KR100428576B1 - Anode for strip plating - Google Patents

Abstract

The present invention relates to an apparatus for equalizing the plating thickness to be plated on the plated material in electroplating. Particularly, the surface of the insoluble anode is curved to prevent overplating of the edge of the plated material to obtain a uniform plating thickness. It relates to an insoluble anode which eliminates the plating deviation of the strip.

The present invention relates to an apparatus for equalizing the plating thickness to be plated on a plated material in an electroplating process, wherein the edges of the plated material are transiently curbed by curving both edge portions of the anode to suppress currents concentrated on the edge portions of the plated material. An insoluble anode which eliminates the plating deviation of the strip, characterized in that it is configured to suppress gold.

According to the present invention, by uniformizing the distribution of the current concentrated in the edge portion of the plated material, a useful effect of suppressing the overplating of the edge portion of the plated material and obtaining a uniform plating thickness in the plated material is obtained and the quality of the plated product is obtained. This can greatly improve.

Description

Insoluble anode to eliminate plating deviation of strips {ANODE FOR STRIP PLATING}

The present invention relates to an apparatus for equalizing the plating thickness to be plated on the plated material in electroplating. Particularly, the surface of the insoluble anode is curved to prevent overplating of the edge of the plated material to obtain a uniform plating thickness. It relates to an insoluble anode which eliminates the plating deviation of the strip.

In general, in the method of plating the plated material by using the electroplating method, as shown in FIG. 8, current is concentrated in the edge portion 110 of the plated material 100 facing the anode 105. As a result, the edge portion 110 of the plated material 100 is excessively plated with the thickness of the edge portion 110, which is excessive compared to the center portion.

Due to the phenomenon of the over-plating of the edge portion 120, the plating deviation in the width direction of the plated material 100 is generated, which causes a problem that it is difficult to realize thin plating. In addition, since the resistance varies in the width direction of the plated material 100 due to the plating deviation, a problem occurs during the resistance welding, and when the strip-shaped plated material 100 is wound in the form of a coil, the plated material is coated by the thickness deviation. Deformation of the ash 100 occurs and problems such as appearance defects occur.

Accordingly, the non-conductor (not shown) is inserted between the anode 105 and the plated material 100 by a conventional method for suppressing the edge portion overplating 120 to obtain a uniform plating thickness. There is a method of blocking the current concentrated in the edge portion 110 of the (100).

However, as described above, the edge mask method of blocking the current concentrated in the edge portion 110 of the plated material 100 by placing a non-conductor between the anode 105 and the plated material 100 is disclosed in Japanese Patent Application Laid-Open No. 60 -162795, which is a method of obtaining a uniform plating thickness in the plated material 100 by maintaining the position of the edge mask to be a constant distance with respect to the edge of the plated material 100.

Therefore, the edge mask method as described above has a structure in which the edge mask is inserted between the anode 105 and the plated material 100, so that the edge mask is shaken in the plating solution and collides with the plated material 100. As a result, problems such as deterioration in plating quality and damage to the edge mask occur.

In addition, since the distance between the anode 105 and the plated material 100 increases by the thickness of the edge mask to be inserted, there is a problem that the power loss required for plating increases.

The present invention is to solve the above conventional problems, to prevent the over-plating phenomenon of the edge of the plated material to obtain a uniform plating thickness to solve the plating deviation of the improved strip to greatly improve the quality of the plated product The purpose is to provide an insoluble anode.

1 is an overall configuration diagram showing an insoluble anode to eliminate the plating deviation of the strip according to the present invention;

2 is a cross-sectional view along the line B-B in FIG.

3 is a cross-sectional view along line C-C in FIG. 1;

4 is a cross-sectional view along the line D-D in FIG. 2;

5 is a cross-sectional view of the upper guide to which the anode of the present invention is mounted;

6 is an exploded perspective view of an insoluble anode to eliminate the plating deviation of the strip according to the present invention;

7 is an explanatory view showing an equipotential surface inside the plating bath by the anode according to the present invention;

8 is an explanatory view showing an equipotential surface inside a plating bath by an anode according to the prior art;

9 is a graph showing the amount of plating adhesion according to the distance from the plated material edge in the present invention and the comparative example.

Explanation of symbols on the main parts of the drawings

10a, 10b, 10c ... Anode 15 ..... Curved

20 ..... Transport 30 ..... Upper guide

32 ..... Lower guide 33 ..... Long through hole

34 ..... step 36 ..... incision

100 ... plate material 105 ... anode

110 ... edge 120 ... edge overplated

In order to achieve the above object, the present invention is configured to suppress the over plating of the edge portion of the plated material by curving both edges of the anode in the electroplating process to suppress the current concentrated on the edge portion of the plated material, In the apparatus for equalizing the plating thickness to be plated on the plated material, The anode is a three-segment anode that can be moved along the upper and lower guides and the anode moving device is attached to the top and side, respectively, The center anode has a tapered shape with a wide top and a narrow bottom. The two side anodes are in contact with both sides of the center anode with the same inclination angle, and the opposite sides have a structure having a straight surface, so that they When combined, insoluble to solve the plating deviation of the strip, characterized in that configured as a whole to form a rectangular structure It depends on the node maryeonham.

Hereinafter, the present invention will be described in more detail with reference to the drawings.

1, 4 and 6, the insoluble anode to eliminate the plating deviation of the strip according to the present invention, has a three-part structure, both sides of the side anode (10b) (10c) in the electroplating process The edge portion 110 is curved to suppress the current concentrated in the edge portion 110 of the plated material 100, thereby suppressing overplating of the edge portion 110 of the plated material 100.

That is, the structure of the conventional anode 105 has a rectangular cross section as shown in FIG. In this case, the current is concentrated in the edge portion 110 of the plated material 100. However, in the present invention, the current is concentrated on the edge portion 110 of the plated material 100 by rounding the edge portion 110 of the side anodes 10b and 10c as shown in FIG. 7. To alleviate

To this end, in the present invention, anodes 10a, 10b, and 10c are installed at the center and both sides of the plated material 100, and the anodes 10a, 10b, and 10c are upper and side surfaces. The anode moving device 20 is attached to each of the three split anodes so that they can be moved along the upper and lower guides 30 and 32.

That is, the center anode 10a has a tapered shape with a wide top and a narrow bottom, and both side anodes 10b and 10c are in contact with both sides of the center anode 10a as the same inclination angle, respectively. The opposite side has a structure that each has a straight surface so that when they are combined with each other, as shown in FIG.

On the other hand, the edges at which the center anode 10a and the side anodes 10b and 10c contact each other also have opposite sides of the side anodes 10b and 10c, respectively, as shown by a dotted line in FIG. 6. It may be curved 15 as shown.

By applying such a curved surface treatment 15, the potential distribution can be weakened here as well. The anodes 10a, 10b, and 10c are inserted into the upper anode guide 30 and the lower anode guide 32 to move horizontally and vertically.

As illustrated in FIG. 5, the upper guide 30 on which the anodes 10a, 10b, and 10c are mounted has a long through hole 33 to which the anodes 10a, 10b, and 10c are fitted. ) Is formed, and a step 34 is formed therein to prevent the upper jaw 40 of the anodes 10a, 10b, 10c from engaging and falling down through the through-hole 33 and falling down. On both sides of the long hole 33 is to form a cut-out portion 36 in which the transfer devices 20 of the side anodes 10b and 10c are located, respectively.

In addition, since the anode transport apparatus 20 may have a known structure using, for example, a screw jack (not shown) or a rack and a pinion mechanism (not shown), a detailed description thereof will be omitted herein. .

When the both sides of the anode (10b) (10c) is moved in the left and right directions in accordance with the width of the plated material 100, the center anode (10a) is moved up and down by the upper moving device 20 to adjust the width By enabling this, there is no current unevenness inside the to-be-plated material 100.

Hereinafter, the present invention will be described in more detail with reference to Examples.

(Example)

As an embodiment according to the present invention, when the width of the plated material 100 is 1000 mm and the distance between the anodes 10a, 10b, 10c and the plated material 100 is 20 mm, the anode 10a ( FIG. 7 illustrates a case where the widths of 10b) and 10c are set to 1000 mm and the curved surfaces 15 are treated so that the edge portions of the anodes 10b and 10c have a radius of curvature of 25 mm. As a comparative example of the present invention, the width of the plated material 100 is 1000 mm, and the distance between the anode 105 and the plated material 100 is 20 mm, and the width of the anode 105 in the same plating bath as in the embodiment. The case of the anode 105 having a square cross section of 1000 mm is shown in FIG.

In the present embodiment, as shown in FIG. 7, the equipotential surface is biased toward the anodes 10b and 10c as compared to the equipotential surface of FIG. Able to know. The plating thickness according to this embodiment is shown in FIG.

In the comparative example, the plated material 100 showed an effect of 10% or more as 16% in the case of the embodiment according to the present invention, while the overplating rate in the edge portion 110 was 27%. The experimental results are shown in Table 1 below.

division Comparative example Example Plate Material Width (Steel Plate Width) 1000 mm 1000 mm Distance between anode and plated material 20 mm 20 mm Anode Width 1000 mm 1000 mm Rounding amount Radius = 0 Radius = 25mm Over-plating rate 27% 16% Overplated part length (distance from plated edge) 40 mm 20 mm

As described above, according to the present invention, by uniformly distributing the current concentrated in the edge portion 110 of the plated material 100, overplating of the edge portion 110 of the plated material 100 is suppressed and the plated material is plated. A useful effect of obtaining a uniform plating thickness in the ash 100 can be obtained and the quality of the plated product can be greatly improved.

Claims (4)

In the electroplating process, the edges 110 of the anode 100 are cured by suppressing a current concentrated in the edge portion 110 of the to-be-plated material 100. In the apparatus configured to suppress the over plating, and to equalize the plating thickness to be plated on the plated material 100, The anode is a three-segment anode (10a) (10b) (10c) that is attached to the anode moving device 20 and can be moved along the upper and lower guides (30) and (32) respectively. The center anode 10a has a tapered shape with a wide top and a narrow bottom, and both side anodes 10b and 10c are in contact with both sides of the center anode 10a as the same inclination angle, respectively. Insoluble anodes to eliminate the plating deviation of the strip, characterized in that the opposite side has a structure having a straight surface, respectively, when they are combined with each other, to form a generally rectangular structure. delete According to claim 1, wherein the edges in which the center anode (10a) and the side anode (10b) (10c) is in contact with both sides of the curved surface (like the opposite edge portion of the side anode (10b) (10c), respectively ( 15) An insoluble anode which eliminates the plating deviation of the strip, characterized in that. According to claim 1, wherein the upper guide 30 is formed with a long through hole 33 so that the anode (10a) (10b) (10c) is fitted up and down, successive to the through hole 33, the anode Steps 34 are formed therein to prevent the upper jaw 40 of the (10a), 10b, and 10c from being caught and dropped to the bottom, and the side anodes 10b (10b) on both sides of the elongated hole 33 ( An insoluble anode for eliminating the plating deviation of the strip, characterized in that each forming a cut 36 in which the transfer devices 20 of 10c are located.