JPH06173082A - Continuous plating device - Google Patents

Abstract

PURPOSE:To prevent the flow of a plating liquid to the contact parts of conductor rolls and a metallic strip and to prevent the overcoating of both end edges of this metallic strip with plating. CONSTITUTION:The metallic strip 1 with its transverse direction positioned perpendicularly is passed in a horizontal direction and is subjected to plating by running the plating liquid between the metallic strip 1 and anode 3a from above. The plating liquid passed between the metallic strip 1 and the anode 3a is flown out of the end in the transverse direction of the metallic strip 1, by which the remaining of the plating liquid on the front surface of the passing metallic strip 1 is prevented and an effect of liquid draining is enhanced. A jet header 4 for supplying the plating liquid is lifted according to the width of the metallic strip 1 to prevent the concentration of current to both end edges of the metallic strip 1.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a continuous plating apparatus for continuously electroplating a surface of a metal strip.

[0002]

2. Description of the Related Art As an apparatus for continuously electroplating a metal strip of steel or the like, there are various apparatuses such as a horizontal type and a vertical type. In the conventional horizontal type continuous electroplating apparatus, as shown in the line configuration diagram of FIG. 4, a conductor roll provided in a transport path in which the width direction of the metal strip 1 and the plate passing direction are horizontal.
While making the metal strip 1 a cathode with the rule 2,
Both sides of the metal strip 1 are provided while flowing the plating solution from the nozzles of the jet headers 4a, 4b into the space between the electrodes 3a, 3b and the metal strip 1 and preventing the plating solution from flowing to the conductor roll 2 by the dam roll 5. Is electroplated. In the vertical continuous plating apparatus, as shown in FIG. 5, the width direction of the metal strip 1 is horizontal and the plate passing direction is vertical, that is, the bottom roll 7 provided at the bottom of the vertical tank 6 lowers the traveling direction. The vertical tank 6 is filled with the plating solution while reversing in the upward direction and the upward direction (Japanese Patent Laid-Open No. 60-56092), or as shown in FIG. 6, between the anodes 3a and 3b and the metal strip 1. The plating solution is caused to flow from the jet headers 4a and 4b into the space (Japanese Patent Laid-Open No. 61-190096).
Both sides of the metal strip 1 are electroplated.
Further, as shown in FIG. 7, a vertical type plating device is also used in which the width direction of the metal strip 1 is made vertical and the both sides of the metal strip 1 are plated while horizontally passing through the plating tank 8 filled with the plating solution. (JP-A-1-168890).

[0003]

As shown in FIGS. 4 to 6, in the horizontal type or vertical type plating apparatus in which the plating solution is caused to flow in the space between the anodes 3a, 3b and the metal strip 1. Normally, the anode 3a, so that the surface of the metal strip 1 can be plated well even if the running metal strip 1 meanders or the width of the metal strip 1 to be processed changes.
The width of the metal strip 1 is larger than the maximum width of the metal strip 1 passing through the metal strip 1, and the metal strip 1 is a cathode from the nodes 3a and 3b in a state where both edge portions of the metal strip 1 are completely covered with the plating solution. An electric current is applied to 1. For this reason, current concentrates on the edges of both ends of the metal strip 1, and plating is overcoated on the edges of both ends. In order to prevent this over-coating, it is necessary to attach an edge mask made of an insulator to both end edges of the metal strip 1 to cut off an excessive current. When the edge mask is attached in this way, the device becomes complicated and the maintainability is poor.

Further, a current is flowing in the contact portion between the conductor roll 2 and the metal strip 1,
The conductor 2 becomes a cathode from the metal strip 1 by the contact resistance between the conductor roll 2 and the metal strip 1. Since the plating solution also flows to this contact portion, the surface of the conductor roll 2 is also plated. The amount of plating adhered is proportional to the density of the current flowing through the contact surface depending on the plate width of the metal strip 1, and a step is formed on the surface of the conductor roll 2 according to the plate width of the metal strip 1. If the width of the metal strip 1 passing through becomes large when such a step occurs, the conductor roll 2 and the metal strip 1 do not contact each other uniformly in the width direction, and the metal strip 1 is plated uniformly. Will not be possible. In order to prevent this, it is necessary to provide a polishing device to polish the conductor roll 2. For this reason, the apparatus becomes complicated and there is a disadvantage that extra time is required for polishing.

Further, the vertical plating apparatus as shown in FIG. 7 is an apparatus limited to the one which passes a narrow material at a low speed, and the above disadvantages have not been solved at all.

The present invention has been made to solve the above drawbacks, and prevents the plating solution from flowing to the contact portion between the conductor roll and the metal strip.
It is an object of the present invention to provide a continuous plating apparatus capable of preventing the plating from overcoating on both edges of the metal strip.

[0007]

SUMMARY OF THE INVENTION A continuous plating apparatus according to the present invention is provided so as to oppose each surface of a metal strip and a conveying path for vertically passing the metal strip in the horizontal direction. It is characterized in that it is provided with an anode and a jet header which is provided on the upper part of the above-mentioned transport path and which moves up and down between the electrodes according to the width of the metal strip to be passed.

[0008]

In the present invention, the metal strip is passed horizontally with the width direction vertical and the plating solution is flowed from above between the metal strip and the electrode for plating. The plating solution flowing between the metal strip and the electrode is caused to flow out from the lower end portion in the width direction of the metal strip to prevent the plating solution from remaining on the surface of the passing metal strip, and to enhance the liquid drainage effect. To prevent the plating solution from flowing to the contact portion between the conductor roll and the metal strip.

Further, the jet header for supplying the plating solution is moved up and down in accordance with the width of the metal strip passing through the jet header to prevent the electric current from concentrating on the edges of both ends of the metal strip 1.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIGS. 1 and 2 are line construction diagrams of an embodiment of the present invention. FIG. 1 is a front view and FIG. 2 is a top sectional view.
As shown in the figure, a plurality of conductor rolls 2 and nodes 3a and 3b are connected in a horizontal direction in a transport path along which the metal strip 1 travels. The conductor roll 2 has its axis arranged in the vertical direction, and runs the metal strip 1 in the horizontal direction with the width direction of the metal strip 1 being vertical. Anode 3a, 3b
Is provided vertically so as to sandwich the metal strip 1 on which the electrode surface runs, and the front and rear ends and the lower and lower ends of the nodes 3a and 3b are covered with a shielding portion 10 made of, for example, a labyrinth packing.
a, 10b and 10c are attached respectively.

A jet header 4 attached to a lifting device 11 is installed above the nodes 3a and 3b.
As shown in the side sectional view of FIG. 3, the jet header 4 has a pair of nozzles 12a, 12b for ejecting the plating solution into the space between the anodes 3a, 3b and the metal strip 1.

In the continuous electroplating apparatus constructed as described above, while aligning the lower end of the metal strip 1 whose width direction is vertical to the lower ends of the nodes 3a and 3b, the metal strip 1 is moved horizontally. Drive to. The elevating device 11 is driven according to the width of the traveling metal strip 1 to change the positions of the nozzles 12a and 12b of the jet header 4. Then, while the running metal strip 1 is made into a casing by the conductor roll 2, the plating solution is jetted from the nozzles 12 a and 12 b of the jet header 4. In this way, since the plating solution is jetted from above onto the metal strip 1 which is vertical in the width direction and runs horizontally, the plating solution can be jetted onto both sides of the metal strip 1 by one jet header 4.

The plating solution ejected from the nozzles 12a and 12b is shielded by the shields 1 provided in front of and behind the nodes 3a and 3b.
By 0a and 10b, the outflow before and after the anodes 3a and 3b is suppressed, and they are supplied to the space between the anodes 3a and 3b and the metal strip 1. The supplied plating solution flows down into the recovery pan 13 from the shielding part 10c provided at the lower ends of the nodes 3a and 3b by a fixed amount.
Flowing between the anodes 3a, 3b and the metal strip 1,
Plate both sides of the metal strip 1.

A metal strip 1 whose width direction is vertical
When plating the metal strip 1, the lower end of the metal strip 1 is aligned with the lower ends of the anodes 3a, 3b, and the nozzles 12a, 12b of the jet header 4 are positioned.
Depending on the width of the metal strip 1, the height of the plating solution is changed so that the plating solution is adjusted to the width of the metal strip 1. By adjusting the positions of the nozzles 12a and 12b of the jet header 4 in this manner, the anodes 3a and 3b act as anodes only in the portions where the plating solution is present. Therefore, current does not flow from the portions of the anodes 3a and 3b outside the plate width of the metal strip 1 to prevent the current from concentrating on the edge of the metal strip 1, and the metal strip 1 is substantially evenly distributed over the entire surface. Current flows. Therefore, it is possible to prevent the plating from overcoating on the edge portion of the metal strip 1 without using the edge mask.

Further, a part of the plating solution supplied to the space between the anodes 3a and 3b and the metal strip 1 is a shielding portion provided along the metal strip 1 before and after the anodes 3a and 3b. Although the metal strip 1 flows out from 10a and 10b, since the width direction of the metal strip 1 is vertical, the plating solution adhering to the metal strip 1 immediately drops due to gravity, so that the liquid is well drained and the metal strip 1 and the conductor roll 2 It is possible to prevent the plating solution from flowing to the contact portion. Therefore, the surface of the conductor roll 2 can be prevented from being plated or corroded.

Further, since the plating solution is flowed along the vertical metal strip 1, even if the metal strip has a wide width of about 60 to 200 cm, the bubbling of the plating solution is improved and the metal strip 1 which is a cathode. The metal ions can be replenished smoothly and precise plating can be performed.

[0017]

As described above, according to the present invention, the metal strip is passed through in the horizontal direction with the width direction being vertical, and the plating solution is flowed from the upper portion between the metal strip and the electrode for plating. Therefore, it is possible to prevent the plating solution from remaining on the surface of the metal strip that is running through, and to enhance the effect of draining the solution, and prevent the plating solution from flowing to the contact portion between the conductor roll and the metal strip. it can. Therefore, plating or corrosion of the contact roll can be prevented without the need for a dam roller or the like.

Further, since the jet header for supplying the plating solution can be moved up and down according to the width of the metal strip passing through it, it is possible to prevent the electric current from concentrating on the edge portions at both ends of the metal strip 1. Even if it is not used, it is possible to prevent the plating from overcoating on the edge portion of the metal strip, and it is possible to perform uniform plating.

Further, since good quality plating can be made uniform without the need for a dam roller or an edge mask, the structure of plating equipment can be simplified.

Further, since the metal strips are passed horizontally with the width direction vertical, it is possible to reduce the installation area of the plating equipment.

[Brief description of drawings]

FIG. 1 is a front view showing a line configuration diagram of an embodiment of the present invention.

FIG. 2 is a top sectional view of the above embodiment.

FIG. 3 is a side sectional view of the above embodiment.

FIG. 4 is a front view showing a line configuration diagram of a conventional horizontal plating apparatus.

FIG. 5 is a sectional view showing a conventional vertical continuous plating apparatus.

FIG. 6 is a sectional view showing another conventional vertical continuous plating apparatus.

FIG. 7 is a perspective view showing a conventional vertical plating apparatus.

[Explanation of reference numerals] 1 metal strip 2 conductor rolls 3a, 3b anode 4 jet header 11 lifting device 12a, 12b nozzle

Claims (1)

[Claims] 1. A conveying path for vertically passing the width direction of a metal strip in a horizontal direction, an anode provided to face each surface of the metal strip, and an upper portion of the conveying path. And a jet header that moves up and down between the electrodes according to the width of the metal strip to be passed.