノズルおよび付帯
部品(,4示せず)等はすべて非磁性材料とする。
In addition, the inside of the magnetic field, the D structural material, the roll 1, the nozzle, the accessory parts (4 not shown), etc. are all made of non-magnetic materials.

〈実施例〉 以下に本発明を実施例に基づき具体的に説明する。<Example> The present invention will be specifically explained below based on Examples.

(実施例1) 第1図に示すめっき装置を用いて厚さ1.6mm、幅1
200mmの帯鋼を硫酸亜鉛系のめっき液を用い、めっ
き液流速1000mm/sec、電流密度200 A 
/ d m 2でZnめっきした。 このとき、第2図
に示す制御ブロックに従いエツジオーバーコートを防止
するよう制御した。 めっき付着量計5によるエツジ部
のめっき付着量は10秒毎に測定し、電磁石のコイルに
18OAの電流を流した。
(Example 1) Using the plating equipment shown in Fig. 1, a plating film with a thickness of 1.6 mm and a width of 1
A 200 mm steel strip was plated using a zinc sulfate-based plating solution at a plating solution flow rate of 1000 mm/sec and a current density of 200 A.
/dm2 Zn plated. At this time, control was performed to prevent edge overcoat according to the control block shown in FIG. The amount of plating on the edge portion was measured every 10 seconds using a plating amount meter 5, and a current of 18 OA was passed through the electromagnetic coil.

得られた亜鉛めっき鋼板は、エツジ部においてオーバー
コートを実質的に発生することなく基準として設定した
めっき厚を維持することができた。
The obtained galvanized steel sheet was able to maintain the plating thickness set as a standard without substantially generating an overcoat at the edge portion.

一方、電磁石のコイルへの制御電流を停止したところ、
エツジ部に35%のオーバーコートが生じた。
On the other hand, when the control current to the electromagnet coil was stopped,
A 35% overcoat occurred on the edges.

〈発明の効果〉 本発明は、以上説明したように構成されているので、電
磁力によりエツジ部のオーバーめっきを防止することが
できる。
<Effects of the Invention> Since the present invention is configured as described above, over-plating of the edge portion can be prevented by electromagnetic force.

また、エツジ部でのめっき付着量の制御は、静磁場を発
生させる電fin力の電流を制御することで容易に行う
ことができ、機成的動作を伴わないため、信頼性の向上
と寿命の大幅な延長ができるという効果を奏する。
In addition, the amount of plating deposited on the edges can be easily controlled by controlling the current of the electric fin force that generates the static magnetic field, and since no mechanical movement is involved, reliability and service life can be improved. This has the effect of significantly extending the length of time.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、ラジアルセル型めっき槽における本発明の一
実施例を示す要部断面説明図である。 第2図は、ストリップの一方の板端のエツジオーバーコ
ートを防止する本発明の一実施例を示す制御ブロック図
である。 符号の説明 1 ・・・ ロ − ル 、 2・・・めりき槽、 3・・・ストリップ、 4・・・陽極、 5・・・電磁石、 6・・・コイル、 7・・・コイル電流演算装置、 8・・・めっき付着量計、 9・・・直流電源装置、 10・・・コイル切替装置、 11・・・板端位置検出装置、 12・・・コイル切替制御装置
FIG. 1 is an explanatory cross-sectional view of essential parts showing an embodiment of the present invention in a radial cell type plating tank. FIG. 2 is a control block diagram illustrating one embodiment of the present invention for preventing edge overcoating on one end of a strip. Explanation of symbols 1...Roll, 2...Melt tank, 3...Strip, 4...Anode, 5...Electromagnet, 6...Coil, 7...Coil current calculation Apparatus, 8... Plating coating weight meter, 9... DC power supply device, 10... Coil switching device, 11... Board edge position detection device, 12... Coil switching control device

Claims (1)

【特許請求の範囲】[Claims] (1)ラジアルセル型めっき槽において、金属ストリッ
プの幅方向端部にめっき電流に対して、前記幅方向端部
の外方に作用する力を発生させるよう磁界を発生させ、
かつ磁界の強さを制御して電気めっきすることを特徴と
する電気めっきにおける板エッジ部でのめっき付着量の
制御方法。
(1) In a radial cell type plating bath, a magnetic field is generated at the widthwise ends of the metal strip so as to generate a force acting outward from the widthwise ends with respect to the plating current,
A method for controlling the amount of plating deposited on a plate edge portion in electroplating, characterized in that electroplating is performed by controlling the strength of a magnetic field.
JP30261688A 1988-11-30 1988-11-30 Method for controlling plating amount at plate edge in electroplating Pending JPH02149696A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP30261688A JPH02149696A (en) 1988-11-30 1988-11-30 Method for controlling plating amount at plate edge in electroplating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30261688A JPH02149696A (en) 1988-11-30 1988-11-30 Method for controlling plating amount at plate edge in electroplating

Publications (1)

Publication Number Publication Date
JPH02149696A true JPH02149696A (en) 1990-06-08

Family

ID=17911127

Family Applications (1)

Application Number Title Priority Date Filing Date
JP30261688A Pending JPH02149696A (en) 1988-11-30 1988-11-30 Method for controlling plating amount at plate edge in electroplating

Country Status (1)

Country Link
JP (1) JPH02149696A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100428576B1 (en) * 1999-12-24 2004-04-28 주식회사 포스코 Anode for strip plating
JP2005527705A (en) * 2002-05-27 2005-09-15 コンカスト アクチェンゲゼルシャフト Method for electrolytic coating of continuous casting mold
KR101142485B1 (en) * 2004-12-22 2012-05-07 주식회사 포스코 System for preventing excessive plating for edge of strip

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100428576B1 (en) * 1999-12-24 2004-04-28 주식회사 포스코 Anode for strip plating
JP2005527705A (en) * 2002-05-27 2005-09-15 コンカスト アクチェンゲゼルシャフト Method for electrolytic coating of continuous casting mold
KR101142485B1 (en) * 2004-12-22 2012-05-07 주식회사 포스코 System for preventing excessive plating for edge of strip

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