JPH0214777B2 - - Google Patents

Info

Publication number
JPH0214777B2
JPH0214777B2 JP50137780A JP50137780A JPH0214777B2 JP H0214777 B2 JPH0214777 B2 JP H0214777B2 JP 50137780 A JP50137780 A JP 50137780A JP 50137780 A JP50137780 A JP 50137780A JP H0214777 B2 JPH0214777 B2 JP H0214777B2
Authority
JP
Japan
Prior art keywords
shim
contact
semiconductor
emitter
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP50137780A
Other languages
English (en)
Japanese (ja)
Other versions
JPS56500988A (enExample
Inventor
Nikorasu Richaado Orei
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Mobility Ltd
Original Assignee
Westinghouse Brake and Signal Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Westinghouse Brake and Signal Co Ltd filed Critical Westinghouse Brake and Signal Co Ltd
Publication of JPS56500988A publication Critical patent/JPS56500988A/ja
Publication of JPH0214777B2 publication Critical patent/JPH0214777B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/20—Conductive package substrates serving as an interconnection, e.g. metal plates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/136—Containers comprising a conductive base serving as an interconnection having other interconnections perpendicular to the conductive base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type

Landscapes

  • Thyristors (AREA)
  • Die Bonding (AREA)
JP50137780A 1979-07-04 1980-07-03 Expired - Lifetime JPH0214777B2 (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB7923223 1979-07-04

Publications (2)

Publication Number Publication Date
JPS56500988A JPS56500988A (enExample) 1981-07-16
JPH0214777B2 true JPH0214777B2 (enExample) 1990-04-10

Family

ID=10506280

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50137780A Expired - Lifetime JPH0214777B2 (enExample) 1979-07-04 1980-07-03

Country Status (5)

Country Link
US (1) US4477826A (enExample)
EP (1) EP0022359B1 (enExample)
JP (1) JPH0214777B2 (enExample)
DE (1) DE3064121D1 (enExample)
WO (1) WO1981000172A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6038868B2 (ja) * 1981-11-06 1985-09-03 富士通株式会社 半導体パツケ−ジ
US4567505A (en) * 1983-10-27 1986-01-28 The Board Of Trustees Of The Leland Stanford Junior University Heat sink and method of attaching heat sink to a semiconductor integrated circuit and the like
JPS60177674A (ja) * 1984-02-23 1985-09-11 Mitsubishi Electric Corp 圧接形半導体装置の插入電極板の固定方法
US4693199A (en) * 1984-11-30 1987-09-15 Ludwig Omachen Release means for sailboard footstraps
US5053358A (en) * 1988-08-01 1991-10-01 Sundstrand Corporation Method of manufacturing hermetically sealed compression bonded circuit assemblies
US5034803A (en) * 1988-08-01 1991-07-23 Sundstrand Corporation Compression bonded semiconductor device having a plurality of stacked hermetically sealed circuit assemblies
FR2665817B1 (fr) * 1990-08-07 1996-08-02 Auxilec Diode a electrode et a boitier assembles sans soudure ni sertissage, et pont redresseur realise avec de telles diodes.

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL270438A (enExample) * 1960-11-02 1900-01-01
FR1317754A (enExample) * 1961-03-17 1963-05-08
US3418543A (en) * 1965-03-01 1968-12-24 Westinghouse Electric Corp Semiconductor device contact structure
US3473303A (en) * 1967-02-23 1969-10-21 Howard Dale Ellis Ear stripping mechanism for harvester for sweet corn
US3783044A (en) * 1971-04-09 1974-01-01 Motorola Inc Photoresist keys and depth indicator
SE373689B (sv) * 1973-06-12 1975-02-10 Asea Ab Halvledaranordning bestaende av en tyristor med styrelektrod, vars halvledarskiva er innesluten i en dosa
GB1465328A (en) * 1973-06-19 1977-02-23 Westinghouse Electric Corp Compression bond assembly for a planar semiconductor device
JPS5138969A (enExample) * 1974-09-30 1976-03-31 Hitachi Ltd
US4289834A (en) * 1977-10-20 1981-09-15 Ibm Corporation Dense dry etched multi-level metallurgy with non-overlapped vias

Also Published As

Publication number Publication date
JPS56500988A (enExample) 1981-07-16
EP0022359B1 (en) 1983-07-13
DE3064121D1 (en) 1983-08-18
WO1981000172A1 (en) 1981-01-22
EP0022359A1 (en) 1981-01-14
US4477826A (en) 1984-10-16

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