JPH08239796A - Edge mask for electroplating and electroplating method - Google Patents
Edge mask for electroplating and electroplating methodInfo
- Publication number
- JPH08239796A JPH08239796A JP4156695A JP4156695A JPH08239796A JP H08239796 A JPH08239796 A JP H08239796A JP 4156695 A JP4156695 A JP 4156695A JP 4156695 A JP4156695 A JP 4156695A JP H08239796 A JPH08239796 A JP H08239796A
- Authority
- JP
- Japan
- Prior art keywords
- edge
- plated
- electroplating
- mask device
- edge mask
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、鋼板などの被めっき部
の表面に連続的に電気めっきを施す連続電気めっき装置
において、被めっき部の端部のエッジオーバーコートを
防止するためのエッジマスク装置及びそれを用いた電気
めっき法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a continuous electroplating apparatus for continuously electroplating a surface of a portion to be plated such as a steel plate, and an edge mask for preventing an edge overcoat at the end of the portion to be plated. The present invention relates to an apparatus and an electroplating method using the apparatus.
【０００２】[0002]
【従来の技術】鋼板のような被めっき部を連続電気めっ
きするための装置として、垂直型および水平型の電気め
っき装置が知られている。いずれの装置もめっき槽内を
走行する被めっき部の表面に対向させて電極板を設け、
槽内を通過する間に被めっき部に連続的にめっきを行う
ものである。しかし、被めっき部のエッジ部に電流が集
中しこの部分のめっき付着量が過剰になる。このように
エッジ部にオーバーコートが生じると、被めっき部をコ
イル状に巻いた場合に、エッジ部が盛り上がるビルトア
ップ現象が生じ、オーバーコート部分のめっき皮膜同士
がすれ合って傷が発生したり、溶接時におけるオーバー
コート部分の溶接強度不良や、オーバーコート部の変色
による外観不良を招くなどの問題が生じる。2. Description of the Related Art Vertical and horizontal electroplating apparatuses are known as apparatuses for continuously electroplating a plated portion such as a steel plate. In either device, an electrode plate is provided facing the surface of the part to be plated that runs in the plating tank,
The portion to be plated is continuously plated while passing through the bath. However, the current concentrates on the edge portion of the plated portion, and the amount of plating adhered on this portion becomes excessive. When the overcoat is generated on the edge part in this way, when the plated part is wound in a coil, a build-up phenomenon occurs in which the edge part rises, and the plating films of the overcoat part rub against each other to cause scratches. However, problems such as poor welding strength of the overcoat portion during welding and poor appearance due to discoloration of the overcoat portion occur.
【０００３】この現象を防ぐために、従来、図４に示す
ように、上部電極板１ａおよび下部電極板１ｂから所定
間隔をあけて、被めっき部２のエッジ部３ａ，３ｂに向
けた「く」字状のエッジマスク装置４ａ，４ｂを配置
し、このエッジマスク装置によってエッジ部３ａ，３ｂ
へのめっき電流を物理的に遮蔽する方法がある（例え
ば、特公昭５２−１３０４３５号公報）。しかし、この
方法が十分な効果を発揮するためにはエッジマスクを被
めっき部のごく近くに配置しなければならないため、被
めっき部の蛇行などによりエッジマスクが破損する可能
性が生じる。In order to prevent this phenomenon, conventionally, as shown in FIG. 4, a "ku" is directed toward the edge portions 3a, 3b of the plated portion 2 at a predetermined distance from the upper electrode plate 1a and the lower electrode plate 1b. The character-shaped edge mask devices 4a and 4b are arranged, and the edge portions 3a and 3b are arranged by this edge mask device.
There is a method of physically shielding the plating current to the metal (for example, Japanese Patent Publication No. 52-130435). However, in order for this method to exert a sufficient effect, the edge mask must be arranged very close to the portion to be plated, so that the edge mask may be damaged due to meandering of the portion to be plated.
【０００４】また、その他の方法に補助電極を用いる方
法がある。この方法は電気めっき槽内を移動中の被めっ
き部の両エッジ部に近接して補助電極板（陰極）を配置
し、主電極板と補助陰極板との間にも電圧を印加するこ
とにより被めっき部の両エッジ部に集中していた電流を
補助陰極板に分流させることによりオーバーコートを防
止している（例えば、特公平４−１１６３８号公報）。
しかし、この方法では補助陰極にめっきが付着してしま
うため十分な方法とはいえない。また、磁束型エッジマ
スク装置を用いて、電磁気的な力によりエッジ部への電
流の集中を防止する方法も提案されている（特公平４−
３４６３４号公報）。Another method is to use an auxiliary electrode. This method places an auxiliary electrode plate (cathode) close to both edges of the part to be plated that is moving in the electroplating bath, and applies a voltage between the main electrode plate and the auxiliary cathode plate. Overcoating is prevented by diverting the current concentrated on both edges of the plated portion to the auxiliary cathode plate (for example, Japanese Patent Publication No. 4-116638).
However, this method cannot be said to be a sufficient method because the plating adheres to the auxiliary cathode. In addition, a method of preventing current concentration on the edge portion by an electromagnetic force using a magnetic flux type edge mask device has also been proposed (Japanese Patent Publication No.
34634).
【０００５】[0005]
【発明が解決しようとする課題】実際の連続電気めっき
装置における被めっき部は、特に被めっき部の厚さが薄
いときには電極と平行ではなく、「Ｃ反り」と言われる
ように被めっき部の自重で曲がっている。このような現
象があると、従来の技術では被めっき部の電極に近い側
に電流が集中しエッジオーバーコートが生じてしまう。
従って、エッジオーバーコートを完全に防止することが
出来ない。従って、本発明の目的は被めっき部の「Ｃ反
り」が原因で生じるエッジオーバーコートをも防止でき
るようにした連続電気めっき装置のエッジマスク装置お
よび電気めっき方法を提供することである。The part to be plated in an actual continuous electroplating apparatus is not parallel to the electrodes, especially when the thickness of the part to be plated is thin, and the part to be plated is called "C warp". It bends under its own weight. If such a phenomenon occurs, in the conventional technique, the current is concentrated on the side of the plated portion near the electrode, and the edge overcoat occurs.
Therefore, the edge overcoat cannot be completely prevented. Therefore, an object of the present invention is to provide an edge mask device and an electroplating method for a continuous electroplating device capable of preventing an edge overcoat caused by "C warpage" of a plated portion.
【０００６】[0006]
【課題を解決するための手段】上記課題を解決するた
め、本発明の電気めっき用エッジマスク装置は絶縁体か
らなる電気めっき用エッジマスク装置において、被めっ
き部の対面側の一部に補助用陽極電極を有するエッジマ
スク装置で、補助用陽極電極部分が、対面する被めっき
部と平行であり、不溶性電極であり、及びめっき進行方
向に連続または不連続に配置されていることを特徴とし
ている。また、電気めっき方法は、絶縁体からなるエッ
ジマスク装置を用いながら電気めっきする方法におい
て、被めっき部に対面する部分の当該エッジマスク装置
の一部に補助用陽極電極を配置し、当該エッジマスク装
置の先端を被めっき部エッジ部より被めっき部幅方向に
内側制御し、及び補助用陽極電極を被めっき部エッジ部
より被めっき部幅方向内側に制御することを特徴として
いる。In order to solve the above-mentioned problems, the electroplating edge mask device of the present invention is an electroplating edge mask device comprising an insulator, and is used as an auxiliary member on a part of the opposite side of a plated portion. An edge mask device having an anode electrode, characterized in that an auxiliary anode electrode portion is parallel to a facing portion to be plated, is an insoluble electrode, and is arranged continuously or discontinuously in a plating proceeding direction. . Further, the electroplating method is a method of electroplating while using an edge mask device made of an insulator, in which an auxiliary anode electrode is arranged in a part of the edge mask device in a portion facing a plated portion, It is characterized in that the tip of the device is controlled inward from the edge portion of the plated portion in the width direction of the plated portion, and the auxiliary anode electrode is controlled inward of the edge portion of the plated portion in the width direction of the plated portion.
【０００７】[0007]
【作用】図１は本発明の連続電気めっき装置でエッジマ
スク装置を用いた場合の概略図である。上部電極板１ａ
および下部電極板２ｂから所定間隔をあけて、被めっき
部２のエッジ部３ａ，３ｂに向けた「コ」字状のエッジ
マスク４ａ，４ｂを配置し、このエッジマスク装置によ
ってエッジ部３ａ，３ｂへのめっき電流を物理的に遮蔽
している。この発明では、補助用陽極電極５から電流を
印加しない場合、エッジマスクの先端を被めっき部の端
部より内側に配置しているので、被めっき部エッジ部へ
の電流の流れを遮蔽し、エッジ部への付着を防止する。
その状態で、補助用陽極電極５から、電流を被めっき部
のエッジ部に流すことにより、主電極からの電流とは別
にエッジ部のみに付着させ、全体として被めっき部の付
着量を均一化する。FIG. 1 is a schematic view when an edge mask device is used in the continuous electroplating device of the present invention. Upper electrode plate 1a
And the "U" -shaped edge masks 4a, 4b facing the edge portions 3a, 3b of the plated portion 2 are arranged at a predetermined distance from the lower electrode plate 2b, and the edge portions 3a, 3b are arranged by this edge mask device. It physically shields the plating current to. In this invention, when the current is not applied from the auxiliary anode electrode 5, the tip of the edge mask is arranged inside the end of the plated portion, so that the current flow to the edge of the plated portion is shielded, Prevents adhesion to the edge.
In that state, a current is passed from the auxiliary anode electrode 5 to the edge of the plated portion so that it is attached only to the edge separately from the current from the main electrode, and the amount of deposition on the plated portion is made uniform as a whole. To do.
【０００８】また、補助電極の電流量を自由に変化させ
ることが出来るので、被めっき部の「Ｃ反り」があって
も、エッジ部が補助電極に近い方の電流量を低く、エッ
ジ部が補助電極から離れている方の電流量を高く制御す
ることにより、「Ｃ反り」に起因するエッジオーバーコ
ートを防止できる。また、補助電極が対面する被めっき
部と平行でないと、上述したような制御が困難となっ
て、エッジオーバーコートを防止できないので、補助電
極は対面する被めっき部と平行である必要がある。Further, since the current amount of the auxiliary electrode can be freely changed, even if there is "C warpage" of the plated portion, the current amount of the edge portion near the auxiliary electrode is low and the edge portion is By controlling the amount of current in the side away from the auxiliary electrode to be high, it is possible to prevent the edge overcoat due to the “C warp”. Further, if the auxiliary electrode is not parallel to the facing plated portion, the above control becomes difficult and the edge overcoat cannot be prevented. Therefore, the auxiliary electrode needs to be parallel to the facing plated portion.
【０００９】また、補助電極が不溶性電極を用いること
により、めっき中に電極の形が変化しないので、エッジ
マスク装置の位置の制御を簡単にすることが出来、また
この電極を交換する必要もない。また、本エッジマスク
装置を用いためっき方法では、補助用陽極電極を被めっ
き部より被めっき部幅方向内側に制御するが、これは、
内側に制御しないと被めっき部端部はエッジマスク装置
を用いない場合の電気めっきと同じ条件となりエッジオ
ーバーコートを生じるからである。Further, since the auxiliary electrode is an insoluble electrode, the shape of the electrode does not change during plating, so that the position control of the edge mask device can be simplified and it is not necessary to replace the electrode. . Further, in the plating method using the present edge mask device, the auxiliary anode electrode is controlled to the inner side in the width direction of the plated portion from the plated portion.
This is because if the inner side is not controlled, the end of the plated portion will have the same condition as the electroplating when the edge mask device is not used and edge overcoat will occur.
【００１０】[0010]
【実施例】この発明を実施例により説明する。図１に示
したような電気めっき装置で、そのエッジマスク装置を
図２に示す。エッジマスク装置の全体の高さｈ＝２８ｍ
ｍ、エッジマスク装置の間隔ｈ1 ＝２０ｍｍ、エッジマ
スク装置の幅ｔ＝８０ｍｍ、エッジマスク装置先端と付
け根間の距離ｔ1 ＝６０ｍｍ、エッジマスク装置の長さ
１＝１５００ｍｍ、エッジマスク装置先端と補助用陽極
電極との距離ａ＝２０ｍｍ、補助用陽極電極の幅ｂ＝１
０ｍｍとし、主電極間距離を３０ｍｍ、主電極の長さ１
５００ｍｍ（＝１）の装置で板厚０．５ｍｍ、幅１００
０ｍｍの鋼板を用いて電気亜鉛めっきを施した。エッジ
マスク装置の先端の位置は鋼板の端部より内側に４０ｍ
ｍの位置に制御した。通電した電流密度は主電極で２０
０Ａ／ｄｍ2 とした。鋼板は薄いため板の幅方向に「Ｃ
反り」を起こしており、「Ｃ反り」の程度は板の端部と
中央部で１０ｍｍあった。そこで補助用陽極電極の電流
密度は鋼板から近い側で１５０Ａ／ｄｍ2 、鋼板から遠
い側で１３０Ａ／ｄｍ2 とした。その結果、鋼板の端部
のエッジオーバーコートを解消することが出来た。EXAMPLES The present invention will be described with reference to examples. FIG. 2 shows an edge mask device of the electroplating apparatus as shown in FIG. Overall height of edge mask device h = 28m
m, the interval between the edge mask devices h 1 = 20 mm, the width of the edge mask device t = 80 mm, the distance between the tip of the edge mask device and the base t 1 = 60 mm, the length of the edge mask device 1 = 1500 mm, the edge mask device tip Distance a = 20 mm from the auxiliary anode electrode, width b = 1 of the auxiliary anode electrode
0 mm, main electrode distance 30 mm, main electrode length 1
With a device of 500 mm (= 1), a plate thickness of 0.5 mm and a width of 100
Electrogalvanization was performed using a 0 mm steel plate. The position of the tip of the edge mask device is 40 m inside the edge of the steel plate.
Controlled to the m position. The applied current density is 20 at the main electrode.
It was set to 0 A / dm 2 . Since the steel plate is thin, "C
"War" was caused, and the degree of "C warp" was 10 mm at the end and center of the plate. Therefore, the current density of the auxiliary anode electrode was set to 150 A / dm 2 on the side closer to the steel sheet and 130 A / dm 2 on the side farther from the steel sheet. As a result, it was possible to eliminate the edge overcoat on the edges of the steel sheet.
【００１１】また、エッジマスク装置として図３に示す
形も別に実施した。このエッジマスク装置では、ｈ，ｈ
1 ，ｔ，ｔ1 ，ｌ，ａ，ｂは図２のエッジマスク装置と
同じ値で、このエッジマスク装置は補助用陽極電極が長
手方向に分離されていて、それぞれの補助用陽極電極の
長さがｄ＝２００ｍｍで、補助用陽極電極の間隔ｋ＝３
００ｍｍとした。この電極間部分はセラミックコーテン
グを施した。通電した電流密度は主電極で２００Ａ／ｄ
ｍ2 で電気めっきを施した。上述したのと同じように鋼
板は板の幅方向に「Ｃ反り」を起こしており、「Ｃ反
り」は板の端部と中央部で１０ｍｍあった。そこで補助
用陽極電極の電流密度は板の近い方で２５０Ａ／ｄｍ
2 、板が遠い方で２００Ａ／ｄｍ2 で電気亜鉛めっきを
施した。その結果、鋼板の端部のエッジオーバーコート
は解消した。The edge mask device shown in FIG. 3 was also implemented separately. In this edge mask device, h, h
1 , t, t 1 , l, a, and b have the same values as those of the edge mask device of FIG. 2, and in this edge mask device, the auxiliary anode electrodes are separated in the longitudinal direction, and the length of each auxiliary anode electrode is increased. Is d = 200 mm, the distance between the auxiliary anode electrodes is k = 3
It was set to 00 mm. Ceramic coating was applied to the portion between the electrodes. The applied current density is 200 A / d at the main electrode
It was electroplated at m 2 . As described above, the steel sheet had a "C warp" in the width direction of the plate, and the "C warp" was 10 mm at the end and center of the plate. Therefore, the current density of the auxiliary anode electrode is 250 A / dm near the plate.
2. Electroplating was performed at 200 A / dm 2 on the side far from the plate. As a result, the edge overcoat on the edge of the steel sheet was eliminated.
【００１２】[0012]
【発明の効果】以上のように、この発明によれば、連続
電気めっき設備において被めっき部の端部のエッジオー
バーコートを防止でき、特に被めっき部が薄く「Ｃ反
り」が生じているときでもエッジオーバーコートを防止
できる。As described above, according to the present invention, it is possible to prevent the edge overcoat at the end of the plated portion in the continuous electroplating equipment, and particularly when the plated portion is thin and "C warp" occurs. But you can prevent edge overcoat.
【図１】本発明のエッジマスク装置を設置した連続めっ
き装置の概略横断面図、FIG. 1 is a schematic cross-sectional view of a continuous plating apparatus equipped with an edge mask device of the present invention,
【図２】本発明の実施例のエッジマスク装置の概略図、FIG. 2 is a schematic view of an edge mask device according to an embodiment of the present invention,
【図３】本発明の他の実施例のエッジマスク装置の概略
図、FIG. 3 is a schematic view of an edge mask device according to another embodiment of the present invention,
【図４】従来のエッジマスク装置を設置した連続めっき
装置の概略横断面図である。０FIG. 4 is a schematic cross-sectional view of a continuous plating apparatus provided with a conventional edge mask device. 0
1 主電極 2 被めっき部 3 被めっき部のエッジ部 4 エッジマスク装置 5 補助用陽極電極 ｈ エッジマスク装置全体の高さ ｈ1 エッジマスク装置の間隔 ｔ エッジマスク装置の幅 ｔ1 エッジマスク装置先端と付け根間の距離 1 エッジマスク装置の長さ ａ エッジマスク装置先端と補助用陽極電極との距離 ｂ 補助用陽極電極の幅 ｄ 補助用陽極電極の長さ ｋ 補助用陽極電極の間隔1 Main electrode 2 Plated part 3 Edge of plated part 4 Edge mask device 5 Auxiliary anode electrode h Overall height of edge mask device h 1 Edge mask device interval t Edge mask device width t 1 Edge mask device tip Distance between base and base 1 Length of edge mask device a Distance between edge mask device tip and auxiliary anode electrode b Width of auxiliary anode electrode d Length of auxiliary anode electrode k Distance of auxiliary anode electrode
───────────────────────────────────────────────────── フロントページの続き (72)発明者 高田 一俊 千葉県富津市新富20−１ 新日本製鐵株式 会社技術開発本部内 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Kazutoshi Takada 20-1 Shintomi, Futtsu-shi, Chiba Nippon Steel Corporation Corporate Technology Development Division
Claims (5)
ク装置において、被めっき部の対面側の一部に補助用陽
極電極を有することを特徴とする電気めっき用エッジマ
スク装置。1. An electroplating edge mask device comprising an insulator, wherein an electroplating edge mask device has an auxiliary anode electrode on a part of a surface to be plated facing the surface.
き部と平行であることを特徴とする請求項１記載の電気
めっき用エッジマスク装置。2. The edge mask device for electroplating according to claim 1, wherein the auxiliary anode electrode portion is parallel to the facing portion to be plated.
ことを特徴とする請求項１または２記載の電気めっき用
エッジマスク装置。3. The edge mask device for electroplating according to claim 1, wherein the auxiliary anode electrode portion is an insoluble electrode.
連続または不連続に配置されていることを特徴とする請
求項１、２または３記載の電気めっき用エッジマスク装
置。4. The edge mask device for electroplating according to claim 1, wherein the auxiliary anode electrode portion is arranged continuously or discontinuously in the plating progressing direction.
ながら電気めっきする方法において、被めっき部に対面
する部分の当該エッジマスク装置の一部に補助用陽極電
極を配置し、当該エッジマスク装置の先端を被めっき部
エッジ部より被めっき部幅方向に内側に制御し、及び補
助用陽極電極を被めっき部エッジ部より被めっき部幅方
向内側に制御することを特徴とする電気めっき方法。5. A method of electroplating using an edge mask device made of an insulator, wherein an auxiliary anode electrode is arranged in a part of the edge mask device facing a plated portion, An electroplating method characterized in that the tip is controlled inward in the width direction of the plated section from the edge section of the plated section, and the auxiliary anode electrode is controlled inward in the width direction of the plated section from the edge section of the plated section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4156695A JPH08239796A (en) | 1995-03-01 | 1995-03-01 | Edge mask for electroplating and electroplating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4156695A JPH08239796A (en) | 1995-03-01 | 1995-03-01 | Edge mask for electroplating and electroplating method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08239796A true JPH08239796A (en) | 1996-09-17 |
Family
ID=12612003
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4156695A Withdrawn JPH08239796A (en) | 1995-03-01 | 1995-03-01 | Edge mask for electroplating and electroplating method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08239796A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002302794A (en) * | 2001-04-06 | 2002-10-18 | Nippon Steel Corp | Edge mask device in electroplating tank |
| JP2009173952A (en) * | 2008-01-21 | 2009-08-06 | Nippon Mining & Metals Co Ltd | Edge over coat preventing device and method of manufacturing electroplated material using the same |
| WO2014168314A1 (en) * | 2013-04-10 | 2014-10-16 | (주)포스코 | Electroplating apparatus for preventing excessive plating of edge |
| KR20160077864A (en) * | 2014-12-24 | 2016-07-04 | 주식회사 포스코 | Electro-plating apparatus for preventing edge area of plate from being overcoated |
| KR20210067121A (en) * | 2019-11-29 | 2021-06-08 | 서승섭 | The electroplating apparatus |
-
1995
- 1995-03-01 JP JP4156695A patent/JPH08239796A/en not_active Withdrawn
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002302794A (en) * | 2001-04-06 | 2002-10-18 | Nippon Steel Corp | Edge mask device in electroplating tank |
| JP4695283B2 (en) * | 2001-04-06 | 2011-06-08 | 新日本製鐵株式会社 | Edge mask device in electroplating tank |
| JP2009173952A (en) * | 2008-01-21 | 2009-08-06 | Nippon Mining & Metals Co Ltd | Edge over coat preventing device and method of manufacturing electroplated material using the same |
| WO2014168314A1 (en) * | 2013-04-10 | 2014-10-16 | (주)포스코 | Electroplating apparatus for preventing excessive plating of edge |
| KR101495419B1 (en) * | 2013-04-10 | 2015-02-24 | 주식회사 포스코 | Electro-plating apparatus utilizing edge mask to prevent the edge overcoating |
| CN105189830A (en) * | 2013-04-10 | 2015-12-23 | Posco公司 | Electroplating apparatus for preventing excessive plating of edge |
| JP2016513752A (en) * | 2013-04-10 | 2016-05-16 | ポスコ | Electroplating equipment to prevent edge overplating |
| KR20160077864A (en) * | 2014-12-24 | 2016-07-04 | 주식회사 포스코 | Electro-plating apparatus for preventing edge area of plate from being overcoated |
| KR20210067121A (en) * | 2019-11-29 | 2021-06-08 | 서승섭 | The electroplating apparatus |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20020507 |